JPS5993138U - 半導体素子用ボンダの送りレ−ル - Google Patents
半導体素子用ボンダの送りレ−ルInfo
- Publication number
- JPS5993138U JPS5993138U JP1982189338U JP18933882U JPS5993138U JP S5993138 U JPS5993138 U JP S5993138U JP 1982189338 U JP1982189338 U JP 1982189338U JP 18933882 U JP18933882 U JP 18933882U JP S5993138 U JPS5993138 U JP S5993138U
- Authority
- JP
- Japan
- Prior art keywords
- feed rail
- semiconductor devices
- lead frame
- bonder
- honda
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Registering Or Overturning Sheets (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の送りレールの断面図、第２図は従来の送
りレールの平面図、第３図は本考案に係る送りし・−ル
の断面図、第４図は本考案に係る送りレールの平面図で
ある。 １・・・櫛型リードフレーム、１０ａ、１０ｂ・・・送
りレール、１４・・・トンネル。
りレールの平面図、第３図は本考案に係る送りし・−ル
の断面図、第４図は本考案に係る送りレールの平面図で
ある。 １・・・櫛型リードフレーム、１０ａ、１０ｂ・・・送
りレール、１４・・・トンネル。
Claims (1)
- 櫛型リードフレームを用いる半導体素子用ホンダにおい
て、櫛型リードフレームを支えるホンダの送りレールを
、該リードフレームの頭部端と脚部端とをそれぞれ支え
る平行な２本の送りレールで構成し、リードフレームの
頭部端側支持用送りレール上でリードフレームの頭部端
を覆う部材内に不活性ガスを流動させるトンネルを形成
したことを特徴とする半導体素子用ホンダの送りレール
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982189338U JPS5993138U (ja) | 1982-12-15 | 1982-12-15 | 半導体素子用ボンダの送りレ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982189338U JPS5993138U (ja) | 1982-12-15 | 1982-12-15 | 半導体素子用ボンダの送りレ−ル |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5993138U true JPS5993138U (ja) | 1984-06-25 |
Family
ID=30408238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982189338U Pending JPS5993138U (ja) | 1982-12-15 | 1982-12-15 | 半導体素子用ボンダの送りレ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5993138U (ja) |
-
1982
- 1982-12-15 JP JP1982189338U patent/JPS5993138U/ja active Pending
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