JPS6246268Y2 - - Google Patents
Info
- Publication number
- JPS6246268Y2 JPS6246268Y2 JP1982159987U JP15998782U JPS6246268Y2 JP S6246268 Y2 JPS6246268 Y2 JP S6246268Y2 JP 1982159987 U JP1982159987 U JP 1982159987U JP 15998782 U JP15998782 U JP 15998782U JP S6246268 Y2 JPS6246268 Y2 JP S6246268Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- lead wire
- semiconductor chip
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 230000000630 rising effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982159987U JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982159987U JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5965546U JPS5965546U (ja) | 1984-05-01 |
| JPS6246268Y2 true JPS6246268Y2 (US07534539-20090519-C00280.png) | 1987-12-12 |
Family
ID=30352023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982159987U Granted JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965546U (US07534539-20090519-C00280.png) |
-
1982
- 1982-10-22 JP JP1982159987U patent/JPS5965546U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5965546U (ja) | 1984-05-01 |
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