JPS6242379B2 - - Google Patents
Info
- Publication number
- JPS6242379B2 JPS6242379B2 JP58097555A JP9755583A JPS6242379B2 JP S6242379 B2 JPS6242379 B2 JP S6242379B2 JP 58097555 A JP58097555 A JP 58097555A JP 9755583 A JP9755583 A JP 9755583A JP S6242379 B2 JPS6242379 B2 JP S6242379B2
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- wafer sheet
- wafer
- pellet
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/0442—
-
- H10P72/50—
-
- H10P72/7414—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58097555A JPS59229836A (ja) | 1983-05-30 | 1983-05-30 | ペレツトピツクアツプ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58097555A JPS59229836A (ja) | 1983-05-30 | 1983-05-30 | ペレツトピツクアツプ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59229836A JPS59229836A (ja) | 1984-12-24 |
| JPS6242379B2 true JPS6242379B2 (index.php) | 1987-09-08 |
Family
ID=14195483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58097555A Granted JPS59229836A (ja) | 1983-05-30 | 1983-05-30 | ペレツトピツクアツプ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59229836A (index.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100346482B1 (ko) * | 1994-12-03 | 2002-11-23 | 앰코 테크놀로지 코리아 주식회사 | 다이본딩의이젝팅장치 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4980971A (index.php) * | 1972-12-08 | 1974-08-05 |
-
1983
- 1983-05-30 JP JP58097555A patent/JPS59229836A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59229836A (ja) | 1984-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000353710A (ja) | ペレットピックアップ装置および半導体装置の製造方法 | |
| JP2002270542A (ja) | ダイのピックアップ方法及びピックアップ装置 | |
| JP2015076410A (ja) | ボンディング方法及びダイボンダ | |
| KR100950250B1 (ko) | 이젝터의 칩 지지장치 | |
| KR102068358B1 (ko) | 반도체 다이 분리장치 | |
| CN205810778U (zh) | 吸附装置 | |
| JPH09181150A (ja) | 半導体チップのピックアップ装置及びこれを用いたピックアップ方法 | |
| JPS6242379B2 (index.php) | ||
| KR100639553B1 (ko) | 다이 픽업 장치 | |
| JP3870803B2 (ja) | チップ部品供給装置 | |
| JPH0376139A (ja) | 半導体素子突上げ方法 | |
| JP3918661B2 (ja) | ウェハシート上のチップのピックアップ装置及びピックアップ方法 | |
| JP4230178B2 (ja) | 半導体チップ剥離装置およびその方法 | |
| KR102382558B1 (ko) | 다이 픽업 장치 및 다이 픽업 장치의 동작방법 | |
| TW569375B (en) | Method to separate article and adhesive film | |
| JPS6410935B2 (index.php) | ||
| JP2619443B2 (ja) | ペレットのピックアップ方法 | |
| JPH0144018B2 (index.php) | ||
| CN1230870C (zh) | 贴膜对象与其所贴胶膜分离的方法 | |
| JPH11274181A (ja) | チップの突き上げ装置 | |
| JP2002124525A (ja) | 半導体チップ剥離装置及び方法 | |
| JP3440803B2 (ja) | チップの突き上げ方法 | |
| KR102819732B1 (ko) | 반도체 제조 공정에서의 다이 이젝팅 방법 및 장치 | |
| JPH098101A (ja) | ダイエジェクタ装置 | |
| JPH0997807A (ja) | チップのピックアップ方法 |