JPS6250194B2 - - Google Patents
Info
- Publication number
- JPS6250194B2 JPS6250194B2 JP54131484A JP13148479A JPS6250194B2 JP S6250194 B2 JPS6250194 B2 JP S6250194B2 JP 54131484 A JP54131484 A JP 54131484A JP 13148479 A JP13148479 A JP 13148479A JP S6250194 B2 JPS6250194 B2 JP S6250194B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- photoresist
- liquid
- coating liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13148479A JPS5656261A (en) | 1979-10-11 | 1979-10-11 | Method and apparatus for rotary coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13148479A JPS5656261A (en) | 1979-10-11 | 1979-10-11 | Method and apparatus for rotary coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5656261A JPS5656261A (en) | 1981-05-18 |
| JPS6250194B2 true JPS6250194B2 (enExample) | 1987-10-23 |
Family
ID=15059052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13148479A Granted JPS5656261A (en) | 1979-10-11 | 1979-10-11 | Method and apparatus for rotary coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5656261A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04504377A (ja) * | 1989-04-05 | 1992-08-06 | オー・シー・ジー・マイクロエレクトロニツク・マテリアルズ・インコーポレイテツド | 基体上へフォトレジスト組成物をコーティングする方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59208832A (ja) * | 1983-05-13 | 1984-11-27 | Hitachi Tokyo Electronics Co Ltd | 塗布装置 |
| JPH0669019B2 (ja) * | 1984-03-12 | 1994-08-31 | 株式会社ニコン | 半導体製造装置 |
| US4590094A (en) * | 1984-10-29 | 1986-05-20 | International Business Machines Corporation | Inverted apply using bubble dispense |
| JPH03272140A (ja) * | 1990-03-22 | 1991-12-03 | Fujitsu Ltd | 半導体基板の薬品処理装置 |
| JP4812704B2 (ja) * | 2007-07-10 | 2011-11-09 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2022098245A (ja) * | 2020-12-21 | 2022-07-01 | 株式会社ディスコ | スピンコーター、及びスピンコート方法 |
-
1979
- 1979-10-11 JP JP13148479A patent/JPS5656261A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04504377A (ja) * | 1989-04-05 | 1992-08-06 | オー・シー・ジー・マイクロエレクトロニツク・マテリアルズ・インコーポレイテツド | 基体上へフォトレジスト組成物をコーティングする方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5656261A (en) | 1981-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5571560A (en) | Proximity-dispensing high-throughput low-consumption resist coating device | |
| US6248398B1 (en) | Coater having a controllable pressurized process chamber for semiconductor processing | |
| JPH07320999A (ja) | 塗布膜形成方法及びその装置 | |
| JPS6250194B2 (enExample) | ||
| US6761930B2 (en) | Method of coating solution on substrate surface using a slit nozzle | |
| JPS60137016A (ja) | 成膜装置 | |
| JPS6214092B2 (enExample) | ||
| US4528934A (en) | Thin-film coating apparatus | |
| US6576055B2 (en) | Method and apparatus for controlling air over a spinning microelectronic substrate | |
| JPS62121669A (ja) | 塗布装置 | |
| JPS5889966A (ja) | 塗布装置 | |
| JPS6085524A (ja) | レジスト塗布方法 | |
| JPH04332116A (ja) | 回転塗布装置 | |
| JP3800291B2 (ja) | 塗布方法及び塗布装置 | |
| JPS591385B2 (ja) | 回転塗布方法及びその装置 | |
| JP2002134388A (ja) | レジスト吐出口洗浄方法および装置、並びにレジスト塗布方法および装置 | |
| JPH0226668A (ja) | 塗布装置 | |
| JPH08187458A (ja) | 回転塗布装置 | |
| JPH0338821A (ja) | 塗布方法 | |
| JPS60139363A (ja) | レジスト自動塗布装置の排気制御装置 | |
| JPH04340217A (ja) | 液処理方法及び液処理装置 | |
| JPH0817700A (ja) | レジスト塗布方法およびレジスト塗布装置 | |
| JPS6125430B2 (enExample) | ||
| JPH0444213A (ja) | 半導体装置の製造方法 | |
| JPH01151972A (ja) | スピンコーティング装置 |