JPS6235545A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To prevent a crack from occurring in a passivation film by forming a stress moderating member which is higher than the thickness of a semiconduc tor chip in the height outside the chip on a frame secured with the chip. CONSTITUTION:A molding resin 3 and a semiconductor chip 1 are both exposed to a high temperature at molding time, and both returned to a normal temperature after the chip 1 is resin-molded. Since the thermal expansion coefficient of the resin 3 is larger than the chip 1 at this time, the volumetric shrinkage of the resin 3 is larger than the chip 1 and the chip 1 is secured of the chip 1. This stress acts most largely at the corner of the chip 1. However, a stress moderating member 5 is provided at the corner of the chip 1 and the height is higher than the thickness of the chip 1, it performs to stop the shrinkage of the resin 3 which tends to shrink toward the center of the chip 1 to alleviate the stress applied to the chip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

FIG. 3 shows the configuration of a conventional resin-sealed semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a frame, 3 is a molding resin, and 4 is a bottle. In addition, in the right half of Figure 3,
Pins and bonding wires are not shown.

A semiconductor chip 1 is fixed to a frame 2.

On the other hand, the mold resin 3 is molded at a high temperature and then exposed to room temperature, so its volume shrinks.

Similarly, the semiconductor chip 1 is exposed to high temperatures during molding and then exposed to room temperature, but as described above, the semiconductor chip 1 is fixed to the frame 2, and the semiconductor chip 1
The coefficient of thermal expansion of the mold resin 3 is different from that of the semiconductor chip 1, and the coefficient of thermal expansion of the mold resin 3 is generally larger than that of the semiconductor chip 1. At the contact surface with the resin 3, a pressure cuff is applied parallel to the surface of the semiconductor chip 1 toward the center. This cuff is particularly large at the corner portions of the semiconductor chip 1. Therefore, a crank occurs in the passivation film on the semiconductor chip 1.

[Problem that the invention seeks to solve]

Conventional resin-sealed semiconductor devices are configured as described above, so stress is applied to the surface of the semiconductor chip due to the difference in thermal expansion coefficient between the semiconductor chip and the molding resin, and this stress causes the problem of cranking of the passivation film. was there.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a resin-sealed semiconductor device in which stress applied to the surface of a semiconductor chip is reduced.

[Means for Solving the Problems] The resin-sealed semiconductor device according to the present invention includes a stress relaxation member whose height is higher than the thickness of the semiconductor chip on the outside of the semiconductor chip on the frame to which the semiconductor chip is fixed. It was established.

[Effect]

In the present invention, the stress relaxation member relieves stress applied to the surface of the semiconductor chip.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. FIG. 1 shows a resin-sealed semiconductor device according to an embodiment of the present invention. In the figure, 1 is a semiconductor chip, 2 is a frame, 3 is a molding resin, 4 is a bottle, and 5 is a stress relaxation member. Note that the bottle and bonding wire are not shown on the right half of FIG. 1. A semiconductor chip 1 is fixed on a frame 2. Further, the stress relaxation member 5 is also fixed on the frame 2, but here a case is shown in which the stress relaxation member 5 is fixed perpendicularly to the frame 2. Furthermore, the height of the stress relaxation member 5 is higher than the thickness of the semiconductor chip 1.

Next, the effects will be explained.

During molding, both the mold resin 3 and the semiconductor chip 1 are exposed to high temperatures. After the semiconductor chip 1 is sealed with the mold resin, both the mold resin 3 and the semiconductor chip 1 return to room temperature. At this time, since the thermal expansion coefficient of the molding resin 3 is larger than that of the semiconductor chip 1, the volumetric contraction of the molding resin 30 is larger than that of the semiconductor chip 1, and since the semiconductor chip 1 is fixed to the frame 2, the semiconductor chip 1 Stress is about to be applied to the surface of This stress acts most strongly at the corner portions of the semiconductor chip 1. However, since the stress relaxation members 5 are provided at the corner portions of the semiconductor chip 1 and their height is higher than the thickness of the semiconductor chip 1, the mold resin tends to contract toward the center of the semiconductor chip 1. It plays a role in stopping the contraction of 3.
The stress applied to the semiconductor chip 1 is relaxed. Therefore, cranking of the passivation film due to this stress does not occur.

In addition, in the above embodiment, a case has been described in which the stress relaxation member is fixed perpendicularly to the frame, but it may be fixed so as to form an acute angle with the frame surface when viewed from the semiconductor chip side.

Further, in the above embodiment, the stress relaxation member is provided only at the corner portion of the semiconductor chip, but it may be provided at other portions, for example, as shown in FIG. A stress relieving member 6 may be provided to surround the.

〔Effect of the invention〕

As described above, according to the present invention, a stress relaxation member that is thicker than the semiconductor chip is provided on the outside of the semiconductor chip and is fixed to the frame, so that the stress applied to the surface of the semiconductor chip can be relaxed and the passivation It has the effect of preventing cranks from forming in the lower back.

[Brief explanation of the drawing]

FIG. 1 shows a resin-sealed semiconductor device according to an embodiment of the present invention, FIG. 2 shows a resin-sealed semiconductor device according to another embodiment of the invention, and FIG. 3 shows a conventional resin-sealed semiconductor device. FIG. 4 is a diagram showing the semiconductor device, and FIG. 4 is a diagram showing the application of stress. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Frame, 3... Mold resin, 5.6... Stress relaxation member. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (4)

[Claims] (1) In a resin-sealed semiconductor device in which a semiconductor chip and a frame are embedded in a mold resin, a stress relaxation member whose height is higher than the thickness of the chip is fixed to the frame and provided on the outside of the semiconductor chip. A resin-sealed semiconductor device characterized by: (2) The resin-sealed semiconductor device according to claim 1, wherein the stress relaxation member is fixed on the frame so as to form an acute angle with the surface of the frame when viewed from the semiconductor chip side. (3) The resin-sealed semiconductor device according to claim 1 or 2, wherein the stress relaxation member is provided outside a corner portion of the semiconductor chip. (4) The resin-sealed semiconductor device according to claim 1 or 2, wherein the stress relaxation member is provided on the entire outer periphery of the semiconductor chip.