JPS63226948A - Hybrid integrated device - Google Patents

Abstract

PURPOSE:To enhance the integration density without expanding an external shape by a method wherein a separate hybrid integrated circuit is constituted and a connecting electrode is installed at the inside face of a lid while another connecting electrode is installed at a package so that both connecting electrodes can be connected to each other by an airtight sealing operation of the lid and the package. CONSTITUTION:At a hybrid integrated device where a hybrid integrated circuit is constituted at an inside bottom 3a of a package 3 and the upper part is sealed airtightly by a lid 7, a separate hybrid integrated circuit is constituted at an inside face of the lid, and connecting electrodes 9 are installed; connecting electrodes 5 are also installed at the package 3; when the lid 7 and the package 3 are sealed airtightly, both connecting electrodes 9, 5 are connected mutually. For example, after individual prescribed electronic components have been connected to wiring patterns at an inside bottom 3a of the package 3 and other wiring patterns at an inside face 7a of the lid 7, a solder ring 6 is brought into coincidence with 9 stepped part 3b of the package 3. Then, the lid 7 is positioned and is put on the upper face of the solder ring 6; after that, the solder ring 6 is melted by heating; electrodes 4 and 8 for airtightness use and the connecting electrodes 5 and 9 are molten-bonded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a hybrid integrated device with an improved degree of integration.

[Prior art]

Conventionally, a hybrid integrated circuit has been constructed by mounting and connecting circuit components such as semiconductor elements on the bottom surface 1a of a package body 1 on which a wiring pattern is formed, as shown in FIG.
The structure is hermetically sealed. Therefore, the degree of integration is determined only by the size of the bottom surface 1a, and to increase it, it is necessary to increase the size of the package body 1 itself, which necessitates an increase in the external size.

[Purpose of the invention]

An object of the present invention is to provide a hybrid integration device that can improve the degree of integration without increasing the external size.

[Structure of the invention]

To this end, the present invention provides a hybrid integrated device in which a hybrid integrated circuit is formed on the inner bottom of a package body and the top surface is hermetically sealed with a lid, in which another hybrid integrated circuit is formed on the inner surface of the lid, and connection electrodes are provided. , and the package body is also provided with connection electrodes, and the two connection electrodes are connected to each other by hermetically sealing the lid to the package body.

〔Example〕

Examples of the present invention will be described below. 1 to 4 are diagrams for explaining one embodiment of the present invention.

Reference numeral 3 designates a pan cage main body, which has a wiring pattern for mounting and connecting electronic components on its concave inner bottom 3a, and has a wiring pattern on the outer corner of the upper step 3b of the wall surrounding the inner bottom 3a. A hermetic sealing electrode 4 is formed over the same, and a group of connection electrodes 5 drawn out from the inner bottom 3a are formed in an appropriate arrangement inside the electrode 4 in the same step portion 3b.

Reference numeral 6 denotes soldering, which is made of a solder plate with paste, and includes an airtight sealing part 6a with an outer shape corresponding to the airtight sealing electrode 4 of the upper step part 3b, and a position and outer shape corresponding to the connection electrode group 5. It is composed of a connecting electrode part 6b and a connecting part 6C that connects the connecting electrode part 6b to the hermetically sealing part 6a.

Reference numeral 7 denotes a lid for sealing the upper surface of the package body 3, and a wiring pattern for mounting and connecting electronic components is formed on its inner surface 7a. Around the inner surface 7a, a hermetically sealed electrode 8 having a shape corresponding to the hermetically sealed electrode 4 described above and a connection electrode group 9 connected to the wiring pattern on the inner surface are provided.
is formed. The arrangement of each electrode in this connection electrode group 9 corresponds to each electrode in the connection electrode group 5 of the package body 4 described above.

Now, in assembling, after connecting the predetermined electronic components to the wiring pattern on the inner bottom 3a of the package body 3 and the wiring pattern on the inner surface 7a of the lid 7, the solder ring 6 is aligned with the step 3b of the package body 3. let At this time, positioning is performed so that the connection electrode portion 6b of the solder ring 6 matches the connection electrode 5 of the pan cage body 3. Further, at this time, the hermetic sealing portion 6a of the solder ring 6 matches the hermetic sealing electrode 4 of the pan cage body 3.

Next, the M7 is positioned so that the individual electrodes of the connection electrode group 9 correspond to the individual electrodes of the connection electrode group 5 of the buff cage main body 3, and then placed on the upper surface of the solder ring 6.

Then, when heat is applied after this, the solder ring 6 melts and the corresponding ones of the airtight electrodes 4 and 8 and the connection electrode groups 5 and 9 are welded together, and at this time, the connecting part 6C of the solder ring 6 is melted and cut. Therefore, the connection electrode portion 6b is separated from the hermetic sealing portion 6a.

Therefore, the circuit formed on the inner bottom 3a of the package body 3 and the circuit formed on the inner surface 7a of M7 are connected to the connection electrode group 5.
and 9, and the entire periphery of the connected portion is sealed by hermetically sealed electrodes 4 and 8.

In addition, in the hybrid stacking device of this embodiment, it is necessary to fit the lid 7 into the package body 3 at an accurate position, but this can be done by providing a positioning part with a convex part and a concave part between them, or by - Alternatively, the lid 7 may be formed into a directional shape such as an asymmetrical or trapezoidal shape so that it fits into the stepped portion 3b of the package body 3 only in a specific direction.

〔Effect of the invention〕

As described above, according to the present invention, a hybrid integrated circuit can also be formed on the inner surface of the lid, so that the degree of integration can be significantly improved even if the size is the same as that of the conventional one.

[Brief explanation of drawings]

FIG. 1 is an exploded explanatory view of a hybrid integration device according to an embodiment of the present invention, FIG. 2 is a plan view of the inner surface of the lid of the same embodiment, FIG. 3 is a plan view of soldering of the same embodiment, and FIG. This figure is a plan view of the package body of the same embodiment, and FIG. 5 is an explanatory diagram of a conventional hybrid integration device. DESCRIPTION OF SYMBOLS 1... Package main body, 2... Lid, 3... Package main body, 4... Hermetically sealed electrode, 5... Connection electrode group, 6... Soldering, 7... Lid, 8... Hermetic sealing electrode, 9... Connection electrode group. Agent Patent Attorney Tsuneaki Nagao Figure 3, Figure 4

Claims (1)

[Claims] (1). In a hybrid integrated device in which a hybrid integrated circuit is configured on the inner bottom of a package body and the top surface is hermetically sealed with a lid, another hybrid integrated circuit is configured on the inner surface of the lid, and connection electrodes are provided, and also on the package body. A hybrid integrated device characterized in that a connection electrode is provided, and the two connection electrodes are connected to each other by hermetically sealing the lid to the package body.