JPS6232603A - Method of laminating sheet-type electronic parts - Google Patents

Abstract

PURPOSE:To improve lamination productivity and to stabilize and improve parts quality by adopting a process wherein the sheet on which sheet-type electronic parts are arranged is bonded to an adhesive sheet, and, in addition, a process wherein sheet-type electronic parts are punched and taken out. CONSTITUTION:A number of sheet-type electronic parts 2 such as coils, are arranged on a large sheet 1. An adhesive sheet 3 made of an insulating film is formed by providing adhesive layers 5 and 6 coated with the epoxy resin adhesive on both sides of a PET film 4, and by forming a cover film 7 used as a releasing paper on the adhesive layer 5. A single coil is obtained by laminating the large sheet 1 and adhesive sheet 3, heating and pressing them, and then punching the coil 2 together with the sheet to which the adhesive sheet is bonded. Furthermore, the adhesive agent is hardened by heating and pressing it after removing the releasing paper from the single laminated coil, and placing the second sheet-type electronic parts thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is directed to bonding a first sheet-shaped electronic component such as a sheet-shaped coil conductor to a second sheet-shaped electronic component such as a sheet-shaped coil through an insulating adhesive layer. conductor.

The present invention relates to a method of laminating sheet-like electronic components on a yoke plate or a printed circuit board while maintaining an electrically insulated state.

[Prior art] When laminating two sheet-like electronic components in this way, conventionally, adhesive was applied to both sides of the PE↑ film, and a cover film made of release paper was placed on one of the adhesive layers. The adhesive sheet is cut out into the shape of individual sheet-shaped electronic components, for example, a coil shape, and the cut-out bone-bonding sheet is adhered to each individual sheet-shaped electronic component.Then, the release paper is peeled off to form a second sheet. pasted with electronic components,
A method is used in which both sheet-like electronic components are laminated by heating and pressurizing the adhesive layer to cure it.

However, in this lamination method, the adhesive sheet is cut out to fit each individual sheet-like quasi-chip component and pasted onto the sheet-like electronic component one by one. Coupled with the fact that it is necessary to punch out the adhesive sheet, and it is inconvenient to handle the adhesive sheet after cutting out, productivity is low, and the adhesive sheet is easily stuck together, which may cause the PET to be cut out. Sometimes the film protrudes from the edges.

[Problems to be Solved by the Invention] Therefore, an object of the present invention is to provide a sheet-shaped electronic component that eliminates the drawbacks mentioned above, improves the productivity of lamination, and uniformizes and improves the quality. The purpose is to propose a lamination method.

[Means for Solving the Problems] In order to achieve such an object, the first embodiment of the present invention provides a method in which an adhesive is applied to both sides of a sheet on which sheet-like electronic components are arranged and an insulating film. .

It is characterized by comprising the steps of bonding and adhering an adhesive sheet with release paper on one side of the adhesive layer, and punching out a sheet-like electronic component from the bonded sheet.

A second embodiment of the present invention includes a sheet in which the first sheet-like electronic components are arranged, and an adhesive sheet in which an adhesive is applied to both sides of an insulating film and a release paper is applied to one of the adhesive layers. A step of pasting and gluing, a step of punching out a first sheet-like electronic component from the pasted sheets, and a step of peeling off the release paper from the punched first sheet-like electronic component and forming a second sheet-like electronic component. It is characterized by comprising a process of bonding electronic components together.

[Function] According to the present invention, since the electronic component and the adhesive sheet are pasted together and then punched out, there is no need for two punching processes as in the past, and the individually punched coil and adhesive sheet can be combined. Since there is no need for the trouble of pasting them together, the productivity of lamination is improved, and since they are pasted together and then punched out, the positional accuracy of the pasting is also high, and the quality of the laminate is improved.

[Example] The present invention will be described in detail below with reference to the drawings.

FIG. 1 shows an example of a large sheet in which a large number of sheet-like electronic components such as coils are formed by etching, plating, CVO, etc. and arranged. Here, 1 is a large sheet, and 2 is a large number of sheet-shaped electronic components, such as coils, arranged on this sheet.

FIG. 2(A) shows a roll 3 of an adhesive sheet. As shown in FIG. 2(B), this adhesive sheet is made by applying an epoxy adhesive to both sides of an insulating film, for example, a PET film 4. Adhesive layers 5 and 6 are provided, and a cover film 7 made of release paper is adhered onto one of the adhesive layers 5. An example of such an adhesive sheet is I manufactured by Three Pond Company.
Ei52 (the thickness of the PET film 4 is 10 g, m) can be used.

In the present invention, as shown in FIG. 3, the large-sized sheet l shown in FIG. 1 and the adhesive sheet 3 shown in FIGS. The laminating process can be carried out using a normal commercially available laminator, for example, using a two-roll type laminator at a temperature of 100°C.
C., a feed rate of 1 m/min, and a laminator air cylinder pressure of 3.5 kg/c2.

Next, the coil 2 is punched out from the adhesive sheet pasted together to obtain a single coil. According to this, there is no need to separately punch out the coil and the adhesive sheet as in the conventional method, and the adhesive sheet does not shift from the coil, so the positioning accuracy is greatly improved compared to the conventional method.

Furthermore, peel off the release paper from the single bonded coil,
As shown in FIG. 4, a single second sheet electronic component,
For example, it is bonded to a coil, yoke plate or printed circuit board and then heated.

Apply pressure to harden the adhesive.

Here, the curing process can be divided into two stages, in which heating and pressurization are performed in preliminary curing, and only heating is performed in the subsequent main curing. For example, precuring is performed at a temperature of tSO°C and a pressure of 0. The main curing was carried out at a temperature of 150° C. for 1.5 hours.

Note that the punching pattern shapes are generally different between the first and second electronic components, so it is not possible to stack them and then punch them in the same pattern. As shown, the punching of the first electronic component to which the adhesive sheet is attached and the punching of the second electronic component are performed separately, and then the two are attached and laminated. However, if both patterns match, it is of course possible to paste them together and then punch them out.

[Effects of the Invention] As is clear from the above, according to the present invention, since the electronic component and the adhesive sheet are pasted together and then punched out, two punching steps unlike the conventional method are not required, and
Since there is no need to attach the individually punched coils to the 1/adhesive sheet, the productivity of lamination is improved, and since the coils are pasted together and then punched out, the positional accuracy of the lamination is also high, and the laminated body is The quality of the product will improve. Moreover, since the large-sized sheet and the adhesive sheet are laminated together in the present invention, there is an advantage that the lamination process can be mechanized using an ordinary laminator or the like.

[Brief explanation of the drawing]

Figure 1 is a plan view showing a series of large sheets, Figure 2 (A)
2(B) is a diagram showing a roll of adhesive sheet, FIG. 2(B) is a cross-sectional view showing an enlarged part of the roll, and FIGS. 3 and 4 are cross-sectional views for explaining the steps in the present invention. DESCRIPTION OF SYMBOLS 1... Large sheet, 2... First electronic component (coil), 3... Roll of adhesive sheet, 4... PET film, 5, 6... Adhesive layer, 7... Release paper , 8... Second ML child part. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Scope of Claims] 1) A sheet in which sheet-like electronic components are arranged is pasted together with an adhesive sheet in which an adhesive is applied to both sides of an insulating film and a release paper is attached to one side of the adhesive layer. 1. A method for laminating sheet-like electronic components, comprising the steps of adhering, and punching out the sheet-like electronic component from the bonded sheet. 2) A step of bonding together the first arranged sheet of sheet-like electronic components and an adhesive sheet in which an adhesive is applied to both sides of an insulating film and a release paper is attached to one of the adhesive layers. a step of punching out the first sheet-like electronic component from the pasted sheets, and peeling off the release paper from the punched first sheet-like electronic component and pasting the second sheet-like electronic component. A method for laminating sheet electronic components, characterized by comprising a step of combining.