JPH11300727A - Preparation of green sheet and electronic part - Google Patents

Preparation of green sheet and electronic part

Info

Publication number
JPH11300727A
JPH11300727A JP13126598A JP13126598A JPH11300727A JP H11300727 A JPH11300727 A JP H11300727A JP 13126598 A JP13126598 A JP 13126598A JP 13126598 A JP13126598 A JP 13126598A JP H11300727 A JPH11300727 A JP H11300727A
Authority
JP
Japan
Prior art keywords
film
layer
green sheet
laminated
positioning mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13126598A
Other languages
Japanese (ja)
Inventor
Junichi Obata
淳一 小幡
Norio Yamaki
徳郎 八巻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP13126598A priority Critical patent/JPH11300727A/en
Publication of JPH11300727A publication Critical patent/JPH11300727A/en
Pending legal-status Critical Current

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  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for preparing a green sheet by which a product with good operability on lamination and releasing, stable quality and high reliability can be obtd. even in a laminated body using very thin films and an electronic part using the method. SOLUTION: When an inner electrode layer 2 with a specified pattern is formed on a carrier film 1 and a dielectric layer 4 covering the whole face is formed, at the same time when the specified pattern of the initial inner electrode layer 2 is printed, a positioning mark 3 is printed on an arbitrary site on the carrier film 1 on which the next dielectric layer 4 is not formed. Then, a dielectric layer 4 is formed uniformly on the whole face of the inner electrode layer 2 except a part of the above described positioning mark 3 thereon by using the positioning mark as a reference. In addition, in the second printing and film-forming of a pattern of the inner electrode layer 2, the positioning mark 3 is detected and printing and film-forming are performed to fit the position and film forming is repeated in advance to a specified thickness to prepare a laminated green sheet.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、積層型電子部品に
用いるセラミック粉末ペースト層や導体粉末ペースト層
等を積層した、電子部品用の圧粉積層体の素材になるキ
ャリアフィルム上に形成されたグリーンシートの製造方
法及びその方法を用いた電子部品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic powder paste layer, a conductor powder paste layer, and the like used for a laminated electronic component, which are formed on a carrier film which is used as a material of a compact for an electronic component. The present invention relates to a method for manufacturing a green sheet and an electronic component using the method.

【0002】[0002]

【従来の技術】電子部品は、小型化、高性能化の要求に
従って、薄型、小型化され、さらに多層化され、各機能
素子を一体に複合化して、小型にも関わらず、高性能、
高機能になっている。特に、セラミックス層と導体層等
を積層した、セラミックス積層型電子部品は、積層型コ
ンデンサ、積層型インダクタ、積層型抵抗、積層型ノイ
ズフィルタ、或いはこれらの組み合わせた機能を持つ電
子部品等で盛んに用いられている。
2. Description of the Related Art In accordance with demands for miniaturization and high performance, electronic components are thinned, miniaturized, and further multilayered, and each functional element is integrally compounded.
It has become highly functional. In particular, ceramic multilayer electronic components in which ceramic layers and conductor layers are laminated are actively used in multilayer capacitors, multilayer inductors, multilayer resistors, multilayer noise filters, and electronic components having a combination of these functions. Used.

【0003】これらの製品は、基本となるセラミックス
の原料粉末を含有したペーストを成膜し、この上に導電
体膜等を形成する原料粉末を含有するペーストや、直接
導電体で、所定のパターンの層を形成し、積層されたグ
リーンシート(未焼成の膜)や、前記の原料素材のペー
スト単独で形成された単層のグリーンシート(未焼成の
膜)を準備し、これを所定の要求機能に合わせて順次積
層し、中間体の圧粉積層体を作製し、これを熱プレスで
圧着し、焼成して、電子部品を製造している。
[0003] In these products, a paste containing a raw material powder of a basic ceramic is formed into a film, and a paste containing a raw material powder for forming a conductive film or the like, or a direct conductive material is formed in a predetermined pattern. And a laminated green sheet (unfired film) or a single-layer green sheet (unfired film) formed solely of the paste of the raw material described above is prepared according to a predetermined requirement. An electronic component is manufactured by sequentially laminating according to the function, producing an intermediate powder laminate, pressing the laminate with a hot press, and firing.

【0004】この中間体の圧粉積層体を作る素材である
グリーンシートの製造は、製品のコストや品質を決定す
る重要な素材である。このセラミックス積層型電子部品
に使用されるグリーンシートの製造について、以下、セ
ラミックコンデンサの例を用いて説明する。
[0004] The production of a green sheet, which is a material for producing the intermediate powder compact, is an important material that determines the cost and quality of the product. The production of the green sheet used for the ceramic laminated electronic component will be described below using an example of a ceramic capacitor.

【0005】図3は、従来のグリーンシートを用いた積
層体の積層工程の説明図である。図4は、ロール状に巻
き取られたキャリアフィルムの斜視図である。図5は、
従来のグリーンシートを使用した積層体の側面断面図で
ある。
FIG. 3 is an explanatory view of a laminating process of a conventional laminate using a green sheet. FIG. 4 is a perspective view of the carrier film wound up in a roll shape. FIG.
It is a side sectional view of a layered product using a conventional green sheet.

【0006】まず、その素材となるセラミックスや導電
体のグリーンシートは、一般に、図4に示すようなロー
ル状に巻き取られたキャリアフィルムの上に、図3及び
図4のように、素材となる誘電体層4(他の部品では磁
性体層、絶縁体層など)のセラミックスのペーストをド
クターブレード法などにより成膜し、その上に、内部電
極層2(他の部品では、コイル導体層、抵抗体層など)
の導体のペーストを印刷法などにより成膜して作製され
る。
First, a ceramic or conductive green sheet as a raw material is generally placed on a carrier film wound into a roll as shown in FIG. 4 on a carrier film as shown in FIG. 3 and FIG. A ceramic paste of a dielectric layer 4 (a magnetic layer, an insulator layer, etc. in other parts) is formed by a doctor blade method or the like, and an internal electrode layer 2 (a coil conductor layer in other parts) is formed thereon. , Resistor layer, etc.)
The conductor paste is manufactured by forming a film by a printing method or the like.

【0007】図5のように、このグリーンシートを所定
の順序で、それぞれのパターンの位置合わせの行われた
装置で積層し、圧粉積層体を形成し、これを乾燥、焼結
し、切断や電極処理などの各種の仕上げ処理を施し、積
層型のセラミックコンデンサを形成していた。
As shown in FIG. 5, the green sheets are laminated in a predetermined order by an apparatus in which respective patterns are aligned to form a green compact, which is dried, sintered, and cut. Various types of finishing processes such as electrode and electrode processing were performed to form a multilayer ceramic capacitor.

【0008】インダクタ、抵抗器、バリスタ、ノイズフ
ィルタ、複合電子部品等の積層型セラミックス電子部品
も同様に製造していた。電子部品の小型化、高性能化、
高機能化は、グリーンシートの構造にも影響を及ぼし、
誘電体層、磁性体層、絶縁体層などのセラミックス層、
電極、導電体などを形成する導体層は、共に、非常に薄
くする必要性が出てきた。
[0008] Multilayer ceramic electronic components such as inductors, resistors, varistors, noise filters, and composite electronic components have also been manufactured. Smaller and higher performance electronic components,
High functionality also affects the structure of the green sheet,
Ceramic layers such as dielectric layers, magnetic layers, and insulator layers,
It has become necessary for the conductor layers forming the electrodes, conductors, etc., to be very thin.

【0009】[0009]

【発明が解決しようとする課題】積層体を形成する際
に、キャリアシートからグリーンシートを剥離して、グ
リーンシートのみを積層する必要があるが、グリーンシ
ートを薄くしていくと、キャリアフィルムからグリーン
シートを剥離するのが非常に難しくなるという問題があ
る。また、グリーンシート自体の膜厚が薄いため、剥離
がうまくできても、グリーンシートに皺が発生しやす
く、これを積層すると積層体に空隙ができたり、厚さが
ばらついたりして、製品の精度が低下してしまうという
問題がある。
When forming a laminate, it is necessary to peel off the green sheet from the carrier sheet and laminate only the green sheet. There is a problem that it is very difficult to peel off the green sheet. Also, since the thickness of the green sheet itself is thin, even if peeling is successful, wrinkles are likely to be generated in the green sheet, and when this is laminated, voids are formed in the laminate or the thickness varies, and the product There is a problem that accuracy is reduced.

【0010】さらに、図5に示すように、誘電体層4と
内部電極層2との厚みに差が少ないため、段差6が発生
し、その比率が大きいので、積層圧縮されたでき上がり
の積層体でも、この段差を十分に解消することは困難と
なり、製品になったとき、デラミネーションや特性のば
らつきになり、品質に悪い影響を与えるという問題があ
った。さらに、積層時の位置合わせも不十分となるた
め、内部電極の重なる面積も減少し、層の厚さもばらつ
く結果となり、特性も十分に発揮できず、ばらつきも大
きくなってしまうという問題がある。
Further, as shown in FIG. 5, since there is little difference in thickness between the dielectric layer 4 and the internal electrode layer 2, a step 6 is generated, and the ratio thereof is large. However, it is difficult to sufficiently eliminate the step, and when a product is manufactured, there is a problem that delamination and variations in characteristics are caused, which adversely affects quality. Furthermore, since the alignment at the time of lamination is also insufficient, the overlapping area of the internal electrodes is reduced, the thickness of the layers varies, and the characteristics cannot be sufficiently exhibited, and the variation increases.

【0011】従って、本発明の課題は、非常に薄い膜を
使用する積層体でも、積層時や剥離時の操作性が良く、
この積層体を使用した製品の品質が安定し、信頼性の高
い製品が得られるグリーンシートの製造方法及びその方
法を用いた電子部品を提供することである。
Therefore, an object of the present invention is to provide a laminate using a very thin film with good operability at the time of lamination and peeling.
It is an object of the present invention to provide a method for manufacturing a green sheet, in which the quality of a product using the laminate is stable and a highly reliable product can be obtained, and an electronic component using the method.

【0012】[0012]

【課題を解決するための手段】本発明者らは、上記課題
を解決するために検討を重ね、グリーンシートとして目
的に合わせた多層膜をキャリアフィルム上に予め形成
し、これを目的に合わせて積層して使用することにより
解決することを見出した。また、グリーンシートの積層
を正確に位置決めして行うことにより、高機能を実現で
きるように、キャリアフィルム上に位置決めマークを最
初の成膜時に加工し、これを用いて以降の成膜を行う方
法を見出した。
Means for Solving the Problems The inventors of the present invention have been studying to solve the above-mentioned problems and have formed a multi-layer film suitable for the purpose as a green sheet on a carrier film in advance, and adapted the multi-layer film to the purpose. It has been found that the problem can be solved by stacking and using. In addition, a method of processing positioning marks on a carrier film at the time of the first film formation and performing subsequent film formation using the marks so that high performance can be realized by accurately positioning and stacking the green sheets. Was found.

【0013】即ち、本発明は、長尺のキャリアフィルム
上に、誘電体層、絶縁体層、磁性体層等のセラミックス
層、或いは内部電極層や導電体層等の導体層等を形成し
て、これを積層して作る積層型電子部品の中間体である
圧粉積層体に使用する各素材粉末を含有するグリーンシ
ートを製造する方法において、前記キャリアフィルム上
に、所定のパターンの層と、他のパターンの層を印刷技
術等を用いた成膜法やナイフエッジやロールを用いた成
膜法等により、順次、繰り返し成膜積層して、前記キャ
リアフィルム上に膜状の各素材粉末の層を積層したグリ
ーンシートを形成し、この最初の成膜時に、次回以降の
成膜パターンの位置決めに使用する位置決めマークをキ
ャリアフィルム上の次の層が形成されない部位に成膜
し、2層め以降に成膜する層の位置決めを、前記位置決
めマークを基準として成膜して、積層状のグリーンシー
トを作るグリーンシートの製造方法である。
That is, according to the present invention, a ceramic layer such as a dielectric layer, an insulator layer or a magnetic layer, or a conductor layer such as an internal electrode layer or a conductor layer is formed on a long carrier film. In a method for producing a green sheet containing each material powder used for a green compact which is an intermediate of a laminated electronic component made by laminating the above, a layer of a predetermined pattern on the carrier film, Layers of other patterns are sequentially and repeatedly formed and laminated by a film forming method using a printing technique or a film forming method using a knife edge or a roll, and a film-shaped material powder is formed on the carrier film. A green sheet is formed by laminating layers, and at the time of this first film formation, a positioning mark used for positioning the next and subsequent film formation patterns is formed on a portion of the carrier film where the next layer is not formed, and a second layer is formed. Later Positioning of the layer, by forming the positioning mark as a reference, a green sheet manufacturing method of making a laminated green sheet.

【0014】また、本発明は、前記グリーンシートの製
造方法を用いた電子部品である。
Further, the present invention is an electronic component using the method for producing a green sheet.

【0015】[0015]

【発明の実施の形態】本発明の実施の形態を、図面を参
照して説明する。
Embodiments of the present invention will be described with reference to the drawings.

【0016】図1は、本発明のグリーンシートの製造工
程を示し、各段階の斜視図とフィルム上のグリーンシー
トの断面図を示す。ロール状に巻き取られた長尺なキャ
リアフィルム1の上に、所定のパターンの内部電極層2
を形成する工程と、その全面を覆う誘電体層4を形成す
る工程を順次、繰り返し行う例で説明する。
FIG. 1 shows a manufacturing process of the green sheet of the present invention, and shows a perspective view of each stage and a cross-sectional view of the green sheet on a film. The internal electrode layer 2 having a predetermined pattern is formed on the long carrier film 1 wound in a roll shape.
An example in which the step of forming the dielectric layer 4 and the step of forming the dielectric layer 4 covering the entire surface are sequentially and repeatedly performed will be described.

【0017】最初の印刷成膜工程において、内部電極層
2の所定のパターンの成膜のための印刷と同時に、位置
決めマーク3を、次に成膜される誘電体層4が形成され
ないキャリアフィルム1上の任意の部位に印刷する。次
に、その上の前記位置決めマーク3の部分を除いた内部
電極層2の上に、全面一様に誘電体層4を前記位置決め
マークを基準にして成膜する。さらに、2回めの内部電
極層2[図3(f)の最上段]パターンの印刷成膜は、
前記位置決めマーク3を検出し、その位置に合わせて印
刷成膜する。
In the first printing film forming step, at the same time as printing for forming a predetermined pattern of the internal electrode layer 2, the positioning mark 3 is formed on the carrier film 1 on which the next dielectric layer 4 is not formed. Print on any part above. Next, a dielectric layer 4 is uniformly formed on the entire surface of the internal electrode layer 2 excluding the positioning mark 3 with reference to the positioning mark. Further, the second printing of the internal electrode layer 2 [the uppermost layer in FIG.
The positioning mark 3 is detected, and a print film is formed in accordance with the position.

【0018】このように、それ以降の膜の積層は、この
位置決めマークを基準に行い、キャリアフィルム上のグ
リーンシートが、剥離積層などの取り扱いに十分な膜厚
になるまで繰り返し成膜積層し、所定の厚さのグリーン
シートを完成する。その結果、このグリーンシートを用
いて圧粉積層体を作るとき、キャリアフィルムからの剥
離や積層作業が容易となる。また、キャリアフィルムか
ら剥離したグリーンシートへの皺の発生を防止でき、積
層精度も向上でき、特性のばらつきの少ない、デラミネ
ーション等の発生が無い信頼性の高い電子部品が得られ
る。
As described above, the subsequent lamination of the film is performed based on the positioning mark, and the film is repeatedly laminated until the green sheet on the carrier film has a film thickness sufficient for handling such as peeling lamination. A green sheet having a predetermined thickness is completed. As a result, peeling from the carrier film and laminating work are facilitated when a green compact is produced using this green sheet. Further, generation of wrinkles on the green sheet peeled off from the carrier film can be prevented, lamination accuracy can be improved, and a highly reliable electronic component free from variations in characteristics and free from delamination can be obtained.

【0019】[0019]

【実施例】本発明を、実施例により、図面を参照して説
明する。本実施例では、積層型のセラミックコンデンサ
を用いて説明する。この例では、誘電体層の間に内部電
極層となる導体層が積層されたものである。また、一つ
のフィルム上の一ブロックに複数のコンデンサ素子を含
むパターンのグリーンシートの例である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described by way of examples with reference to the drawings. In this embodiment, a description will be given using a multilayer ceramic capacitor. In this example, a conductor layer serving as an internal electrode layer is laminated between dielectric layers. It is also an example of a green sheet having a pattern including a plurality of capacitor elements in one block on one film.

【0020】図1は、本発明のグリーンシートの製造工
程を説明する説明図で、図1(a)は、最初の内部電極
のパターンの印刷成膜が終了したグリーンシートの斜視
図、図1(b)は、図1(a)のA−A断面図、図1
(c)は、誘電体層を成膜した斜視図、図1(d)は、
図1(c)のB−B断面図、図1(e)は、2回めの内
部電極層を印刷積層した斜視図、図1(f)は、図1
(e)のC−C断面図、図1(g)は、2回めの誘電体
層を成膜した斜視図、図1(h)は、図1(g)のD−
D断面図である。
FIG. 1 is an explanatory view for explaining the manufacturing process of the green sheet of the present invention. FIG. 1A is a perspective view of the green sheet after the first internal electrode pattern has been printed and formed. FIG. 1B is a sectional view taken along line AA of FIG.
FIG. 1C is a perspective view in which a dielectric layer is formed, and FIG.
FIG. 1C is a cross-sectional view taken along line BB, FIG. 1E is a perspective view in which a second internal electrode layer is printed and laminated, and FIG.
1E is a cross-sectional view taken along the line CC, FIG. 1G is a perspective view showing a second dielectric layer formed, and FIG.
It is D sectional drawing.

【0021】図2は、実施例のグリーンシートを用いた
圧粉積層体の熱プレス前の側面断面図である。図1のよ
うに、電極層と誘電体層を繰り返し行い、成膜積層を進
め、次の積層作業やフィルムからの剥離作業が容易にで
きる厚さまでグリーンシートを成膜積層し所定の厚さの
グリーンシートを作製する。このグリーンシートを積層
し、熱プレスで圧縮し、圧粉積層体を作製する。
FIG. 2 is a side sectional view of a green compact using the green sheets of the embodiment before hot pressing. As shown in FIG. 1, the electrode layer and the dielectric layer are repeatedly formed, the film formation and lamination are advanced, and the green sheet is formed and laminated to a thickness that facilitates the next lamination work and the peeling work from the film. Make a green sheet. The green sheets are laminated and compressed by a hot press to produce a green laminate.

【0022】つまり、従来の製造工程では、成膜−印刷
−積層の順で行っていたが、本発明では、印刷−成膜−
印刷−・・・−印刷−成膜−積層の製造工程にする。
That is, in the conventional manufacturing process, film formation, printing, and lamination are performed in this order.
Print -...- Print-Film formation-Lamination manufacturing process.

【0023】本発明のグリーンシートの製造方法で作製
したグリーンシートを使用することにより、個々の機能
を有する材料の層(誘電体層や導体層等)は、十分に薄
く作製でき、しかも、キャリアフィルム上に作製される
グリーンシートは、取り扱いに十分な膜厚を維持するこ
とが可能となる。
By using the green sheet produced by the method for producing a green sheet of the present invention, layers of materials having individual functions (dielectric layer, conductor layer, etc.) can be produced sufficiently thin, and the carrier The green sheet produced on the film can maintain a sufficient film thickness for handling.

【0024】また、2回め以降の内部電極のパターンの
印刷時に発生するずれなどによる内部電極の厚みのばら
つきや、図5に示すような従来の積層体に発生する段差
6の発生を防止でき、図1(h)や図2に示すように、
誘電体層の中に内部電極が入り込んだ形状にでき、空隙
のない積層が可能となる。
In addition, it is possible to prevent variations in the thickness of the internal electrodes due to misalignment or the like occurring when printing the pattern of the internal electrodes after the second time, and the occurrence of the step 6 generated in the conventional laminated body as shown in FIG. , As shown in FIG. 1 (h) and FIG.
It is possible to form a shape in which the internal electrode is inserted in the dielectric layer, and it is possible to laminate without any voids.

【0025】このようにして作製したグリーンシートを
積層し、熱プレス、切断、乾燥、焼成、電極加工などの
工程を経て、積層型セラミックコンデンサを完成した。
その結果、この積層型セラミックコンデンサでは、積層
作業が容易で、作業時間や工数も節減でき、キャリアフ
ィルムからの剥離も容易で、皺の発生もなく、精度良く
積層できた。コンデンサでのデラミネーションの発生は
皆無で、特性のばらつきも小さくできた。従って、製品
の歩留まりも向上できた。
The green sheets produced as described above were laminated and subjected to steps such as hot pressing, cutting, drying, firing, and electrode processing to complete a laminated ceramic capacitor.
As a result, in the multilayer ceramic capacitor, the laminating operation was easy, the operation time and man-hour were reduced, the peeling from the carrier film was easy, the wrinkles did not occur, and the laminating was performed accurately. No delamination occurred in the capacitor, and the variation in characteristics was reduced. Therefore, the product yield was also improved.

【0026】また、グリーンシートの製造過程で予め精
度良く積層できているので、内部電極の有効な面積が大
きく取れ、ばらつきの少ない高い容量のコンデンサが得
られた。
In addition, since the green sheets were laminated with high precision in the manufacturing process, the effective area of the internal electrodes was large, and a capacitor having a small variation and a high capacitance was obtained.

【0027】特に、本例のように、最初に内部電極層を
キャリアフィルムに成膜して積層化したグリーンシート
を用いると、次の誘電体層が内部電極層のパターンの間
に隙間無く成膜されるので、誘電体層間の段差も発生せ
ず、次の積層作業でも段差の発生は無く、均質な圧粉積
層体が得られ、焼結後の製品の品質、信頼性を高めるこ
とができた。
In particular, when a green sheet in which an internal electrode layer is first formed on a carrier film and laminated is used as in this example, the next dielectric layer is formed without any gap between the patterns of the internal electrode layer. Since the film is formed, there is no step between the dielectric layers, and there is no step in the next laminating operation, so that a homogeneous green compact can be obtained and the quality and reliability of the product after sintering can be improved. did it.

【0028】本実施例では、セラミックコンデンサの例
で説明したが、積層して作られるものであれば、インダ
クタ、抵抗、バリスタ、その他の電子部品でも有効であ
る。
Although the present embodiment has been described with reference to the example of a ceramic capacitor, an inductor, a resistor, a varistor, and other electronic components are also effective as long as they are made by lamination.

【0029】[0029]

【発明の効果】以上、述べた如く、本発明によれば、積
層型電子部品の製造に用いる圧粉積層体の製造におい
て、グリーンシートの積層作業、フィルムからの剥離作
業が容易で、皺の発生が無いグリーンシートが得られ、
その結果、これを用いた圧粉積層体や製品では剥離(デ
ラミネーション)も無く、特性のばらつきも少なくで
き、生産性と信頼性の高い製品の得られるグリーンシー
トの製造方法及びその方法を用いた電子部品が提供でき
る。
As described above, according to the present invention, in the production of a dust laminate used in the production of a laminated electronic component, the laminating operation of the green sheet and the exfoliation operation from the film are easy, and wrinkles are reduced. A green sheet without generation is obtained,
As a result, there is no peeling (delamination) in the green compact or the product using the same, the characteristic variation can be reduced, and a method for manufacturing a green sheet capable of obtaining a product with high productivity and reliability can be used. Electronic components can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のグリーンシートの製造工程を説明する
説明図で、図1(a)は、最初の内部電極のパターンの
印刷成膜が終了したグリーンシートの斜視図、図1
(b)は、図1(a)のA−A断面図、図1(c)は、
誘電体層の成膜した斜視図、図1(d)は、図1(c)
のB−B断面図、図1(e)は、2回めの内部電極層を
印刷積層した斜視図、図1(f)は、図1(e)のC−
C断面図、図1(g)は、2回めの誘電体層を成膜した
斜視図、図1(h)は、図1(g)のD−D断面図。
FIG. 1 is an explanatory view for explaining a manufacturing process of a green sheet of the present invention. FIG. 1 (a) is a perspective view of a green sheet after a first film formation of a pattern of an internal electrode is completed.
1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG.
FIG. 1D is a perspective view in which a dielectric layer is formed, and FIG.
1 (e) is a perspective view in which a second internal electrode layer is printed and laminated, and FIG. 1 (f) is a sectional view taken on line C-B of FIG. 1 (e).
1G is a perspective view in which a second dielectric layer is formed, and FIG. 1H is a DD sectional view in FIG. 1G.

【図2】実施例のグリーンシートを用いた圧粉積層体の
熱プレス前の側面面断面。
FIG. 2 is a side cross-sectional view of a green compact using a green sheet of an example before hot pressing.

【図3】従来のグリーンシートを用いた圧粉積層体の積
層工程の説明図。
FIG. 3 is an explanatory diagram of a laminating step of a conventional green compact using a green sheet.

【図4】ロール状に巻き取られたキャリアフィルムの斜
視図。
FIG. 4 is a perspective view of a carrier film wound up in a roll shape.

【図5】従来のグリーンシートを使用した圧粉積層体の
熱プレス前の側面断面図。
FIG. 5 is a side cross-sectional view of a green compact using a conventional green sheet before hot pressing.

【符号の説明】[Explanation of symbols]

1 キャリアフィルム 2 内部電極層 3 位置決めマーク 4 誘電体層 5 積層体の保護膜層 6 (内部電極層の厚みにより発生する)段差 DESCRIPTION OF SYMBOLS 1 Carrier film 2 Internal electrode layer 3 Positioning mark 4 Dielectric layer 5 Protective film layer of laminated body 6 Step (generated by the thickness of internal electrode layer)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 長尺のキャリアフィルム上に、誘電体
層、絶縁体層、磁性体層等のセラミックス層、或いは内
部電極層や導電体層等の導体層等を形成して、これを積
層して作る積層型電子部品の中間体である圧粉積層体に
使用する各素材粉末を含有するグリーンシートを製造す
る方法において、前記キャリアフィルム上に、所定のパ
ターンの層と、他のパターンの層を印刷技術等を用いた
成膜法やナイフエッジやロールを用いた成膜法等によ
り、順次、繰り返し成膜積層して、前記キャリアフィル
ム上に膜状の各素材粉末の層を積層したグリーンシート
を形成し、この最初の成膜時に、次回以降の成膜パター
ンの位置決めに使用する位置決めマークをキャリアフィ
ルム上の次の層が形成されない部位に成膜し、2層め以
降に成膜する層の位置決めを、前記位置決めマークを基
準として成膜して、積層状のグリーンシートを作ること
を特徴とするグリーンシートの製造方法。
A ceramic layer such as a dielectric layer, an insulator layer, and a magnetic layer, or a conductor layer such as an internal electrode layer and a conductor layer is formed on a long carrier film and laminated. In a method for producing a green sheet containing each material powder used for a green compact which is an intermediate of a laminated electronic component to be made, the carrier film has a predetermined pattern layer and another pattern. The layers were sequentially and repeatedly laminated by a film forming method using a printing technique or a film forming method using a knife edge or a roll, and a layer of each material powder in a film form was laminated on the carrier film. A green sheet is formed, and at the time of this first film formation, a positioning mark used for positioning the next and subsequent film formation patterns is formed on a portion of the carrier film where the next layer is not formed, and a film is formed on the second and subsequent layers. Layer positioning Forming a film on the basis of the positioning mark to form a laminated green sheet.
【請求項2】 請求項1記載のグリーンシートの製造方
法を用いたことを特徴とする電子部品。
2. An electronic component using the method for producing a green sheet according to claim 1.
JP13126598A 1998-04-23 1998-04-23 Preparation of green sheet and electronic part Pending JPH11300727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13126598A JPH11300727A (en) 1998-04-23 1998-04-23 Preparation of green sheet and electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13126598A JPH11300727A (en) 1998-04-23 1998-04-23 Preparation of green sheet and electronic part

Publications (1)

Publication Number Publication Date
JPH11300727A true JPH11300727A (en) 1999-11-02

Family

ID=15053892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13126598A Pending JPH11300727A (en) 1998-04-23 1998-04-23 Preparation of green sheet and electronic part

Country Status (1)

Country Link
JP (1) JPH11300727A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009016698A1 (en) * 2007-07-27 2009-02-05 Ngk Insulators, Ltd. Ceramic powder molding, ceramic burning product, and process for producing ceramic powder molding
KR101037873B1 (en) 2008-03-22 2011-05-31 주식회사 엘지화학 Attaching Method of Metal-clad
US7973238B2 (en) 2007-07-27 2011-07-05 Ngk Insulators, Ltd. Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009016698A1 (en) * 2007-07-27 2009-02-05 Ngk Insulators, Ltd. Ceramic powder molding, ceramic burning product, and process for producing ceramic powder molding
US7973238B2 (en) 2007-07-27 2011-07-05 Ngk Insulators, Ltd. Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part
US8034402B2 (en) 2007-07-27 2011-10-11 Ngk Insulators, Ltd. Method for producing ceramic compact and ceramic part
US8409484B2 (en) 2007-07-27 2013-04-02 Ngk Insulators, Ltd. Method for producing a ceramic compact
KR101037873B1 (en) 2008-03-22 2011-05-31 주식회사 엘지화학 Attaching Method of Metal-clad

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