JPS5871482U - 溶接装置 - Google Patents

溶接装置

Info

Publication number
JPS5871482U
JPS5871482U JP1981163600U JP16360081U JPS5871482U JP S5871482 U JPS5871482 U JP S5871482U JP 1981163600 U JP1981163600 U JP 1981163600U JP 16360081 U JP16360081 U JP 16360081U JP S5871482 U JPS5871482 U JP S5871482U
Authority
JP
Japan
Prior art keywords
welding
welding equipment
workpiece
push
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981163600U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235595Y2 (enrdf_load_html_response
Inventor
山下　武則
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981163600U priority Critical patent/JPS5871482U/ja
Publication of JPS5871482U publication Critical patent/JPS5871482U/ja
Application granted granted Critical
Publication of JPS6235595Y2 publication Critical patent/JPS6235595Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Die Bonding (AREA)
  • Resistance Welding (AREA)
JP1981163600U 1981-10-30 1981-10-30 溶接装置 Granted JPS5871482U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981163600U JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981163600U JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Publications (2)

Publication Number Publication Date
JPS5871482U true JPS5871482U (ja) 1983-05-14
JPS6235595Y2 JPS6235595Y2 (enrdf_load_html_response) 1987-09-10

Family

ID=29955891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981163600U Granted JPS5871482U (ja) 1981-10-30 1981-10-30 溶接装置

Country Status (1)

Country Link
JP (1) JPS5871482U (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS6235595Y2 (enrdf_load_html_response) 1987-09-10

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