JPS6240458Y2 - - Google Patents
Info
- Publication number
- JPS6240458Y2 JPS6240458Y2 JP1980157604U JP15760480U JPS6240458Y2 JP S6240458 Y2 JPS6240458 Y2 JP S6240458Y2 JP 1980157604 U JP1980157604 U JP 1980157604U JP 15760480 U JP15760480 U JP 15760480U JP S6240458 Y2 JPS6240458 Y2 JP S6240458Y2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- etching
- conductor
- check
- check mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000001154 acute effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980157604U JPS6240458Y2 (zh) | 1980-11-04 | 1980-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980157604U JPS6240458Y2 (zh) | 1980-11-04 | 1980-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5780865U JPS5780865U (zh) | 1982-05-19 |
| JPS6240458Y2 true JPS6240458Y2 (zh) | 1987-10-16 |
Family
ID=29516711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980157604U Expired JPS6240458Y2 (zh) | 1980-11-04 | 1980-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240458Y2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0694393B2 (ja) * | 1985-11-25 | 1994-11-24 | 株式会社東芝 | セラミツク素体 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519684A (en) * | 1974-07-15 | 1976-01-26 | Nippon Electric Co | Handotai sochi no seizo hoho |
-
1980
- 1980-11-04 JP JP1980157604U patent/JPS6240458Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519684A (en) * | 1974-07-15 | 1976-01-26 | Nippon Electric Co | Handotai sochi no seizo hoho |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5780865U (zh) | 1982-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4049903A (en) | Circuit film strip and manufacturing method | |
| GB1445366A (en) | Method of manufacturing a wafer holding conductor patterns upon two opposite faces electrochemical production of substituted pyridines | |
| JPS6240458Y2 (zh) | ||
| US20080297183A1 (en) | Probe card having columnar base portion and method of producing the same | |
| JPH0983116A (ja) | プリント配線基板 | |
| JPH0514541Y2 (zh) | ||
| JPH05335438A (ja) | リードレスチップキャリア | |
| JPH0669638A (ja) | プリント配線板のランド部構造 | |
| US4410574A (en) | Printed circuit boards and methods for making same | |
| JPH02122590A (ja) | 部品の位置決め装置 | |
| JPH0737329Y2 (ja) | 印刷配線板 | |
| JPS599934A (ja) | プロ−ブカ−ドの製造方法 | |
| JP2002043742A (ja) | 回路基板の製造方法 | |
| JP2645516B2 (ja) | アイマークを備えたプリント配線板及びその製造方法 | |
| KR100331250B1 (ko) | 인쇄회로기판의 제조 방법 | |
| JP3569923B2 (ja) | 積層混成集積回路部品の製造方法 | |
| JPH0223004Y2 (zh) | ||
| US20030002263A1 (en) | HDI circuit board and method of production of an HDI circuit board | |
| JPS587897A (ja) | 回路配線板の製造方法 | |
| JPS59220991A (ja) | Ｉｃ基板の表裏パタ−ンの位置合わせ方法 | |
| JPH06283834A (ja) | 配線回路板、その製造方法及びリード接続方法 | |
| JPH0936505A (ja) | フレキシブルプリント基板原板 | |
| JPH04263446A (ja) | Ｔａｂ用テープキャリア | |
| JPH04277689A (ja) | 印刷配線板の製造方法 | |
| JPH0357645A (ja) | 多層プリント配線板の製造方法 |