JPS6235261B2 - - Google Patents
Info
- Publication number
- JPS6235261B2 JPS6235261B2 JP22201183A JP22201183A JPS6235261B2 JP S6235261 B2 JPS6235261 B2 JP S6235261B2 JP 22201183 A JP22201183 A JP 22201183A JP 22201183 A JP22201183 A JP 22201183A JP S6235261 B2 JPS6235261 B2 JP S6235261B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- jig
- rod
- extraction rod
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 37
- 230000037431 insertion Effects 0.000 claims description 37
- 235000012431 wafers Nutrition 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000000605 extraction Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 18
- 239000000428 dust Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22201183A JPS59130420A (ja) | 1983-11-28 | 1983-11-28 | 熱処理治具の插入取出し装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22201183A JPS59130420A (ja) | 1983-11-28 | 1983-11-28 | 熱処理治具の插入取出し装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4445677A Division JPS53129964A (en) | 1977-04-20 | 1977-04-20 | Method and device for inserting and taking out of heat treatment jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59130420A JPS59130420A (ja) | 1984-07-27 |
| JPS6235261B2 true JPS6235261B2 (OSRAM) | 1987-07-31 |
Family
ID=16775705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22201183A Granted JPS59130420A (ja) | 1983-11-28 | 1983-11-28 | 熱処理治具の插入取出し装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59130420A (OSRAM) |
-
1983
- 1983-11-28 JP JP22201183A patent/JPS59130420A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59130420A (ja) | 1984-07-27 |
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