JPS6250079B2 - - Google Patents
Info
- Publication number
- JPS6250079B2 JPS6250079B2 JP6816582A JP6816582A JPS6250079B2 JP S6250079 B2 JPS6250079 B2 JP S6250079B2 JP 6816582 A JP6816582 A JP 6816582A JP 6816582 A JP6816582 A JP 6816582A JP S6250079 B2 JPS6250079 B2 JP S6250079B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit
- multilayer
- layer circuit
- pillars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 121
- 238000007747 plating Methods 0.000 claims description 18
- 239000011810 insulating material Substances 0.000 claims description 17
- 239000011229 interlayer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6816582A JPS58184794A (ja) | 1982-04-23 | 1982-04-23 | 多層形水平プリント板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6816582A JPS58184794A (ja) | 1982-04-23 | 1982-04-23 | 多層形水平プリント板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58184794A JPS58184794A (ja) | 1983-10-28 |
| JPS6250079B2 true JPS6250079B2 (cs) | 1987-10-22 |
Family
ID=13365871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6816582A Granted JPS58184794A (ja) | 1982-04-23 | 1982-04-23 | 多層形水平プリント板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184794A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340905A (ja) * | 1999-05-28 | 2000-12-08 | Toppan Printing Co Ltd | 光・電気配線基板及び製造方法並びに実装基板 |
| JP2000340906A (ja) * | 1999-05-28 | 2000-12-08 | Toppan Printing Co Ltd | 光・電気配線基板及びその製造方法並びに実装基板 |
-
1982
- 1982-04-23 JP JP6816582A patent/JPS58184794A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58184794A (ja) | 1983-10-28 |
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