JP2625367B2 - Method for manufacturing multilayer wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board, and more particularly to a method for manufacturing a ceramic multilayer wiring board used in a large-sized computer.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication (Kokai) No. 63-173391 is provided in order to prevent a dimensional deviation between an inner layer circuit pattern and a through hole in response to demands for higher density and higher multilayer. There is disclosed a technique for inserting a reference pin into one of the openings provided.

[0003]

In the conventional method of manufacturing a multilayer wiring board, there is no particular problem when the board size is small or the through hole diameter and through hole pitch are large. When this becomes necessary, it appears in the form of poor lamination accuracy. In particular, at this time, the thickness of the green sheet becomes thin, so that it is difficult to handle the green sheet alone.

[0004]

According to the method for manufacturing a ceramic multilayer wiring board of the present invention, a step of uniformly applying an adhesive to the entire surface of a green sheet before laminating is performed, and the first green sheet as a reference and a camera are used. The method includes a step of aligning and inserting into a guide pin in a lamination mold to perform temporary bonding, and a step of cutting the green sheet after the temporary bonding. Further, in the case of a process in which printing is performed with the protective film adhered, there is a step of peeling the protective film after cutting the green sheet.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1A, the pre-process of one embodiment of the present invention is as follows. That is, the carrier film used for film formation is used as it is as the protective film 1 and is attached to the stainless steel frame 2 to form a through hole. Then, after filling with the conductive paste, the pattern is printed. As a preparation for laminating the green sheet having this configuration into the lamination mold 3, the silicon-coated surface of the polyethylene film having one surface coated with silicon is adhered to the stainless steel frame 2 with an adhesive. Four through holes are formed in the polyethylene film for positioning and inserting the guide pins 4. The adhesive is uniformly applied to the entire surface of the lower mold 5 of the multilayer mold 3. The through hole formed in the prepared polyethylene film and the guide pin 4 coming out of the lower mold 5 are aligned by the camera 6. When the positioning is completed, the lower mold 5 is gradually raised, and the guide pins 4 are inserted into the through holes. Next, the lower mold 5 and the polyethylene film are brought into close contact with each other and cut. Preparation of the lamination mold 3 is thus completed.

Next, an adhesive which is completely thermally decomposed up to about 500 ° C. is uniformly applied to the pattern printing surface of the green sheet of FIG. 1A by a spraying method as shown in FIG. At this time, the coating thickness is controlled to 10 μm or less. The preparation of the green sheet is also completed in the adhesive application step shown in FIG. First, the lower mold 5 of the prepared laminated mold 3
Is about 2 to 3 mm lower than the upper surface of the sheet cutting blade.

Referring to FIG. 1C, a green sheet to which an adhesive is applied is set thereon, and the position of a through hole for positioning and inserting a guide pin 4 and the position of the camera 6 are aligned.

Referring to FIG. 1D, after the positioning is completed, the lower mold 5 is gradually raised, inserted into the through hole, and the green sheet and the lower mold 5 are brought into close contact with each other.

Referring to FIG. 1E, in this state, the upper mold 7 of the laminated mold 3 is lowered, the green sheet is cut, and pressure is applied by the upper mold 7 to separate the polyethylene film and the green sheet. Glued.

Referring to FIG. 1F, after bonding, the upper mold 7 is formed.
And the protective film 1 stuck on the green sheet is peeled off using the adhesive roll 8. The second and subsequent green sheets are similarly laminated.

[0012]

As described above, the present invention employs a laminating method of positioning, fixing the green sheet to a reference green sheet as it is, and then cutting it. Can be manufactured.

[Brief description of the drawings]

FIG. 1 is a flowchart showing an embodiment of the present invention.

FIG. 2 is a view for explaining the adhesive application method shown in FIG. 1 (B).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Protective film 2 Stainless steel frame 3 Lamination mold 4 Guide pin 5 Lower mold 6 Camera 7 Upper mold 8 Adhesive roll

Claims (2)

(57) [Claims] 1. A flexible film is adhered to one main surface.
An adhesive application step of uniformly applying an adhesive on the other main surface of the green sheet, and the green sheet applied in the adhesive application step .
The adhesive application surface and the lamination mold are opposed to each other for alignment.
And aligning temporary bonding step of inserting is temporarily adhered to the guide pin provided on the stacked die after a cutting step of cutting the temporarily bonded green sheets in this alignment temporary bonding step to a predetermined size, From the green sheet cut in this cutting step
And a peeling step of peeling the flexible film . 2. The position of the through hole of the first laminated green sheet is confirmed by a camera in the alignment temporary bonding step, the camera is fixed, and the second and subsequent green sheets are fixed by the camera. 2. The method for manufacturing a multilayer wiring board according to claim 1, wherein the stacking is performed by inserting into the guide pins.