JPS6235595Y2 - - Google Patents

Info

Publication number
JPS6235595Y2
JPS6235595Y2 JP1981163600U JP16360081U JPS6235595Y2 JP S6235595 Y2 JPS6235595 Y2 JP S6235595Y2 JP 1981163600 U JP1981163600 U JP 1981163600U JP 16360081 U JP16360081 U JP 16360081U JP S6235595 Y2 JPS6235595 Y2 JP S6235595Y2
Authority
JP
Japan
Prior art keywords
welding
push
cap
rod
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981163600U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5871482U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981163600U priority Critical patent/JPS5871482U/ja
Publication of JPS5871482U publication Critical patent/JPS5871482U/ja
Application granted granted Critical
Publication of JPS6235595Y2 publication Critical patent/JPS6235595Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Die Bonding (AREA)
  • Resistance Welding (AREA)
JP1981163600U 1981-10-30 1981-10-30 溶接装置 Granted JPS5871482U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981163600U JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981163600U JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Publications (2)

Publication Number Publication Date
JPS5871482U JPS5871482U (ja) 1983-05-14
JPS6235595Y2 true JPS6235595Y2 (enrdf_load_html_response) 1987-09-10

Family

ID=29955891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981163600U Granted JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Country Status (1)

Country Link
JP (1) JPS5871482U (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS5871482U (ja) 1983-05-14

Similar Documents

Publication Publication Date Title
JPS63296398A (ja) 部品装着装置
JPS6235595Y2 (enrdf_load_html_response)
JP3132354B2 (ja) 導電性ボールの搭載装置および搭載方法
JP3408638B2 (ja) 電子部品移載装置
JPH02135131U (enrdf_load_html_response)
KR100325293B1 (ko) 반도체패키지의 볼 리페어를 위한 볼 마운팅 장치 및 이를 이용한 볼 마운트 방법
JP3187977B2 (ja) キャピラリの取り付け方法及びワイヤボンディング装置
JPS5832652U (ja) 半導体装置の製造装置
CN218706979U (zh) 一种模组入箱夹具及模组入箱设备
CN118253980B (zh) 一种装药组件保护帽自动装配装置
CN217647693U (zh) 一种连杆及防尘盖凸焊夹紧定位装置
CN222492686U (zh) 一种焊装夹具单元的限位块保护装置
JPS5854656A (ja) 半導体装置のキヤツプ封着方法
CN209803720U (zh) 一种嵌入式单板计算机芯片防护结构
JP3257409B2 (ja) 導電性ボールの搭載装置
CN209407703U (zh) 一种焊接用夹具及激光焊接装置
JPS6268231A (ja) コンプライアンス機構の制御装置
JPS6232712Y2 (enrdf_load_html_response)
JPS5932349U (ja) 平面研削装置におけるワ−クの装脱機構
JPS6066684U (ja) ウエルドナツトプロジエクシヨン溶接装置
CN118664210A (zh) 一种焊接机器人末端快焊机构
JPH07112110B2 (ja) フラツトリ−ド部品のリム−ブ方式
JPH0520830U (ja) 部品挿入組立装置
JPS5819023Y2 (ja) 孔付小物部品の抵抗溶接装置
CN118162934A (zh) 一种筒类锻件加工用自动夹持装置