JPS6249732B2 - - Google Patents

Info

Publication number
JPS6249732B2
JPS6249732B2 JP16597983A JP16597983A JPS6249732B2 JP S6249732 B2 JPS6249732 B2 JP S6249732B2 JP 16597983 A JP16597983 A JP 16597983A JP 16597983 A JP16597983 A JP 16597983A JP S6249732 B2 JPS6249732 B2 JP S6249732B2
Authority
JP
Japan
Prior art keywords
alignment rod
semiconductor wafer
aligner
facet
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16597983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6057641A (ja
Inventor
Masato Toyoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16597983A priority Critical patent/JPS6057641A/ja
Publication of JPS6057641A publication Critical patent/JPS6057641A/ja
Publication of JPS6249732B2 publication Critical patent/JPS6249732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP16597983A 1983-09-07 1983-09-07 半導体ウエハ用フアセツトアライナ Granted JPS6057641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16597983A JPS6057641A (ja) 1983-09-07 1983-09-07 半導体ウエハ用フアセツトアライナ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16597983A JPS6057641A (ja) 1983-09-07 1983-09-07 半導体ウエハ用フアセツトアライナ

Publications (2)

Publication Number Publication Date
JPS6057641A JPS6057641A (ja) 1985-04-03
JPS6249732B2 true JPS6249732B2 (enrdf_load_html_response) 1987-10-21

Family

ID=15822624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16597983A Granted JPS6057641A (ja) 1983-09-07 1983-09-07 半導体ウエハ用フアセツトアライナ

Country Status (1)

Country Link
JP (1) JPS6057641A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04346041A (ja) * 1991-05-23 1992-12-01 Fuji Electric Co Ltd 圧電式荷重センサとその応用装置および回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04346041A (ja) * 1991-05-23 1992-12-01 Fuji Electric Co Ltd 圧電式荷重センサとその応用装置および回路

Also Published As

Publication number Publication date
JPS6057641A (ja) 1985-04-03

Similar Documents

Publication Publication Date Title
KR920004063B1 (ko) 반도체 웨이퍼 표면의 연삭 방법 및 그 장치
JP2628424B2 (ja) ウエーハ面取部の研磨方法及び装置
US4227347A (en) Two motor drive for a wafer processing machine
JPH02178947A (ja) 半導体ウェーハのノッチ合わせ機構
JPH1190801A (ja) ウェハの両面加工方法及び装置
JPS6249732B2 (enrdf_load_html_response)
JP4384742B2 (ja) 半導体ウェーハのラッピング装置及びラッピング方法
JPH064219B2 (ja) ワイヤ式切断加工装置の溝ロ−ラ駆動方法
US4707945A (en) Upper plate driving system for surface lapping machine
KR200153298Y1 (ko) 웨이퍼 정렬장치
JPS6214692Y2 (enrdf_load_html_response)
JP4209081B2 (ja) ウェーハ支持装置
JPH05121528A (ja) 半導体ウエーハのオリフラ合わせ装置および方法
JPS5917261A (ja) ウエハ搬送装置
JPH0746452Y2 (ja) 表面研磨装置
JPH07164291A (ja) ウェーハ外周部の研磨装置
JPS62136358A (ja) ウエ−ハ複式ベベリング装置
JP3689824B2 (ja) 板状部材の研磨方法
JPH09283474A (ja) 半導体ウエハの両面研磨方法
JPH0342514Y2 (enrdf_load_html_response)
JPS6130285Y2 (enrdf_load_html_response)
JPH0353544A (ja) 半導体ウエハ移替方法および装置
JPS631616A (ja) 搬送機用平ベルト
JP3756985B2 (ja) ダブルｖリブドベルトの製造方法及びそれに用いる多軸加工装置
JPS59154036A (ja) オリエンテ−シヨンフラツト位置決め方法