JPS6233351Y2 - - Google Patents
Info
- Publication number
- JPS6233351Y2 JPS6233351Y2 JP18646981U JP18646981U JPS6233351Y2 JP S6233351 Y2 JPS6233351 Y2 JP S6233351Y2 JP 18646981 U JP18646981 U JP 18646981U JP 18646981 U JP18646981 U JP 18646981U JP S6233351 Y2 JPS6233351 Y2 JP S6233351Y2
- Authority
- JP
- Japan
- Prior art keywords
- support frame
- insulating support
- conductive
- wiring
- conductive lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004080 punching Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18646981U JPS5892760U (ja) | 1981-12-14 | 1981-12-14 | 電気回路配線体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18646981U JPS5892760U (ja) | 1981-12-14 | 1981-12-14 | 電気回路配線体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5892760U JPS5892760U (ja) | 1983-06-23 |
| JPS6233351Y2 true JPS6233351Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-26 |
Family
ID=29988439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18646981U Granted JPS5892760U (ja) | 1981-12-14 | 1981-12-14 | 電気回路配線体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5892760U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1981
- 1981-12-14 JP JP18646981U patent/JPS5892760U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5892760U (ja) | 1983-06-23 |