JPS6249744B2 - - Google Patents
Info
- Publication number
- JPS6249744B2 JPS6249744B2 JP12970181A JP12970181A JPS6249744B2 JP S6249744 B2 JPS6249744 B2 JP S6249744B2 JP 12970181 A JP12970181 A JP 12970181A JP 12970181 A JP12970181 A JP 12970181A JP S6249744 B2 JPS6249744 B2 JP S6249744B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- housing
- axis direction
- connecting rod
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/00—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56129701A JPS5831514A (ja) | 1981-08-18 | 1981-08-18 | 半導体部品のテ−プ片張付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56129701A JPS5831514A (ja) | 1981-08-18 | 1981-08-18 | 半導体部品のテ−プ片張付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831514A JPS5831514A (ja) | 1983-02-24 |
| JPS6249744B2 true JPS6249744B2 (cg-RX-API-DMAC10.html) | 1987-10-21 |
Family
ID=15016055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56129701A Granted JPS5831514A (ja) | 1981-08-18 | 1981-08-18 | 半導体部品のテ−プ片張付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831514A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432595Y2 (cg-RX-API-DMAC10.html) * | 1985-10-17 | 1992-08-05 | ||
| TW315491B (en) * | 1995-07-31 | 1997-09-11 | Micron Technology Inc | Apparatus for applying adhesive tape for semiconductor packages |
| US6281044B1 (en) | 1995-07-31 | 2001-08-28 | Micron Technology, Inc. | Method and system for fabricating semiconductor components |
| US6096165A (en) * | 1997-08-07 | 2000-08-01 | Micron Technology, Inc. | Method and apparatus for application of adhesive tape to semiconductor devices |
-
1981
- 1981-08-18 JP JP56129701A patent/JPS5831514A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831514A (ja) | 1983-02-24 |
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