JPS6238302B2 - - Google Patents
Info
- Publication number
- JPS6238302B2 JPS6238302B2 JP57072754A JP7275482A JPS6238302B2 JP S6238302 B2 JPS6238302 B2 JP S6238302B2 JP 57072754 A JP57072754 A JP 57072754A JP 7275482 A JP7275482 A JP 7275482A JP S6238302 B2 JPS6238302 B2 JP S6238302B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- weight
- composition
- nitrate
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Glass Compositions (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57072754A JPS58190836A (ja) | 1982-04-30 | 1982-04-30 | 半導体被覆用ガラス組成物の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57072754A JPS58190836A (ja) | 1982-04-30 | 1982-04-30 | 半導体被覆用ガラス組成物の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58190836A JPS58190836A (ja) | 1983-11-07 |
| JPS6238302B2 true JPS6238302B2 (enExample) | 1987-08-17 |
Family
ID=13498452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57072754A Granted JPS58190836A (ja) | 1982-04-30 | 1982-04-30 | 半導体被覆用ガラス組成物の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58190836A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002261269A (ja) * | 2001-02-27 | 2002-09-13 | Matsushita Electric Ind Co Ltd | メサ型半導体装置の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962772B (zh) * | 2009-07-24 | 2012-10-17 | 浙江帅康电气股份有限公司 | 一种铸铁搪瓷燃烧器及其制备工艺 |
| WO2014155739A1 (ja) * | 2013-03-29 | 2014-10-02 | 新電元工業株式会社 | 半導体接合保護用ガラス組成物、半導体装置の製造方法及び半導体装置 |
-
1982
- 1982-04-30 JP JP57072754A patent/JPS58190836A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002261269A (ja) * | 2001-02-27 | 2002-09-13 | Matsushita Electric Ind Co Ltd | メサ型半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58190836A (ja) | 1983-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6238300B2 (enExample) | ||
| TWI809240B (zh) | 半導體元件被覆用玻璃及使用其之半導體被覆用材料 | |
| CN112512983B (zh) | 半导体元件被覆用玻璃以及使用其的半导体被覆用材料 | |
| JPH0149653B2 (enExample) | ||
| EP0258408A1 (en) | LOW MELTING POINT GLASS COMPOSITION CONTAINING PbO AND V 2? O 5 ?. | |
| CN119451920A (zh) | 半导体元件覆盖用玻璃、半导体元件覆盖用材料和半导体元件覆盖用烧结体 | |
| CN115066404B (zh) | 半导体元件被覆用玻璃以及使用其的半导体被覆用材料 | |
| JPS58190836A (ja) | 半導体被覆用ガラス組成物の製造方法 | |
| JP7185181B2 (ja) | 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料 | |
| JPS58184730A (ja) | 半導体被覆用ガラス組成物 | |
| JPS5840845A (ja) | 半導体被覆用ガラス | |
| TW202448819A (zh) | 半導體元件被覆用材料及半導體元件被覆用燒結體 | |
| JPH048385B2 (enExample) | ||
| JP2764880B2 (ja) | 半導体被覆用ガラス | |
| TW202532360A (zh) | 玻璃在鈍化電子元件方面的應用及鈍化之電子元件 | |
| JPH0426541B2 (enExample) | ||
| TW202517596A (zh) | 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料 | |
| JPH0224373B2 (enExample) | ||
| JPS5950609B2 (ja) | 半導体被覆用ガラス | |
| CN121335867A (zh) | 半导体元件被覆用玻璃以及半导体元件被覆用烧结体 | |
| CN117923802A (zh) | 半导体器件钝化用无铅玻璃粉及其应用 | |
| TW202248157A (zh) | 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料 | |
| JPS6124343B2 (enExample) | ||
| JPS6325702B2 (enExample) | ||
| JPS5874536A (ja) | 半導体被覆用ガラス |