JPS6244421B2 - - Google Patents
Info
- Publication number
- JPS6244421B2 JPS6244421B2 JP21162782A JP21162782A JPS6244421B2 JP S6244421 B2 JPS6244421 B2 JP S6244421B2 JP 21162782 A JP21162782 A JP 21162782A JP 21162782 A JP21162782 A JP 21162782A JP S6244421 B2 JPS6244421 B2 JP S6244421B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- lead frame
- collector
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21162782A JPS59100558A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21162782A JPS59100558A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59100558A JPS59100558A (ja) | 1984-06-09 |
| JPS6244421B2 true JPS6244421B2 (US07709020-20100504-C00041.png) | 1987-09-21 |
Family
ID=16608900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21162782A Granted JPS59100558A (ja) | 1982-11-30 | 1982-11-30 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59100558A (US07709020-20100504-C00041.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4523138B2 (ja) | 2000-10-06 | 2010-08-11 | ローム株式会社 | 半導体装置およびそれに用いるリードフレーム |
-
1982
- 1982-11-30 JP JP21162782A patent/JPS59100558A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59100558A (ja) | 1984-06-09 |
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