JPH0555757A - Manufacture of multilayer ceramic electronic component - Google Patents

Abstract

PURPOSE:To make it possible to laminate ceramic green sheets with high accuracy in a method of manufacturing multilayer ceramic electronic components provided with a ceramic multilayer body where a viahole is made. CONSTITUTION:When a ceramic green sheet 11 is in a stage of a composite backed with a carrier film 12, a through hole 14, which is designed to be a viahole, is formed and filled with conductive paste 18. Since then, a punched ceramic green sheet 11a is peeled off from the carrier film 12 and superposed on one another.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic electronic component, which comprises a ceramic laminated body in which a plurality of ceramic layers are laminated, and a via hole is provided in a specific ceramic layer. The present invention relates to a method for producing a laminated ceramic electronic component, which is characterized by a method for obtaining a ceramic laminate.

[0002]

2. Description of the Related Art As an example of a monolithic ceramic electronic component,
There are ceramic multilayer substrates. FIG. 7 shows a conventional method for manufacturing a ceramic multilayer substrate.

In FIG. 7, first, as shown in (1), a ceramic green sheet 1 is prepared. The ceramic green sheet 1 is lined with a carrier film 2 made of, for example, polyethylene terephthalate or polypropylene, and is wound around a reel 3. In order to form the ceramic green sheet 1 on the carrier film 2, for example, a doctor blade, a reverse roll coater or the like is used.

Next, as shown in (2), the ceramic green sheet 1 is peeled from the carrier film 2.

Next, as shown in (3), a punching die (not shown) is applied to the ceramic green sheet 1, and the ceramic green sheet 1a having a predetermined size is taken out by punching.

Next, as shown in (4), the through hole 4 to be a via hole is formed in the ceramic green sheet 1a.
Is provided. For forming the through hole 4, for example, a drill, punching, a laser or the like is used.

Next, as shown in (5), the ceramic green sheet 1a is positioned on the printing stage 5 having the function of vacuum suction, and is electrically conductive in the through hole 4 by screen printing using the screen 6, for example. While being filled with the paste, a conductive film having a predetermined pattern is formed on the ceramic green sheet 1a.

Next, as shown in (6), the conductive film 7 and the like formed on the ceramic green sheet 1a is dried.

Next, as shown in (7), a plurality of types of ceramic green sheets 1a are stacked on the stacking stage 8 in a predetermined order.

Next, as shown in (8), the obtained ceramic laminate 9 is pressed. Next, as shown in (9), the ceramic laminate 9 is cut, thereby obtaining a chip 10 for a plurality of multilayer substrates. After that, the chip 10 is baked, and a desired conductive film is formed on the outer surface of the chip 10 as needed, whereby a desired multilayer substrate is obtained.

[0011]

However, in the above-mentioned conventional manufacturing method, the ceramic green sheet 1a shrinks from the printing step of FIG. 7 (5) to the drying step of (6), and the shrinking thereof also occurs. Also, the dimensions are likely to vary. Therefore, in the stacking step (7), stacking deviation may occur, or in the cutting step (9), the cutting position may shift. These deviations cause the conduction failure due to the via hole, the defective capacitor, and the like.

[0012] Therefore, an object of the present invention is to provide a method for manufacturing a monolithic ceramic electronic component in which the above-mentioned deviation is unlikely to occur.

[0013]

According to the present invention, there is provided a ceramic laminate in which a plurality of ceramic layers are laminated, at least one of the ceramic layers is provided with a via hole, and the via holes are connected to each other through the via hole. The present invention is directed to a method for manufacturing a laminated ceramic electronic component, in which at least two conductive films are provided on each of the corresponding ceramic layers, and in order to solve the above-mentioned technical problem, in brief, While the ceramic green sheet is lined with a carrier film, a through hole that should be a via hole is provided, a conductive paste is applied in the through hole, and a conductive film is formed on the corresponding ceramic green sheet so that a conductive film is formed. It is characterized by printing a conductive paste.

That is, in the method for manufacturing a monolithic ceramic electronic component according to the present invention, a composite body comprising a ceramic green sheet to be the ceramic layer and a carrier film lining the ceramic green sheet is prepared to form the via hole. Providing through-holes in the composite, applying a conductive paste in the through-holes, printing a conductive paste on the corresponding ceramic green sheet so that the conductive film is formed, then, the ceramic green sheet Each step of peeling from the carrier film and then stacking.

[0015]

According to the present invention, a through hole to be a via hole is provided, and then a conductive paste is applied in the through hole,
Since the steps until the conductive film is formed by printing are performed while being lined with the carrier film, it is possible to prevent the ceramic green sheet from shrinking due to drying. Moreover, it is possible to reduce variation in the dimensions of the ceramic green sheet due to shrinkage. With respect to this variation, as a practical example, it has been about 200 μm in the past, but according to the present invention, it can be reduced to about 30 μm.

[0016]

As described above, according to the present invention, the shrinkage of the ceramic green sheets to be stacked is suppressed by the carrier film, so that the variation in shrinkage dimension can be reduced, so that the stacked ceramic green sheets are stacked. The accuracy can be increased. Therefore, it is possible to suppress the conduction failure of the via hole and the occurrence of variations in other electrical characteristics.

[0017]

1 to 6 show a method of manufacturing a ceramic multilayer substrate according to an embodiment of the present invention.

As shown in FIG. 1, first, a composite 13 in which a ceramic green sheet 11 is lined with a carrier film 12 is prepared. Carrier film 1
2 is composed of, for example, a film of polyethylene terephthalate, polypropylene or the like. The ceramic green sheet 1 is formed on the carrier film 12 by a doctor blade or a reverse roll coater.
1 is molded.

Next, as shown in FIG.
A through hole 14 for a via hole having a diameter of about 0.3 mm is provided by applying a laser, punching, an NC drill, or the like. At this time, a positioning hole 15 having a diameter of about 0.5 mm for positioning
Is also provided by a similar method. Both the through hole 14 and the positioning hole 15 pass through both the composite 13, that is, the ceramic green sheet 11 and the carrier film 12.

Next, as shown in FIG. 3, the longitudinal composite 1
3 is positioned on the printing stage 17 having a vacuum suction function while being intermittently fed in the direction of arrow 16. Here, the conductive paste 18 is applied to the ceramic green sheet 11 by printing based on the position of the positioning hole 15. For this printing, for example, screen printing using the screen 19 is applied.

FIG. 4 shows a state in which the conductive paste 18 is filled in the through holes 14 by the printing described above. As shown in FIG. 4, the conductive paste 18 is preferably applied not only to the portion of the through hole 14 surrounded by the ceramic green sheet 11 but also to the carrier film 1 of the through hole 14.
It is set so that the portion surrounded by 2 is filled.

Next, after the conductive paste 18 is dried,
As shown in FIG. 5, the composite 13 is intermittently fed in the direction of the arrow 20, and is positioned on the cutting stage 21 with the position of the positioning hole 15 as a reference. In this state, the cutting head 22 operates as shown by the arrow 24a. The cuttic head 22 has a cutting blade 23 around it, and the ceramic green sheet 11
Punch out. Further, the cutting stage 21 and the cutting head 22 have a vacuum suction function as shown by arrows 24 and 25, respectively, and when the cutting head 22 moves upward, the punched ceramic green sheet 11a is used as a carrier. The ceramic green sheet 11a is held while being peeled off from the film 12. The ceramic green sheets 11a held by the cutting head 22 are carried to the stacking stage 26, where they are sequentially stacked.

FIG. 6 shows a ceramic green sheet 11
The state after a has been peeled from the carrier film 12 is shown. By selecting the viscosity of the conductive paste 18 so that the conductive paste 18 remains on the side of the carrier film 12 when peeled off in this way, it is possible to surely obtain conduction by the via hole 27 provided in the ceramic green sheet 11a. You can

The ceramic green sheet 1 having the via holes 27 thus filled with the conductive paste 18
At least two conductive films connected to each other through at least one via hole 27 are formed in the ceramic laminate obtained by laminating 1a with other ceramic green sheets. This ceramic laminated body is fired into a sintered body, and then a conductive film is formed on the outer surface, if necessary, to obtain a desired ceramic multilayer substrate.

The stacking of the ceramic green sheets 11a carried out on the stacking stage 26 of FIG. 5 is carried out in a mold for hydrostatic pressing, and after the desired stacking is finished, the stack is inserted into this mold. The hydrostatic pressing may be performed in the state of being kept. In addition, at the time of stacking, each ceramic green sheet 11a is
It may be thermocompression-bonded or temporarily adhered with a solvent and conveyed to the pressing step.

The present invention can be applied not only to the ceramic multilayer substrate but also to other monolithic ceramic electronic components as long as it has at least a via hole. For example, laminated ceramic coil, delay circuit element,
The present invention can also be applied to stripline elements and the like.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a composite body 13 obtained by a composite body preparation step included in a method for manufacturing a ceramic multilayer substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the composite body 13 after performing a step of providing a through hole 14.

FIG. 3 is a cross-sectional view showing a state where a printing step is performed on the composite body 13.

4 is an enlarged cross-sectional view showing a through hole 14 filled with a conductive paste 18 by the printing step shown in FIG.

FIG. 5 is a cross-sectional view showing a state in which each step of punching the ceramic green sheet 11 and peeling it from the carrier film 12 and stacking the punched ceramic green sheets 11a is performed.

FIG. 6 is an enlarged cross-sectional view showing a state after the ceramic green sheet 11a has been peeled from the carrier film 12.

FIG. 7 is a diagram showing a conventional method for manufacturing a ceramic multilayer substrate.

[Explanation of symbols]

 11, 11a Ceramic green sheet 12 Carrier film 13 Composite 14 Through hole 17 Printing stage 18 Conductive paste 19 Screen 21 Cutting stage 22 Cutting head 26 Stacking stage 27 Via hole

Claims (1)

[Claims] 1. A ceramic laminated body in which a plurality of ceramic layers are laminated, at least one ceramic layer having a via hole formed therein, and at least two conductive films connected to each other through the via hole correspond to each other. In the method for manufacturing a laminated ceramic electronic component provided on each of the ceramic layers, a composite body comprising a ceramic green sheet to be the ceramic layer and a carrier film lining the ceramic green sheet is prepared. A through hole to be a hole is provided in the composite, a conductive paste is applied in the through hole, a conductive paste is printed on the corresponding ceramic green sheet so that the conductive film is formed, and then the ceramic Peel off the green sheet from the carrier film, then In stacking, characterized in that it comprises the steps, the method of production of a multilayer ceramic electronic component.