JPS6238874B2 - - Google Patents
Info
- Publication number
- JPS6238874B2 JPS6238874B2 JP60058012A JP5801285A JPS6238874B2 JP S6238874 B2 JPS6238874 B2 JP S6238874B2 JP 60058012 A JP60058012 A JP 60058012A JP 5801285 A JP5801285 A JP 5801285A JP S6238874 B2 JPS6238874 B2 JP S6238874B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- heat sink
- tin
- silicon
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 31
- 229910052710 silicon Inorganic materials 0.000 claims description 31
- 239000010703 silicon Substances 0.000 claims description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 26
- 239000008188 pellet Substances 0.000 claims description 19
- 229910052697 platinum Inorganic materials 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 12
- 239000010931 gold Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- WGLNLIPRLXSIEL-UHFFFAOYSA-N [Sn].[Cr] Chemical compound [Sn].[Cr] WGLNLIPRLXSIEL-UHFFFAOYSA-N 0.000 description 2
- AAQSSIHZEVZWNS-UHFFFAOYSA-N [Ti].[Sn].[Pt] Chemical compound [Ti].[Sn].[Pt] AAQSSIHZEVZWNS-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5801285A JPS61179589A (ja) | 1985-03-22 | 1985-03-22 | 半導体レ−ザ装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5801285A JPS61179589A (ja) | 1985-03-22 | 1985-03-22 | 半導体レ−ザ装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7698377A Division JPS5411690A (en) | 1977-06-27 | 1977-06-27 | Semiconductor laser unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179589A JPS61179589A (ja) | 1986-08-12 |
| JPS6238874B2 true JPS6238874B2 (el) | 1987-08-20 |
Family
ID=13072053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5801285A Granted JPS61179589A (ja) | 1985-03-22 | 1985-03-22 | 半導体レ−ザ装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179589A (el) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141975B2 (el) * | 1972-07-31 | 1976-11-12 | ||
| JPS5419829U (el) * | 1977-07-12 | 1979-02-08 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419829Y2 (el) * | 1974-09-25 | 1979-07-20 |
-
1985
- 1985-03-22 JP JP5801285A patent/JPS61179589A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141975B2 (el) * | 1972-07-31 | 1976-11-12 | ||
| JPS5419829U (el) * | 1977-07-12 | 1979-02-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61179589A (ja) | 1986-08-12 |
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