JPS6242576A - Nonlinear resistance element and manufacture of same - Google Patents
Nonlinear resistance element and manufacture of sameInfo
- Publication number
- JPS6242576A JPS6242576A JP60182067A JP18206785A JPS6242576A JP S6242576 A JPS6242576 A JP S6242576A JP 60182067 A JP60182067 A JP 60182067A JP 18206785 A JP18206785 A JP 18206785A JP S6242576 A JPS6242576 A JP S6242576A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- resistance element
- nonlinear resistance
- electrode
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000010409 thin film Substances 0.000 claims abstract description 21
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 9
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims description 2
- 150000001622 bismuth compounds Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 150000002697 manganese compounds Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 10
- 150000001875 compounds Chemical class 0.000 abstract description 9
- 229910052797 bismuth Inorganic materials 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 229910052748 manganese Inorganic materials 0.000 abstract description 3
- 239000011572 manganese Substances 0.000 abstract description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 abstract description 2
- 230000004913 activation Effects 0.000 abstract 1
- 238000004528 spin coating Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- -1 inorganic acid salts Chemical class 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 210000003127 knee Anatomy 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 239000000700 radioactive tracer Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052798 chalcogen Inorganic materials 0.000 description 1
- 150000001787 chalcogens Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- NQNBVCBUOCNRFZ-UHFFFAOYSA-N nickel ferrite Chemical compound [Ni]=O.O=[Fe]O[Fe]=O NQNBVCBUOCNRFZ-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、導電性スイッチングのような機能を備えた非
線形抵抗素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to nonlinear resistive elements with functions such as conductive switching.
従来の技術
導電性スイッチングを行うような非線形抵抗素子はオボ
ニック(OVONIC)素子として知られ、主にカルコ
ゲン元素からなる非晶質半導体をその材料として用いる
。また、遷移金属の酸化物においてもこれと同様な電気
的性質の見られることが知られ、ヘマタイト、マグネタ
イト、ニッケルフェライト、ニッケル亜鉛フェライト、
酸化ニッケルなどが報告されている。これら従来の非線
形抵抗素子では、材料が薄膜や焼結体の形で利用されて
いるが、閾値電圧の低さなどの点から薄膜で構成するの
が有利であり、比較的安定な特性を示す非晶質半導体の
素子ではほとんどが薄膜型である。BACKGROUND OF THE INVENTION A nonlinear resistance element that performs conductive switching is known as an OVONIC element, and uses an amorphous semiconductor mainly composed of chalcogen elements as its material. It is also known that similar electrical properties are found in transition metal oxides, such as hematite, magnetite, nickel ferrite, nickel zinc ferrite,
Nickel oxide etc. have been reported. These conventional nonlinear resistance elements use materials in the form of thin films or sintered bodies, but it is advantageous to construct them with thin films from the viewpoint of low threshold voltage, and they exhibit relatively stable characteristics. Most amorphous semiconductor devices are of the thin film type.
これの基本的な構造を第2図と第3図に示す。The basic structure of this is shown in FIGS. 2 and 3.
なお、図において1は基体、2はアクティブ層、3.4
は電極である。In the figure, 1 is the base, 2 is the active layer, and 3.4
is an electrode.
このように、形成した膜を膜厚の方向で使用するサンド
インチ型(第2図)と、膜をその表面方向で使用するプ
レーナ型(第3図)に分けることができる。いずれの場
合も、アクティブ層は真空蒸着やスパッタで形成される
のが普通である。As described above, it can be divided into a sandwich type (FIG. 2) in which the formed film is used in the direction of its thickness, and a planar type (FIG. 3) in which the film is used in the direction of its surface. In either case, the active layer is usually formed by vacuum evaporation or sputtering.
発明が解決しようとする問題点
前述のように、従来のスイッチング特性を示す非線形抵
抗素子ではそのアクティブ層を真空法で形成するだめ、
製造上の歩留や生産性において不利であるばかりでなく
、例えば非常に大きな基体上に素子を構成する必要のあ
るような用途に対してはコストが高くなるなどの理由で
これに対応することができない。Problems to be Solved by the Invention As mentioned above, in conventional nonlinear resistance elements exhibiting switching characteristics, the active layer cannot be formed using a vacuum method.
This is not only disadvantageous in terms of manufacturing yield and productivity, but also increases costs for applications that require devices to be constructed on very large substrates. I can't.
本発明の目的は、このような問題点を解決したスイッチ
ング特性を持つ非線形抵抗素子とその製造方法を提供し
、これらの素子を生産性良く安価に製造できるようにす
ることである。An object of the present invention is to provide a nonlinear resistance element having switching characteristics that solves these problems and a method for manufacturing the same, and to enable these elements to be manufactured with high productivity and at low cost.
問題点を解決するための手段
上記目的を達成するため本発明では、アクティブ層を形
成するのに金属化合物の溶液の塗布、熱分解という手法
を取入れた。金属化合物としては、適当な溶媒に溶け、
溶液を塗布乾燥した時に膜状になるものであればよく、
例えば硝酸塩などの無機酸塩、酢酸塩などの有機酸塩、
錯体および金属にアルキ°ル基の付いた有機金属などを
用いることができる。このような方法で薄膜を形成でき
る化合物は多いが、発明者らはこのなかからスイッチン
グ特性を呈する化合物として酸化マンガンと酸化ビスマ
スの混合物を見出し、これをアクティブ層に用いた。Means for Solving the Problems In order to achieve the above object, the present invention adopts a method of applying a solution of a metal compound and thermal decomposition to form an active layer. As a metal compound, it dissolves in an appropriate solvent,
It only needs to form a film when the solution is applied and dries.
For example, inorganic acid salts such as nitrates, organic acid salts such as acetates,
Complexes and organic metals with an alkyl group attached to the metal can be used. There are many compounds that can be used to form thin films using this method, but the inventors found a mixture of manganese oxide and bismuth oxide as a compound that exhibits switching properties, and used this for the active layer.
作用
酸化マンガンと酸化ビスマスの混合物薄膜は、マンガン
とビスマスの化合物を溶媒に混合溶解して基体上に塗布
、熱分解させることにより容易に得られる。この際、化
合物と溶媒の組合せを考慮することにより非常に安定な
溶液とすることができ、インキとして長期間の保存が可
能である。このような形成法の導入により、ディップ、
スプレー、印刷などの工法を用いることができるため、
大面積にわたって均一な膜を生産性良く安価に製造する
ことができる。また、熱分解によって得られた薄膜は、
その膜厚、電極間距離、組成などに依存して閾値電圧や
維持電流が変化するスイッチング特性を示し、この特性
の安定性は非常に良好である。A thin film of a mixture of functional manganese oxide and bismuth oxide can be easily obtained by dissolving a compound of manganese and bismuth in a solvent, coating the mixture on a substrate, and thermally decomposing the mixture. At this time, by considering the combination of the compound and the solvent, a very stable solution can be obtained and can be stored as an ink for a long period of time. By introducing such a formation method, dip,
Since construction methods such as spraying and printing can be used,
A uniform film over a large area can be produced with high productivity and at low cost. In addition, the thin film obtained by pyrolysis is
It exhibits switching characteristics in which the threshold voltage and sustaining current change depending on the film thickness, distance between electrodes, composition, etc., and the stability of these characteristics is very good.
実施例 以下に実施例をあげて本発明を説明する。Example The present invention will be explained below with reference to Examples.
(実施例1)
第2図に示したサンドイッチ型の素子を作るため、第1
表に示すような組成で酸化マンガンと酸化ビスマスの混
合物薄膜形成用塗布液を調製した。(Example 1) In order to make the sandwich type element shown in FIG.
A coating solution for forming a thin film of a mixture of manganese oxide and bismuth oxide was prepared with the composition shown in the table.
マンガンとビスマスの化合物として、成膜の非常に容易
な2−エチルへキサン酸塩を使用し、溶媒はメチルイソ
ブチルケトンを使用した。電極として金の薄膜を形成し
たガラス基板上に、これら塗布液をスピンコードしたの
ち常温で乾燥し、大気中560℃で60分間加熱焼成し
てアクティブ層を形成し、さらにこの薄膜上に金の薄膜
を形成した。これらの素子の電圧印加時のI −V特性
をカーブトレーサーで測定すると、第1図に示したよう
なI−4曲線が得られる。測定結果を第1表中に示すが
、この表では第1図におけるvth(閾値電圧)と”t
h (閾値電流)及びvh(維持電圧)と工h(維持電
流)を数値として示した。これらの値はすべて50)4
zの周波数で掃引した時の数値である。また、アクティ
ブ層の厚みは、この薄膜の一部をエツチングして段差を
形成し、接触式の表面粗さ計で測定したものである。As the compound of manganese and bismuth, 2-ethylhexanoate, which is very easy to form into a film, was used, and as the solvent, methyl isobutyl ketone was used. These coating solutions were spin-coded onto a glass substrate on which a thin gold film was formed as an electrode, dried at room temperature, and fired in the air at 560°C for 60 minutes to form an active layer. A thin film was formed. When the I-V characteristics of these elements when voltage is applied are measured with a curve tracer, an I-4 curve as shown in FIG. 1 is obtained. The measurement results are shown in Table 1. In this table, vth (threshold voltage) and "t" in FIG.
h (threshold current), vh (sustaining voltage), and h (maintaining current) are shown as numerical values. All these values are 50)4
This is the value when swept at the frequency of z. The thickness of the active layer was measured by etching a part of this thin film to form a step and using a contact type surface roughness meter.
さらに、これら素子に対し、5Hzで±1sVの調波を
印加し特性の安定性を調べたところ、いずれにおいても
連続で10日間(400万回以上のスイッチングに相当
する)の動作を行わせた後でも、第1表に示した数値に
±6チ以上の変動は認められず、その特性の安定性は実
用上充分であると考えられた。Furthermore, we applied harmonics of ±1 sV at 5 Hz to these devices to examine the stability of their characteristics, and found that each device was operated continuously for 10 days (equivalent to over 4 million switching times). Even after the test, no fluctuation of more than ±6 inches was observed in the values shown in Table 1, and the stability of the properties was considered to be sufficient for practical use.
(以下金 白)
(実施例2)
実施例1と同様な組成の塗布液を用い、電極をスズをド
ープした酸化インジウム薄膜に置換えてサンドイッチ型
の素子を構成した。電極以外の作成方法は、実施例1と
まったく同様である。これらのI−V特性をカーブトレ
ーサで測定すると、同様に第1図のようなI−V曲線が
得られ、この結果を第2表に示す。表中のサンプル隘は
第1表のそれに対応し、同一の陽のものは同じ塗布液で
アクティブ層を形成したことを示す。掃引周波数は50
庵である。この表から、若干の変動はあるがほぼ実施例
1と同じ結果の得られることが分る。(Hereinafter referred to as "Kinshiro") (Example 2) Using a coating solution having the same composition as in Example 1, a sandwich-type element was constructed by replacing the electrode with an indium oxide thin film doped with tin. The manufacturing method except for the electrodes is exactly the same as in Example 1. When these IV characteristics were measured with a curve tracer, IV curves as shown in FIG. 1 were similarly obtained, and the results are shown in Table 2. The sample numbers in the table correspond to those in Table 1, and the same positives indicate that the active layer was formed using the same coating solution. Sweep frequency is 50
It is a hermitage. From this table, it can be seen that almost the same results as in Example 1 were obtained, although there were some variations.
また、実施例1と同様な安定性の試験を行い、これらに
おいても約400万回以上のスイッチングの後でも特性
は安定していることを確認した。Further, stability tests similar to those in Example 1 were conducted, and it was confirmed that the characteristics were stable even after switching approximately 4 million times or more.
(実施例3)
ガラス基板上に金の薄膜を形成し、この薄膜を一部エッ
チングして幅が数十μの間隙を設け、これによって隔て
られた金薄膜を電極とし、この上に実施例1と同様の塗
布液を用いてアクティブ層を形成した。その形成条件は
実施例1と同様である。このようにして第3図に示した
プレーナ型の素子を作成した。これらに直流電圧を印加
し、ニーV特性を測定すると実施例1や2と同様に第1
図に示したようなニー7曲線が得られた。この結果を第
3表に示す。同様にサンプル隘は実施例1の患に対応す
る。サンドインチ型素子に比べ電極間間隔が大きいこと
に対応して閾値電圧が増大していることが分る。これら
においても特性の安定性は実用上充分であることを確認
した。(Example 3) A thin gold film was formed on a glass substrate, a part of this thin film was etched to create a gap of several tens of microns in width, the gold thin film separated by this was used as an electrode, and the example was applied on top of this. An active layer was formed using the same coating solution as in Example 1. The formation conditions are the same as in Example 1. In this way, the planar type element shown in FIG. 3 was produced. When a DC voltage is applied to these and the knee V characteristics are measured, the first
A knee 7 curve as shown in the figure was obtained. The results are shown in Table 3. Similarly, the sample size corresponds to that of Example 1. It can be seen that the threshold voltage increases in response to the larger inter-electrode spacing compared to the sandwich type element. It was confirmed that the stability of the properties in these cases was sufficient for practical use.
(以下余白)
(実施例4)
直径1Hのステンレス線を実施例1の隘4の塗布液中に
浸漬し、約5xz/secの速度で引きあげたのち乾燥
し、SOO″Cで90分間加熱焼成して、ステンレス線
表面に酸化マンガンと酸化ビスマスの混合物薄膜を形成
し、さらにこの膜表面に銀電極を形成して素子を構成し
た。このものでは掃引周波数50HzにオイテVthカ
5.1 V 、 IIhカ1.4mム、Yhが2.8V
、Ihが2.3mムの、実施例1〜3と同様なスイッチ
ング特性が見られた。(Leaving space below) (Example 4) A stainless steel wire with a diameter of 1H was immersed in the coating solution in column 4 of Example 1, pulled up at a speed of about 5xz/sec, dried, and fired at SOO''C for 90 minutes. Then, a thin film of a mixture of manganese oxide and bismuth oxide was formed on the surface of the stainless steel wire, and a silver electrode was further formed on the surface of this film to construct the device. IIh voltage 1.4mm, Yh voltage 2.8V
, Ih was 2.3 mm, and switching characteristics similar to Examples 1 to 3 were observed.
なお、本実施例1〜4では用いた基体と電極材料の耐熱
性の点から焼成温度は500〜550’Cで行ったが、
例えばアルミナなどの耐熱性のある基体を用いる際には
この温度を基体の耐熱温度まで上げることができる。用
いる化合物についても、硝酸塩、硫酸塩などの無機酸塩
、酢酸塩などの有機酸塩、錯塩、金属アルコキシドなど
で適当な溶媒に溶解するものであれば、支障なく使用す
ることができる。また、電極材料としては本実施例以外
の銅、アルミニウム、亜鉛などの金属や、スズ酸カドミ
ウム、アンチモンをドープした酸化スズなどの導電性酸
化物、あるいはカーボンなども使用することができる。In Examples 1 to 4, the firing temperature was 500 to 550'C in view of the heat resistance of the substrate and electrode materials used.
For example, when using a heat-resistant substrate such as alumina, this temperature can be raised to the heat-resistant temperature of the substrate. Regarding the compounds to be used, any inorganic acid salts such as nitrates and sulfates, organic acid salts such as acetates, complex salts, metal alkoxides, etc., which can be dissolved in an appropriate solvent, can be used without any problem. Further, as the electrode material, metals other than those used in this embodiment such as copper, aluminum, and zinc, conductive oxides such as cadmium stannate and antimony-doped tin oxide, or carbon can also be used.
発明の効果
以上のように本発明の非線形抵抗素子は、酸化マンガン
と酸化ビスマスの混合物薄膜とこれから電気的リードを
取るための電極とからなり、酸化マンガンと酸化ビスマ
スの混合物薄膜をマンガン化合物とビスマス化合物を溶
媒に溶解した溶液を基体上に塗布し、乾燥後、大気中で
加熱焼成することによって形成するという方法で製造さ
れることにより、スイッチング特性を有する非線形抵抗
素子を生産性良く安価に提供することができ、大面積に
わたっても製造が容易であるという点においてその実用
的な有用性は大きい。Effects of the Invention As described above, the nonlinear resistance element of the present invention consists of a thin film of a mixture of manganese oxide and bismuth oxide and an electrode for taking electrical leads from the thin film of a mixture of manganese oxide and bismuth oxide. By applying a solution of a compound dissolved in a solvent onto a substrate, drying it, and then baking it in the atmosphere, it is possible to provide a nonlinear resistance element with switching characteristics at a high productivity and at a low cost. Its practical usefulness is great in that it can be easily manufactured even over a large area.
第1図は本発明の非線形抵抗素子の電流−電圧特性図、
第2図はサンドインチ型非線抵抗素子の構造を示す断面
図、第3図はブレーナ型非線抵抗素子の構造を示す断面
図である。
第1図
工¥流FIG. 1 is a current-voltage characteristic diagram of the nonlinear resistance element of the present invention,
FIG. 2 is a sectional view showing the structure of a Sandinch type non-linear resistance element, and FIG. 3 is a sectional view showing the structure of a Brehner type non-linear resistance element. 1st drawing style
Claims (2)
の薄膜から電気的リードを取るための電極とからなり、
導電性スイッチング特性を有することを特徴とする非線
形抵抗素子。(1) Consisting of a thin film of a mixture of manganese oxide and bismuth oxide, and an electrode for taking electrical leads from this thin film,
A nonlinear resistance element characterized by having conductive switching characteristics.
た溶液を基体上に塗布し、乾燥した後、加熱、焼成する
ことによって酸化マンガンと酸化ビスマスの混合物薄膜
を形成することを特徴とする非線形抵抗素子の製造方法
。(2) A nonlinear resistance element characterized by forming a thin film of a mixture of manganese oxide and bismuth oxide by applying a solution of a manganese compound and a bismuth compound dissolved in a solvent onto a substrate, drying it, heating it, and baking it. manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60182067A JPS6242576A (en) | 1985-08-20 | 1985-08-20 | Nonlinear resistance element and manufacture of same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60182067A JPS6242576A (en) | 1985-08-20 | 1985-08-20 | Nonlinear resistance element and manufacture of same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6242576A true JPS6242576A (en) | 1987-02-24 |
Family
ID=16111770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60182067A Pending JPS6242576A (en) | 1985-08-20 | 1985-08-20 | Nonlinear resistance element and manufacture of same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6242576A (en) |
-
1985
- 1985-08-20 JP JP60182067A patent/JPS6242576A/en active Pending
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