JPS6244589B2 - - Google Patents
Info
- Publication number
- JPS6244589B2 JPS6244589B2 JP54167090A JP16709079A JPS6244589B2 JP S6244589 B2 JPS6244589 B2 JP S6244589B2 JP 54167090 A JP54167090 A JP 54167090A JP 16709079 A JP16709079 A JP 16709079A JP S6244589 B2 JPS6244589 B2 JP S6244589B2
- Authority
- JP
- Japan
- Prior art keywords
- phenoxy resin
- metal plates
- bonding
- metal plate
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000013034 phenoxy resin Substances 0.000 claims description 15
- 229920006287 phenoxy resin Polymers 0.000 claims description 15
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- -1 metal plates Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709079A JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709079A JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689520A JPS5689520A (en) | 1981-07-20 |
| JPS6244589B2 true JPS6244589B2 (show.php) | 1987-09-21 |
Family
ID=15843226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16709079A Granted JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5689520A (show.php) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106983A (en) * | 1980-01-30 | 1981-08-25 | Unitika Ltd | Bonding method of film |
| JPS59146837A (ja) * | 1983-02-14 | 1984-08-22 | 日本鋼管株式会社 | 制振用複合鋼板及びその製法 |
| EP3569740B1 (en) * | 2017-01-13 | 2025-02-26 | Asahi Kasei Kabushiki Kaisha | Electrode for electrolysis, electrolytic cell, electrode laminate and method for renewing electrode |
| EP4360855A4 (en) * | 2021-06-24 | 2025-07-02 | Resonac Corp | METHOD FOR MANUFACTURING A BOUND BODY |
| EP4458918A4 (en) * | 2021-12-27 | 2026-01-07 | Resonac Corp | METHOD FOR MANUFACTURING AN ASSEMBLED BODY |
| JP7767914B2 (ja) * | 2021-12-27 | 2025-11-12 | 株式会社レゾナック | 電子基板筐体の製造方法及び電子制御ユニットの製造方法 |
| EP4458917A4 (en) * | 2021-12-27 | 2026-01-07 | Resonac Corp | PROCESS FOR PRODUCING A BOND BODY |
| JP7513214B2 (ja) * | 2021-12-27 | 2024-07-09 | 株式会社レゾナック | 接合体の製造方法 |
| WO2024024424A1 (ja) * | 2022-07-27 | 2024-02-01 | 株式会社レゾナック | 金属材の連結体及び金属材の連結方法 |
| EP4578637A1 (en) * | 2022-08-26 | 2025-07-02 | Resonac Corporation | Connected body of metal materials and method for connecting metal materials |
| JP2024090870A (ja) * | 2022-12-23 | 2024-07-04 | 株式会社レゾナック | 積層体及び積層体の製造方法 |
| JP7552681B2 (ja) * | 2022-12-26 | 2024-09-18 | 株式会社レゾナック | フィルム状接合材の製造方法 |
-
1979
- 1979-12-21 JP JP16709079A patent/JPS5689520A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689520A (en) | 1981-07-20 |
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