JPS6239042A - 電子部品の実装方法 - Google Patents

電子部品の実装方法

Info

Publication number
JPS6239042A
JPS6239042A JP60178890A JP17889085A JPS6239042A JP S6239042 A JPS6239042 A JP S6239042A JP 60178890 A JP60178890 A JP 60178890A JP 17889085 A JP17889085 A JP 17889085A JP S6239042 A JPS6239042 A JP S6239042A
Authority
JP
Japan
Prior art keywords
substrate
heat sink
electronic parts
electronic component
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60178890A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426551B2 (enrdf_load_html_response
Inventor
Michinori Shiina
椎名　道則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60178890A priority Critical patent/JPS6239042A/ja
Publication of JPS6239042A publication Critical patent/JPS6239042A/ja
Publication of JPH0426551B2 publication Critical patent/JPH0426551B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60178890A 1985-08-14 1985-08-14 電子部品の実装方法 Granted JPS6239042A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60178890A JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60178890A JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Publications (2)

Publication Number Publication Date
JPS6239042A true JPS6239042A (ja) 1987-02-20
JPH0426551B2 JPH0426551B2 (enrdf_load_html_response) 1992-05-07

Family

ID=16056486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60178890A Granted JPS6239042A (ja) 1985-08-14 1985-08-14 電子部品の実装方法

Country Status (1)

Country Link
JP (1) JPS6239042A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPH0426551B2 (enrdf_load_html_response) 1992-05-07

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