JPS6236317Y2 - - Google Patents
Info
- Publication number
- JPS6236317Y2 JPS6236317Y2 JP8216983U JP8216983U JPS6236317Y2 JP S6236317 Y2 JPS6236317 Y2 JP S6236317Y2 JP 8216983 U JP8216983 U JP 8216983U JP 8216983 U JP8216983 U JP 8216983U JP S6236317 Y2 JPS6236317 Y2 JP S6236317Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- conductor
- connection
- patterns
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 57
- 238000007747 plating Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8216983U JPS59187171U (ja) | 1983-05-31 | 1983-05-31 | 多層フレキシブル回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8216983U JPS59187171U (ja) | 1983-05-31 | 1983-05-31 | 多層フレキシブル回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59187171U JPS59187171U (ja) | 1984-12-12 |
JPS6236317Y2 true JPS6236317Y2 (es) | 1987-09-16 |
Family
ID=30212121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8216983U Granted JPS59187171U (ja) | 1983-05-31 | 1983-05-31 | 多層フレキシブル回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59187171U (es) |
-
1983
- 1983-05-31 JP JP8216983U patent/JPS59187171U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59187171U (ja) | 1984-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7286370B2 (en) | Wired circuit board and connection structure of wired circuit board | |
JPH046218Y2 (es) | ||
US3348990A (en) | Process for electrically interconnecting elements on different layers of a multilayer printed circuit assembly | |
US4931908A (en) | Housing for an electronic circuit | |
KR930020640A (ko) | 배선기판 조립체와 그 전기적 접합부 형성방법 | |
US4635093A (en) | Electrical connection | |
US4164071A (en) | Method of forming a circuit board with integral terminals | |
JPS6236317Y2 (es) | ||
JPH0582917A (ja) | フレキシブル配線板 | |
JP2889471B2 (ja) | フレキシブルプリント基板 | |
US4962287A (en) | Flexible printed wire board | |
JPH0219982Y2 (es) | ||
US3424854A (en) | Multilayer printed circuit with soldered eyelets forming the sole means joining the same | |
JPH05102621A (ja) | 導電パターン | |
JPS61166148A (ja) | 多層混成集積回路装置 | |
JPH01183192A (ja) | フレキシブルプリント配線板およびその製造方法 | |
KR20240133588A (ko) | 배선 회로 기판 | |
JPS5812464Y2 (ja) | 多層印刷配線板 | |
JPH0535589B2 (es) | ||
JPH062222Y2 (ja) | 多重基板回路モジュール | |
JP2594365B2 (ja) | 配線基板及び配線基板の接続方法 | |
JPS5927079Y2 (ja) | 配線板 | |
JPH0278253A (ja) | 多層プラスチックチップキャリア | |
JPH0524993Y2 (es) | ||
JPS6225858Y2 (es) |