JPS6249983B2 - - Google Patents
Info
- Publication number
- JPS6249983B2 JPS6249983B2 JP55022406A JP2240680A JPS6249983B2 JP S6249983 B2 JPS6249983 B2 JP S6249983B2 JP 55022406 A JP55022406 A JP 55022406A JP 2240680 A JP2240680 A JP 2240680A JP S6249983 B2 JPS6249983 B2 JP S6249983B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding tool
- prism
- electrodes
- slope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240680A JPS56118346A (en) | 1980-02-25 | 1980-02-25 | Gang bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2240680A JPS56118346A (en) | 1980-02-25 | 1980-02-25 | Gang bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56118346A JPS56118346A (en) | 1981-09-17 |
| JPS6249983B2 true JPS6249983B2 (https=) | 1987-10-22 |
Family
ID=12081777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2240680A Granted JPS56118346A (en) | 1980-02-25 | 1980-02-25 | Gang bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56118346A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592337B2 (ja) * | 1989-11-20 | 1997-03-19 | 株式会社カイジョー | テープボンディング方法 |
-
1980
- 1980-02-25 JP JP2240680A patent/JPS56118346A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56118346A (en) | 1981-09-17 |
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