JPS6236552U - - Google Patents
Info
- Publication number
- JPS6236552U JPS6236552U JP1985127679U JP12767985U JPS6236552U JP S6236552 U JPS6236552 U JP S6236552U JP 1985127679 U JP1985127679 U JP 1985127679U JP 12767985 U JP12767985 U JP 12767985U JP S6236552 U JPS6236552 U JP S6236552U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- capacitor
- electrodes
- mounting
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案に係る半導体素子の実装構造の
一実施例を示す断面図、第２図は第１図のコンデ
ンサ形成の説明図、第３図は本考案の第２の実施
例の断面図、第４図は従来例の断面図、第５図は
第４図の等価回路図である。
１０……チツプキヤリア、１０ａ，１０ｂ，１
０ｃ，２４ａ，２４ｃ……電極、１０ｄ……コン
デンサ、１１，２１……半導体素子、２４……基
板。
FIG. 1 is a cross-sectional view showing one embodiment of a semiconductor element mounting structure according to the present invention, FIG. 2 is an explanatory diagram of the formation of a capacitor in FIG. 1, and FIG. 3 is a cross-sectional view of a second embodiment of the present invention. 4 is a sectional view of a conventional example, and FIG. 5 is an equivalent circuit diagram of FIG. 4. 10...Chipukiyaria, 10a, 10b, 1
0c, 24a, 24c... Electrode, 10d... Capacitor, 11, 21... Semiconductor element, 24... Substrate.
Claims (1)
の部材の両面に電極を形成することによりコンデ
ンサを形成し、該コンデンサの電極上に半導体素
子を実装したことを特徴とする半導体素子の実装
構造。 A mounting structure for a semiconductor device, characterized in that a capacitor is formed by forming electrodes on both sides of a member made of a dielectric material for mounting a semiconductor device, and a semiconductor device is mounted on the electrodes of the capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127679U JPS6236552U (en) | 1985-08-21 | 1985-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127679U JPS6236552U (en) | 1985-08-21 | 1985-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236552U true JPS6236552U (en) | 1987-03-04 |
Family
ID=31022665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985127679U Pending JPS6236552U (en) | 1985-08-21 | 1985-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236552U (en) |
-
1985
- 1985-08-21 JP JP1985127679U patent/JPS6236552U/ja active Pending