JPS6248885B2 - - Google Patents
Info
- Publication number
- JPS6248885B2 JPS6248885B2 JP55046877A JP4687780A JPS6248885B2 JP S6248885 B2 JPS6248885 B2 JP S6248885B2 JP 55046877 A JP55046877 A JP 55046877A JP 4687780 A JP4687780 A JP 4687780A JP S6248885 B2 JPS6248885 B2 JP S6248885B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- laminated
- film
- oxide
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 21
- 239000010408 film Substances 0.000 description 17
- 229910000859 α-Fe Inorganic materials 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
Description
【発明の詳細な説明】 本発明は積層インダクタの製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing a laminated inductor.
従来のインダクタは導線を巻いて製造されてい
るが、工程が複雑であり、寸法が大きくなるなど
の欠点があつた。本発明者等は、従来のこのよう
なインダクタの観念を放棄して全く新しい積層技
術によるインダクタの製造方法を特願昭53−
161221号等により提案した。しかしながら、同技
術は印刷技術によるものであるから、厚さがかな
り厚くなり、また特性値の制御もかなり困難なも
のがある。 Conventional inductors are manufactured by winding conductive wire, but they have drawbacks such as complicated processes and large dimensions. The present inventors abandoned the conventional concept of inductors and proposed a method for manufacturing inductors using a completely new layering technology in a patent application filed in 1983.
It was proposed by No. 161221 etc. However, since this technology is based on printing technology, the thickness is quite thick, and it is also quite difficult to control the characteristic values.
前述の印刷法による積層は、フエライト粉末等
を混練りしたペーストと、焼成に耐える金属粉末
（Pd、Pd−Ag等）のペーストとを薄膜状に交互
に印刷することより成るもので、磁性体層により
絶縁を行いながら金属導体層によりコイル状の導
電路を形成するのであり、こうして積層された積
層インダクタは焼成炉で焼成される。しかし、こ
れらの層の厚さはあまり薄く出来ないので寸法の
減少はまだ不充分であり、また特性値も大きなＬ
が出し難いなどの未解決の問題もあり、また焼成
が行われる関係上、耐熱性の高いPd、Pd−Ag等
の金属を使用しなければならないので製品コスト
が高くなる。 Lamination by the printing method described above consists of alternately printing thin films of a paste made by kneading ferrite powder, etc., and a paste of metal powder (Pd, Pd-Ag, etc.) that can withstand firing. A coil-shaped conductive path is formed by the metal conductor layer while providing insulation through the layers, and the laminated inductor thus laminated is fired in a firing furnace. However, since the thickness of these layers cannot be made very thin, the reduction in dimensions is still insufficient, and the characteristic values are also large.
There are also unresolved problems such as the difficulty of producing carbon dioxide, and since sintering is required, metals with high heat resistance such as Pd and Pd-Ag must be used, which increases the product cost.
本発明は上記の技術をさらに改良するものであ
り、印刷法によらないでスパツタリング技術を用
いて積層インダクタを製造することを目的とす
る。本発明の方法は焼成工程を必要としないか
ら、任意の導体材料を採用できるのみならず、各
層の厚みが一様でしかも非常に薄くできるなどの
特徴を有する。 The present invention further improves the above-mentioned technique and aims to manufacture a laminated inductor using a sputtering technique instead of a printing method. Since the method of the present invention does not require a firing process, it not only allows the use of any conductive material, but also has the advantage that the thickness of each layer can be uniform and extremely thin.
本発明はスパツタリング法を用いて実施され
る。インダクタの形成にはコイル状または渦巻状
の導電パターンを形成するための金属と、導電パ
ターンの絶縁と導磁を行うための絶縁性磁性体、
或いは絶縁体で被覆された磁性体とが必要であ
る。スパツタリング法によるとMO・Fe2O3
（Ｍ：金属）で示される酸化物フエライトなどの
磁性層の形成と、これらの層に対するAl，Cu，
Ag等の導電性層の付着とが困難なく実行でき
る。従つて、焼成が不要となり、また安価な金属
の使用で十分に発明の目的を達成できる。 The invention is implemented using a sputtering method. To form an inductor, a metal is used to form a coiled or spiral conductive pattern, an insulating magnetic material is used to insulate the conductive pattern and conduct magnetism, and
Alternatively, a magnetic material coated with an insulator is required. According to the sputtering method MO・Fe 2 O 3
Formation of magnetic layers such as oxide ferrite represented by (M: metal) and the formation of Al, Cu,
Deposition of conductive layers such as Ag can be carried out without difficulty. Therefore, firing is not necessary, and the purpose of the invention can be sufficiently achieved by using inexpensive metals.
本発明の方法で得られる積層インダクタの大き
な特徴は、各層の厚みがオングストローム単位
（10-10ｍ）に近いものまで可能となるために、比
較的薄い積層体でも大きなインダクタンスを有す
ることができる。ことであり、従つて、非常に広
範囲のインダクタンス値を有する積層インダクタ
が自由に製造できることである。 A major feature of the laminated inductor obtained by the method of the present invention is that the thickness of each layer can be close to the angstrom unit (10 -10 m), so even a relatively thin laminate can have a large inductance. Therefore, laminated inductors with a very wide range of inductance values can be manufactured at will.
スパツタリング法は膜形成速度が他の方法に比
してやや遅いが、最近では高速スパツタリング法
も開発されている。スパツタリング法は絶縁体源
または金属源の組成をほぼそのまま生成膜の組成
に移行させることができる特徴があり、さらに付
着強度が大きく、生成膜が一様であるので特に好
ましい方法である。なお、スパツタリング法やで
は回り込み現象が大きくなるので、マスクは基板
の面に出来るだけ接近させる。 Although the sputtering method has a somewhat slower film formation rate than other methods, high-speed sputtering methods have recently been developed. The sputtering method has the characteristic that the composition of the insulator source or metal source can be transferred almost directly to the composition of the produced film, and furthermore, the adhesion strength is high and the produced film is uniform, so it is a particularly preferred method. In addition, since the wrap-around phenomenon becomes large in the sputtering method, the mask is placed as close to the surface of the substrate as possible.
以下、図面に関連して本発明の実施例を詳しく
説明する。 Embodiments of the invention will now be described in detail with reference to the drawings.
第１図はスパツタリング法の原理を示す図であ
り、10-3〜10-2トール程度のアルゴンガスを封じ
た真空室に、マイナス電極１と接地電極５とを対
向させ、この間に高周波電圧（〜10MHz等）を印
加する。マイナス電極１の面には蒸着しようとす
る金属または酸化物の板２を保持させ、接地電極
５の面には蒸着用の基板４を位置づけ、そして基
板４の面にはマスク３を配置する。高周波電圧を
電極１，５の間に印加すると、金属または酸化物
の板２は正イオン化されたガスの衝撃を受けて金
属または酸化物の原子または分子が板２の表面か
ら放出され、大きな速度で基板４へ向けてスパツ
ターし薄膜状に付着する。なお、スパツタリング
法は公知であるから、これ以上詳しい説明は必要
がないと思う。 FIG. 1 is a diagram showing the principle of the sputtering method. A negative electrode 1 and a ground electrode 5 are placed facing each other in a vacuum chamber filled with argon gas of about 10 -3 to 10 -2 Torr, and a high-frequency voltage ( ~10MHz, etc.). A plate 2 of a metal or oxide to be vapor-deposited is held on the surface of the negative electrode 1, a substrate 4 for vapor deposition is placed on the surface of the ground electrode 5, and a mask 3 is placed on the surface of the substrate 4. When a high frequency voltage is applied between the electrodes 1 and 5, the metal or oxide plate 2 is bombarded with positively ionized gas, and atoms or molecules of the metal or oxide are ejected from the surface of the plate 2 at a high speed. It is sputtered toward the substrate 4 to form a thin film. Incidentally, since the sputtering method is well known, there is no need for further detailed explanation.
第２図ないし第８図は本発明の実施例による積
層インダクタの製造工程を示す。基板４としては
離型性のある表面を有する金属板を用いるとか、
積層インダクタに合体して積層インダクタの一部
を形成する絶縁体とかを用いるものとし、また以
下で説明する薄膜形成工程は必要な形の透過孔を
有するマスク３を通して実行されるものとする。 FIGS. 2 to 8 show the manufacturing process of a laminated inductor according to an embodiment of the present invention. As the substrate 4, a metal plate having a releasable surface may be used.
It is assumed that an insulator or the like which is combined with the laminated inductor to form a part of the laminated inductor is used, and that the thin film forming process described below is carried out through a mask 3 having a transmission hole of the required shape.
先ず第２図を参照する。絶縁性の磁性フエライ
トより成る酸化物源を用いて、先ず酸化物膜１０
を基板４の面に形成する。次にAl、Ag、Niまた
はCu等の金属源を酸化物源と置き換え、またマ
スクを交換した上、第３図のように酸化物膜１０
の右寄りの位置に末端が酸化物膜１０の下辺に露
出するようにして導体１１を形成する。次に第４
図のように、導体１１の上端のみを残して酸化物
膜１０の下方を覆うように膜１０と同じ素材の酸
化物膜１２を形成する。次に導体１１と同じ素材
の導体１３を導体１１の端部に接続し積層体の左
辺側に延びるようにして形成する。次に第６図の
ように導体１３の一端のみを残して積層体の上方
を覆うように形成する。次で第７図のように導体
１３の端部から積層体の右辺側に延びる導体１５
を形成する。以下所要の積層数が得られるまで第
４図〜第７図の工程を反復し、最後に導体１５よ
りも長い導体１７を積層体の上辺まで延長させ、
そして第２図と同様な酸化物膜１６を全面に被覆
して（第８図）積層工程を終る。このように積層
された積層体は、導体１１，１３，１５，１７が
酸化物膜で順次絶縁されながら全体として１つの
周回パターンとなつたコイルを含むことが明らか
であろう。第８図に示すように積層体の上下辺に
導電ペーストを焼付けて外部端子１９を形成す
る。この積層体の等価回路は第９図に示される通
りである。 First, refer to FIG. First, an oxide film 10 is formed using an oxide source made of insulating magnetic ferrite.
is formed on the surface of the substrate 4. Next, after replacing the metal source such as Al, Ag, Ni or Cu with an oxide source and replacing the mask, the oxide film 10 is formed as shown in Fig. 3.
A conductor 11 is formed at a position to the right of the conductor 11 so that its end is exposed to the lower side of the oxide film 10. Then the fourth
As shown in the figure, an oxide film 12 made of the same material as the film 10 is formed to cover the lower part of the oxide film 10, leaving only the upper end of the conductor 11. Next, a conductor 13 made of the same material as the conductor 11 is connected to the end of the conductor 11 so as to extend toward the left side of the laminate. Next, as shown in FIG. 6, the conductor 13 is formed so as to cover the upper part of the laminate, leaving only one end of the conductor 13. Next, as shown in FIG. 7, a conductor 15 extends from the end of the conductor 13 to the right side of the laminate.
form. The steps shown in FIGS. 4 to 7 are repeated until the required number of laminated layers is obtained, and finally, the conductor 17, which is longer than the conductor 15, is extended to the upper side of the laminated body.
Then, the entire surface is covered with an oxide film 16 similar to that shown in FIG. 2 (FIG. 8) to complete the lamination process. It will be clear that the laminate thus laminated includes a coil in which the conductors 11, 13, 15, 17 are successively insulated with oxide films, forming a single circular pattern as a whole. As shown in FIG. 8, external terminals 19 are formed by baking a conductive paste on the upper and lower sides of the laminate. The equivalent circuit of this laminate is shown in FIG.
以上のように、本発明はスパツタリング法によ
り一貫した工程で積層インダクタを製造すること
ができる。積層体の各層は極く薄いものであるか
ら製品の寸法は小さくできると共に、導体のター
ン数は任意に調整できるから極めて広範囲のイン
ダクタンス値を有する積層インダクタとすること
ができる。しかも、本発明で得られる積層インダ
クタは外部端子を有するチツプ形のものであるか
ら、プリント基板への直づけに適し、半田作業の
能率を上げることができる。 As described above, according to the present invention, a laminated inductor can be manufactured in a consistent process using the sputtering method. Since each layer of the laminate is extremely thin, the dimensions of the product can be reduced, and since the number of conductor turns can be adjusted arbitrarily, the laminate inductor can have an extremely wide range of inductance values. Moreover, since the laminated inductor obtained according to the present invention is in the form of a chip having external terminals, it is suitable for direct attachment to a printed circuit board, and the efficiency of soldering work can be improved.
上記実施例は本発明の好ましい実施例を示すも
のであるが、種々の変形例が可能である。例えば
上記実施例においてすべての酸化物層を磁性フエ
ライトの層にすれば閉磁路構造にしうるし、また
最上層及び最下層を非磁性体にすれば開磁路構造
にしうる。また磁性体として磁気特性が良いが絶
縁性が悪いものを用いるときには磁性体の面を絶
縁体酸化物で覆う方法も採用できる。 Although the above embodiments represent preferred embodiments of the invention, various modifications are possible. For example, in the above embodiment, if all the oxide layers are made of magnetic ferrite, a closed magnetic path structure can be obtained, and if the top and bottom layers are made of non-magnetic material, an open magnetic path structure can be obtained. Furthermore, when using a magnetic material that has good magnetic properties but poor insulation properties, a method of covering the surface of the magnetic material with an insulating oxide can also be adopted.
第１０図ないし第１５図は本発明の方法の他の
実施例を示す工程図である。本例は先きの例と本
質的に変りはないが、磁路の方向が面方向となつ
ている点でちがう。第１０図のように先ず絶縁性
フエライト膜２０を形成し、第１１図のように膜
２０の上に引出部Ｓを有する複数の平行な導体２
１を形成し、次に第１２図のように導体２１の端
部を露出させてフエライト膜２２を形成し、さら
に第１３図のように導体２１と共にフエライト膜
２２を周回する導電パターンを形成する複数の平
行な導体２３を形成する。ｔはその引出部であ
る。最後に第１４図のようにフエライト膜２４を
全面に付着形成し、真空室から取出した上、第１
５図のように導電ペーストを引出部ｓ，ｔに接続
するように積層体の上下辺に焼付けて積層インダ
クタを完成する。本実施例の作用効果も第２−９
図に関連して述べた実施例と同様である。 FIGS. 10 to 15 are process diagrams showing other embodiments of the method of the present invention. This example is essentially the same as the previous example, but differs in that the direction of the magnetic path is in the plane direction. As shown in FIG. 10, an insulating ferrite film 20 is first formed, and as shown in FIG.
1 is formed, then a ferrite film 22 is formed by exposing the end of the conductor 21 as shown in FIG. 12, and a conductive pattern that goes around the ferrite film 22 together with the conductor 21 is further formed as shown in FIG. 13. A plurality of parallel conductors 23 are formed. t is its drawer part. Finally, as shown in FIG. 14, a ferrite film 24 is deposited on the entire surface, taken out from the vacuum chamber, and then
As shown in Fig. 5, conductive paste is baked on the upper and lower sides of the laminate so as to connect it to the lead-out parts s and t, thereby completing the laminate inductor. The effects of this example are also shown in Section 2-9.
This is similar to the embodiment described in connection with the figures.
第１図は本発明の方法を実施するための装置の
１例を示す正面図、第２図ないし第８図は本発明
の方法の第１実施例の各工程を示す平面図、第９
図は第１実施例により製造された積層インダクタ
の等価回路図、及び第１０図ないし第１５図は本
発明の第２実施例による方法の各順次工程を示す
平面図である。図中主な部分は次の通りである。
１０，１２，１４，１６，２０，２２，２４：
磁性体膜または絶縁体膜、１１，１３，１５，１
７，２１，２３：導体、１８，１９，２５，２
６：外部端子。
FIG. 1 is a front view showing an example of an apparatus for carrying out the method of the present invention, FIGS. 2 to 8 are plan views showing each step of the first embodiment of the method of the present invention, and FIG.
The figure is an equivalent circuit diagram of a laminated inductor manufactured according to the first embodiment, and FIGS. 10 to 15 are plan views showing each sequential step of the method according to the second embodiment of the present invention. The main parts in the figure are as follows. 10, 12, 14, 16, 20, 22, 24:
Magnetic film or insulating film, 11, 13, 15, 1
7, 21, 23: conductor, 18, 19, 25, 2
6: External terminal.
Claims (1)
ツタリング法により交互に形成積層し、その際に
前記導体は前記酸化物磁性体層の層間から層間へ
と連続して周回する一本のコイル状の導電路を構
成するようにし、次いで前記導体の末端に接続す
る外部端子を積層体の外面に設けることを特徴と
する積層インダクタの製造方法。1. An oxide magnetic layer and a metal conductor are alternately formed and laminated on a substrate by a sputtering method, and at this time, the conductor is a single coil that continuously circulates from layer to layer of the oxide magnetic layer. 1. A method of manufacturing a laminated inductor, comprising forming a conductive path in the form of a conductor, and then providing an external terminal connected to an end of the conductor on the outer surface of the laminated body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4687780A JPS56144512A (en) | 1980-04-11 | 1980-04-11 | Manufacture of laminated inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4687780A JPS56144512A (en) | 1980-04-11 | 1980-04-11 | Manufacture of laminated inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56144512A JPS56144512A (en) | 1981-11-10 |
| JPS6248885B2 true JPS6248885B2 (en) | 1987-10-16 |
Family
ID=12759575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4687780A Granted JPS56144512A (en) | 1980-04-11 | 1980-04-11 | Manufacture of laminated inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56144512A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58162011A (en) * | 1982-03-23 | 1983-09-26 | Tdk Corp | Laminated inductor |
| US10349987B2 (en) | 2010-04-14 | 2019-07-16 | Arrowhead Medical Device Technologies, Llc | Intramedullary fixation devices |
| US8685024B2 (en) | 2010-04-14 | 2014-04-01 | Arrowhead Medical Device Technologies, Llc | Intramedullary fixation device and methods for bone fixation and stabilization |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4212191Y1 (en) * | 1964-04-07 | 1967-07-10 | ||
| JPS4937166U (en) * | 1972-07-03 | 1974-04-02 | ||
| JPS5036013A (en) * | 1973-07-11 | 1975-04-04 | ||
| JPS53141197A (en) * | 1977-05-14 | 1978-12-08 | Nippon Telegr & Teleph Corp <Ntt> | Process for producing magnetic oxide film |
| JPS54110424A (en) * | 1978-02-17 | 1979-08-29 | Ricoh Co Ltd | Transformer |
| JPS5536954A (en) * | 1978-09-07 | 1980-03-14 | Tdk Corp | Inductance element and its manufacture |
-
1980
- 1980-04-11 JP JP4687780A patent/JPS56144512A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4212191Y1 (en) * | 1964-04-07 | 1967-07-10 | ||
| JPS4937166U (en) * | 1972-07-03 | 1974-04-02 | ||
| JPS5036013A (en) * | 1973-07-11 | 1975-04-04 | ||
| JPS53141197A (en) * | 1977-05-14 | 1978-12-08 | Nippon Telegr & Teleph Corp <Ntt> | Process for producing magnetic oxide film |
| JPS54110424A (en) * | 1978-02-17 | 1979-08-29 | Ricoh Co Ltd | Transformer |
| JPS5536954A (en) * | 1978-09-07 | 1980-03-14 | Tdk Corp | Inductance element and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56144512A (en) | 1981-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6195249B1 (en) | Electronic component having gaps between conductive thin films | |
| JP3197022B2 (en) | Multilayer ceramic parts for noise suppressor | |
| TW422998B (en) | Inductor element and the manufacturing method of the same | |
| GB2045540A (en) | Electrical inductive device | |
| WO1999046784A1 (en) | Module and method of manufacture | |
| JPH0135483B2 (en) | ||
| JPS6376313A (en) | Laminated lc filter component | |
| JPS6248885B2 (en) | ||
| US5844460A (en) | Wound, solid state inductor | |
| JPH0363205B2 (en) | ||
| JPH09129458A (en) | Coil | |
| JPH04242911A (en) | Manufacture of electronic parts | |
| JPH023605Y2 (en) | ||
| JPS6248886B2 (en) | ||
| JPS637017B2 (en) | ||
| JP3320096B2 (en) | Multilayer inductor and method of manufacturing the same | |
| JPS60176208A (en) | Laminated part and manufacture thereof | |
| JPH01151212A (en) | Structure of laminate-applied component | |
| JPS5943690Y2 (en) | Stacked transformer | |
| JPH0121611B2 (en) | ||
| JPH0137842B2 (en) | ||
| JPS6145851B2 (en) | ||
| JPH0447950Y2 (en) | ||
| JPS6229885B2 (en) | ||
| JPH11154618A (en) | Manufacture of laminated inductor |