JPH0426551B2 - - Google Patents
Info
- Publication number
- JPH0426551B2 JPH0426551B2 JP60178890A JP17889085A JPH0426551B2 JP H0426551 B2 JPH0426551 B2 JP H0426551B2 JP 60178890 A JP60178890 A JP 60178890A JP 17889085 A JP17889085 A JP 17889085A JP H0426551 B2 JPH0426551 B2 JP H0426551B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- heat sink
- sealing
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 9
- 238000005219 brazing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178890A JPS6239042A (ja) | 1985-08-14 | 1985-08-14 | 電子部品の実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178890A JPS6239042A (ja) | 1985-08-14 | 1985-08-14 | 電子部品の実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6239042A JPS6239042A (ja) | 1987-02-20 |
| JPH0426551B2 true JPH0426551B2 (enrdf_load_html_response) | 1992-05-07 |
Family
ID=16056486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60178890A Granted JPS6239042A (ja) | 1985-08-14 | 1985-08-14 | 電子部品の実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239042A (enrdf_load_html_response) |
-
1985
- 1985-08-14 JP JP60178890A patent/JPS6239042A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239042A (ja) | 1987-02-20 |
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