JPS623578B2 - - Google Patents
Info
- Publication number
- JPS623578B2 JPS623578B2 JP58156260A JP15626083A JPS623578B2 JP S623578 B2 JPS623578 B2 JP S623578B2 JP 58156260 A JP58156260 A JP 58156260A JP 15626083 A JP15626083 A JP 15626083A JP S623578 B2 JPS623578 B2 JP S623578B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- patterns
- partial
- standard
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156260A JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156260A JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5651976A Division JPS52140278A (en) | 1976-05-19 | 1976-05-19 | Position detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5981769A JPS5981769A (ja) | 1984-05-11 |
| JPS623578B2 true JPS623578B2 (cg-RX-API-DMAC10.html) | 1987-01-26 |
Family
ID=15623906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58156260A Granted JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981769A (cg-RX-API-DMAC10.html) |
-
1983
- 1983-08-29 JP JP58156260A patent/JPS5981769A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5981769A (ja) | 1984-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4450579A (en) | Recognition method and apparatus | |
| JP2851151B2 (ja) | ワイヤボンディング検査装置 | |
| JPH07111998B2 (ja) | ワイヤボンディング検査装置 | |
| US20230215770A1 (en) | Semiconductor manufacturing apparatus, inspection apparatus, and manufacturing method for semiconductor device | |
| JP3235008B2 (ja) | ワイヤボンデイング部のボール検出方法及び検出装置 | |
| JPS6223457B2 (cg-RX-API-DMAC10.html) | ||
| JPS623578B2 (cg-RX-API-DMAC10.html) | ||
| JPS6223456B2 (cg-RX-API-DMAC10.html) | ||
| US6510240B1 (en) | Automatic detection of die absence on the wire bonding machine | |
| JP3822923B2 (ja) | ピックアップ装置及びチップ位置決め方法 | |
| JPS60227431A (ja) | ダイボンデイング状態の検査装置 | |
| KR100261605B1 (ko) | 칩 마운터용 고정도 화상 입력장치 | |
| JPH0770551B2 (ja) | 半導体チツプのダイボンデイング位置確認方法 | |
| JP2850641B2 (ja) | 半導体装置の製造方法および製造装置 | |
| JPS5867033A (ja) | ワイヤボンデイング方法 | |
| GB1592368A (en) | Automated manipulative operation system | |
| TW202601838A (zh) | 半導體製造裝置及半導體裝置之製造方法 | |
| JPH04315905A (ja) | 物体検査装置 | |
| KR100422277B1 (ko) | 화상처리방법 및 장치 | |
| JPH06102024A (ja) | ワイヤ検査装置及び検査方法 | |
| JP3006437B2 (ja) | 電子部品観察装置及び電子部品観察方法 | |
| KR19990010136A (ko) | 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식방법 | |
| CN120656965A (zh) | 半导体制造装置以及半导体器件的制造方法 | |
| JPH0732188B2 (ja) | 半導体装置の検査装置 | |
| JPS623577B2 (cg-RX-API-DMAC10.html) |