JPS6240458Y2 - - Google Patents

Info

Publication number
JPS6240458Y2
JPS6240458Y2 JP1980157604U JP15760480U JPS6240458Y2 JP S6240458 Y2 JPS6240458 Y2 JP S6240458Y2 JP 1980157604 U JP1980157604 U JP 1980157604U JP 15760480 U JP15760480 U JP 15760480U JP S6240458 Y2 JPS6240458 Y2 JP S6240458Y2
Authority
JP
Japan
Prior art keywords
pattern
etching
conductor
check
check mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980157604U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5780865U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980157604U priority Critical patent/JPS6240458Y2/ja
Publication of JPS5780865U publication Critical patent/JPS5780865U/ja
Application granted granted Critical
Publication of JPS6240458Y2 publication Critical patent/JPS6240458Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP1980157604U 1980-11-04 1980-11-04 Expired JPS6240458Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980157604U JPS6240458Y2 (en:Method) 1980-11-04 1980-11-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980157604U JPS6240458Y2 (en:Method) 1980-11-04 1980-11-04

Publications (2)

Publication Number Publication Date
JPS5780865U JPS5780865U (en:Method) 1982-05-19
JPS6240458Y2 true JPS6240458Y2 (en:Method) 1987-10-16

Family

ID=29516711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980157604U Expired JPS6240458Y2 (en:Method) 1980-11-04 1980-11-04

Country Status (1)

Country Link
JP (1) JPS6240458Y2 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694393B2 (ja) * 1985-11-25 1994-11-24 株式会社東芝 セラミツク素体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594850B2 (ja) * 1974-07-15 1984-02-01 日本電気株式会社 ハンドウタイソウチノセイゾウホウホウ

Also Published As

Publication number Publication date
JPS5780865U (en:Method) 1982-05-19

Similar Documents

Publication Publication Date Title
US4049903A (en) Circuit film strip and manufacturing method
GB1445366A (en) Method of manufacturing a wafer holding conductor patterns upon two opposite faces electrochemical production of substituted pyridines
JPS6240458Y2 (en:Method)
US20080297183A1 (en) Probe card having columnar base portion and method of producing the same
JPH0983116A (ja) プリント配線基板
JPH0514541Y2 (en:Method)
US4410574A (en) Printed circuit boards and methods for making same
JPH02122590A (ja) 部品の位置決め装置
JPH05335438A (ja) リードレスチップキャリア
JPH0737329Y2 (ja) 印刷配線板
JPS599934A (ja) プロ−ブカ−ドの製造方法
JP2645516B2 (ja) アイマークを備えたプリント配線板及びその製造方法
KR100331250B1 (ko) 인쇄회로기판의 제조 방법
JP3569923B2 (ja) 積層混成集積回路部品の製造方法
JPH02277280A (ja) プリント基板のパターン認識マーク形成法
JPH0223004Y2 (en:Method)
JPS587897A (ja) 回路配線板の製造方法
US20030002263A1 (en) HDI circuit board and method of production of an HDI circuit board
JPS5833711Y2 (ja) 電子回路用プリント基板
JPS59220991A (ja) Ｉｃ基板の表裏パタ−ンの位置合わせ方法
JPH03178193A (ja) 多層プリント基板
JPH04263446A (ja) Ｔａｂ用テープキャリア
JPH04277689A (ja) 印刷配線板の製造方法
JPH0357645A (ja) 多層プリント配線板の製造方法
JPH0529719A (ja) プリント配線基板