JPS6237558B2 - - Google Patents
Info
- Publication number
- JPS6237558B2 JPS6237558B2 JP6350978A JP6350978A JPS6237558B2 JP S6237558 B2 JPS6237558 B2 JP S6237558B2 JP 6350978 A JP6350978 A JP 6350978A JP 6350978 A JP6350978 A JP 6350978A JP S6237558 B2 JPS6237558 B2 JP S6237558B2
- Authority
- JP
- Japan
- Prior art keywords
- coverlay
- parts
- printed wiring
- weight
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920000180 alkyd Polymers 0.000 claims description 18
- 239000002904 solvent Substances 0.000 claims description 12
- 239000002518 antifoaming agent Substances 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 230000005484 gravity Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 239000000976 ink Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 10
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 9
- 239000010408 film Substances 0.000 description 6
- 238000004898 kneading Methods 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000012787 coverlay film Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 235000019445 benzyl alcohol Nutrition 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 208000023514 Barrett esophagus Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 asbestin Substances 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6350978A JPS54155469A (en) | 1978-05-27 | 1978-05-27 | Cover ink for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6350978A JPS54155469A (en) | 1978-05-27 | 1978-05-27 | Cover ink for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54155469A JPS54155469A (en) | 1979-12-07 |
| JPS6237558B2 true JPS6237558B2 (enrdf_load_stackoverflow) | 1987-08-13 |
Family
ID=13231259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6350978A Granted JPS54155469A (en) | 1978-05-27 | 1978-05-27 | Cover ink for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54155469A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
| JPH06103783B2 (ja) * | 1987-03-16 | 1994-12-14 | 日本シイエムケイ株式会社 | プリント配線板のソルダーレジスト用印刷インク |
| JPH06188546A (ja) * | 1987-03-16 | 1994-07-08 | Cmk Corp | プリント配線板 |
| JPH06169151A (ja) * | 1993-08-16 | 1994-06-14 | Cmk Corp | プリント配線板の製造方法 |
-
1978
- 1978-05-27 JP JP6350978A patent/JPS54155469A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54155469A (en) | 1979-12-07 |
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