JPS6235544A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To improve the reliability and to reduce the external appearance improper rate by forming a gas vent cutout on the peripheral edge of a hole on the upper surface of an outer case in a range that electrodes formed integrally with the case do not have defects, thereby eliminating storage of air and gas. CONSTITUTION:A gas vent cutout 9 is formed at the intermediate position between electrodes 3 by avoiding the positions of the electrodes 3 formed integrally with an outer case 4 at the peripheral edge of a hole on the upper surface of the case 4b. Accordingly, gas which is readily stored heretofore near this portion at resin filling time is escaped externally through the cutout 9 to eliminate the storage of the gas at the peripheral edge of the upper hole of the case 4b, thereby preventing an external appearance from becoming improper due to the gas which is diffused to the surface of the sealing resin and further preventing the reliability from decreasing due to this defect.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

FIG. 3 shows a perspective view of a resin-sealed semiconductor device using a conventional type outer case integrally molded with a terminal. Further, FIG. 4 is a cross-sectional perspective view showing the internal structure of the cross section ρ) taken along line IV-f'/ in FIG. 3.

In both figures, (1) is the semiconductor chip, (2) is the aluminum wire, (3) is the electrode terminal with an S-shaped bend and integrally molded with the case, which will be described later, and (4a) is the outer case.

(5) is a support plate forming the module body, (6) is a sealing resin, and (7) is a gel for protecting the semiconductor nap (1) and aluminum wire (2).

The order of assembly of the semiconductor device module in this example will be briefly explained. First, the semiconductor chip (1) on the support plate is brazed. Furthermore, this semiconductor chip (1) and the support plate (
5) The wiring pattern 7 formed on the aluminum wire (2
) and are connected and bonded with wire bonds.

After this, the exterior case (
4a), the J pole and the case are simultaneously brazed and bonded to the support plate (5).

After that, the gel (7) for protecting the aluminum wire (2) is press-fitted from the opening on the top of the case (4&), and after the gel (7) is turned into a CD, the resin (6) is press-fitted. .

[Problems that Zu6mei aims to solve] As mentioned above, the resin is usually press-fitted through an opening in the center of the case and spreads to the periphery (or if the outer case is thin). In this case, or especially when the 4-pole terminal is integrally molded with the thin case I, the conventional rectangular opening does not cover the periphery of the case or the part between the side surface of the case and the t-pole terminal (the (indicated by A in Figure 1) tends to become a closed space, and air tends to remain trapped even when resin is press-fitted.

The gas generated during heating and curing of pepper and sesame oil also tends to accumulate in the P part. This state is shown in FIG. 5 as a sectional view of the upper part, and (8) is the stored gas.

If you heat the resin in this condition to harden it.

Due to the expansion of the accumulated air and the further generation of gas,
Finally, during heating, gas air flows through the inner surface of the case,
As a result of this gas reaching the opening of the case and blowing out, gas is generated on the surface of the sealing resin, causing major problems in terms of appearance and reliability.

This invention was made in order to solve the problems mentioned above, and as mentioned above, the fj air and gas storage is
An object of the present invention is to obtain a semiconductor device that can improve reliability and reduce appearance defects.

[Means for solving problems]

In the semiconductor device according to the present invention, a gas venting notch is provided at the periphery of the opening on the upper surface of the outer case, within a range of one part that interferes with the shield 1r integrally molded with the case.

[For production]

In this invention, gas venting notches are provided on the four edges of the opening at the top of the front of the exterior case, so air can escape easily when the resin is press-fitted from the opening, and fluids can be removed when the resin hardens. The generated gas also quickly escapes from the opening to the outside, and the generation of bubbles on the surface of the seal 4 reduces defects in appearance and improves reliability.

〔Example〕

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view from the Wr plane showing the internal structure taken along the line If-ffI in FIG. 1, and FIG. The same reference numerals as those in the conventional example shown in FIG. 4 indicate equivalent parts, and redundant explanation thereof will be avoided.

In the exterior case (4b) in Example 4, the electrodes (3), which are integrated with the case (4b), are placed on the periphery of the opening on the top surface, avoiding the position of the electrodes (3), and between the electrodes (3). A gas venting hole (9) is provided in the middle part.

Therefore, the gas that conventionally was easily stored near this part escapes to the outside of the case (4) through this cutout (9).
b) Gas will no longer accumulate around the periphery of the upper opening, thereby preventing appearance defects due to gas blowing out on the sealing resin surface and the resulting deterioration in reliability. Can be done.

In the above embodiment, a case was explained in which an external case with several electrode terminals was used, but the present invention can also be applied to the case where a thin external case is used, and similar effects can be expected.

〔Effect of the invention〕

As described above, according to the present invention, a gas venting notch is provided at the periphery of the opening on the upper surface of the outer case of a resin-sealed semiconductor device, so that gas is not stored in the upper periphery of the outer case. Therefore, the occurrence of appearance defects due to the blowing of these gases is reduced, and the reliability of the semiconductor device is improved.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a perspective view showing the outline of an embodiment of the present invention;
The figure is a cross-sectional perspective view taken from the line ■-■ in Fig. 1, Fig. 3 is a perspective view showing the external appearance of a conventional resin-sealed semiconductor device, and Fig. 4 is a perspective view taken from the line ■-■ in Fig. 3. FIG. 5 is a partial cross-sectional view showing the state of gas storage in the conventional device. In Figure 2, [1] is the semiconductor chip, (3) is the IE electrode terminal (4b) is the outer case, (6) is the sealing resin, (9)
is a gas vent notch. Note that the same reference numerals in the figures indicate the same or equivalent parts. Figure 1 Figure 2! Semiconductor) book + 7゜3, electrode clapper 46θ, actuator lee again 6, seal #f fat de, ri (I book 4 years old barley piece 91z) missing capital Fig. 3 Fig. 4 Fig. 5

Claims (3)

[Claims] (1) A semiconductor chip is placed inside an outer case having an opening at the top, and a resin is press-fitted into the outer case,
A resin-sealed semiconductor device comprising the semiconductor chip sealed with a resin, wherein a gas venting notch is provided at a peripheral edge of the opening of the outer case. (2) The external case has electrode terminals integrally molded,
2. The resin-sealed semiconductor device according to claim 1, wherein the gas venting notch is provided in a portion that does not interfere with the electrode terminal. (3) The resin-sealed semiconductor device according to claim 1, wherein the outer case is a thin outer case.