JPS6240439Y2 - - Google Patents
Info
- Publication number
- JPS6240439Y2 JPS6240439Y2 JP1980029475U JP2947580U JPS6240439Y2 JP S6240439 Y2 JPS6240439 Y2 JP S6240439Y2 JP 1980029475 U JP1980029475 U JP 1980029475U JP 2947580 U JP2947580 U JP 2947580U JP S6240439 Y2 JPS6240439 Y2 JP S6240439Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- mounting
- dumet
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980029475U JPS6240439Y2 (US06277897-20010821-C00009.png) | 1980-03-06 | 1980-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980029475U JPS6240439Y2 (US06277897-20010821-C00009.png) | 1980-03-06 | 1980-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56132758U JPS56132758U (US06277897-20010821-C00009.png) | 1981-10-08 |
| JPS6240439Y2 true JPS6240439Y2 (US06277897-20010821-C00009.png) | 1987-10-16 |
Family
ID=29625362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980029475U Expired JPS6240439Y2 (US06277897-20010821-C00009.png) | 1980-03-06 | 1980-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240439Y2 (US06277897-20010821-C00009.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5534683B2 (US06277897-20010821-C00009.png) * | 1976-06-15 | 1980-09-09 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843235Y2 (ja) * | 1978-08-28 | 1983-09-30 | 日本電気ホームエレクトロニクス株式会社 | Ｄｈｄ形ダイオ−ド |
| JPS6020953Y2 (ja) * | 1979-12-25 | 1985-06-22 | 日本電気ホームエレクトロニクス株式会社 | ガラス封止形ｄｈｄダイオ−ド |
-
1980
- 1980-03-06 JP JP1980029475U patent/JPS6240439Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5534683B2 (US06277897-20010821-C00009.png) * | 1976-06-15 | 1980-09-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56132758U (US06277897-20010821-C00009.png) | 1981-10-08 |
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