JPS6237928U - - Google Patents
Info
- Publication number
- JPS6237928U JPS6237928U JP1985128842U JP12884285U JPS6237928U JP S6237928 U JPS6237928 U JP S6237928U JP 1985128842 U JP1985128842 U JP 1985128842U JP 12884285 U JP12884285 U JP 12884285U JP S6237928 U JPS6237928 U JP S6237928U
- Authority
- JP
- Japan
- Prior art keywords
- header
- semiconductor chip
- semiconductor device
- spacing member
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/347—Dispositions of multiple die-attach connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128842U JPH0519954Y2 (https=) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128842U JPH0519954Y2 (https=) | 1985-08-26 | 1985-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237928U true JPS6237928U (https=) | 1987-03-06 |
| JPH0519954Y2 JPH0519954Y2 (https=) | 1993-05-25 |
Family
ID=31024873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128842U Expired - Lifetime JPH0519954Y2 (https=) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519954Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123065A (en) * | 1975-04-21 | 1976-10-27 | Hitachi Ltd | Semiconductor device |
| JPS5989427A (ja) * | 1982-11-15 | 1984-05-23 | Sanken Electric Co Ltd | 半導体装置の製造方法 |
-
1985
- 1985-08-26 JP JP1985128842U patent/JPH0519954Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123065A (en) * | 1975-04-21 | 1976-10-27 | Hitachi Ltd | Semiconductor device |
| JPS5989427A (ja) * | 1982-11-15 | 1984-05-23 | Sanken Electric Co Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519954Y2 (https=) | 1993-05-25 |