JPH063777B2 - Stacking method for sheet-shaped electronic components - Google Patents

Description

The present invention relates to a first sheet-shaped electronic component such as a sheet-shaped coil conductor and a second sheet-shaped electronic component such as a sheet-shaped coil with an insulating adhesive layer interposed therebetween. The present invention relates to a method for laminating sheet-shaped electronic components, which are laminated on a conductor, a yoke plate, a printed circuit board, or the like while maintaining electrical insulation.

[Prior Art] When laminating two sheet-like electronic components in this way, conventionally, an adhesive is applied to both sides of a PET film, and a cover film made of release paper is applied on one of the adhesive layers. The resulting adhesive sheet is cut out into a shape of an individual sheet-shaped electronic component, for example, a coil shape, the cut-out adhesive sheet is bonded to an individual sheet-shaped electronic component, and then,
A method is used in which the release paper is peeled off and the second sheet-shaped electronic component is attached to the second sheet-shaped electronic component, and the adhesive layer is heated and pressed to be cured to laminate both sheet-shaped electronic components.

However, in such a stacking method, the adhesive sheet is cut out in accordance with each sheet-shaped electronic component, and the cut-out sheets are attached one by one to the sheet-shaped electronic component. Therefore, the electronic component and the adhesive sheet are individually punched. In addition to the need for handling the adhesive sheet after it has been cut out, the productivity is low, and the bonding of the adhesive sheet is easily misaligned. Sometimes it sticks out of the department.

[Problems to be Solved by the Invention] Therefore, an object of the present invention is to eliminate the above-mentioned drawbacks, improve the productivity of lamination, and achieve a uniform and improved quality of sheet-shaped electronic components. Is to propose.

[Means for Solving Problems] In order to achieve such an object, a first embodiment of the present invention is to apply an adhesive agent to both surfaces of a sheet in which sheet-shaped electronic components are arranged and an insulating film. And a step of adhering one side of the adhesive layer with an adhesive sheet coated with a release paper and adhering the sheet, and a step of punching out and taking out the sheet-shaped electronic component from the attached sheet.

A second aspect of the present invention includes a sheet in which the first sheet-shaped electronic components are arranged and an adhesive sheet in which an adhesive is applied to both surfaces of an insulating film and a release paper is attached to one of the adhesive layers. A step of pasting and adhering, a step of punching out and taking out the first sheet-shaped electronic component from the pasted sheet, a release paper peeled from the punched first sheet-shaped electronic component, a second sheet-shaped And a step of attaching electronic components.

[Operation] According to the present invention, since the electronic component and the adhesive sheet are bonded together and then punched, there is no need for two punching steps as in the conventional case, and the individually punched coil and adhesive sheet are separated. Since there is no need for complicated bonding, the productivity of stacking is improved, and since the bonding is performed before punching, the positional accuracy of the bonding is high and the quality of the stacked body is improved.

[Examples] Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an example of a large-sized sheet in which a large number of sheet-shaped electronic components such as coils are formed and arranged by etching, plating, CVD or the like. Here, 1 is a large-sized sheet, and 2 is a large number of sheet-shaped electronic components arranged on this sheet, for example, coils.

FIG. 2 (A) shows a roll 3 of the adhesive sheet. As shown in FIG. 2 (B), this adhesive sheet is provided with adhesive layers 5 and 6 formed by applying an epoxy adhesive on both surfaces of an insulating film, for example, PET film 4, and one adhesive layer 5 is provided. A cover film 7 made of release paper is attached to the top of the structure.
As such an adhesive sheet, 3652 (PE
The thickness of the T film 4 may be 10 μm).

In the present invention, as shown in FIG. 3, the large sheet 1 shown in FIG. 1 and the adhesive sheet 3 shown in FIGS. 2 (A) and 2 (B) are attached to each other and heated and pressed. This laminating step can be performed using a commercially available laminator, for example,
Using a two-stage roll type laminator, it was possible to perform suitable bonding at a temperature of 100 ° C., a feed rate of 1 m / min, and an air cylinder pressure of the laminator of 3.5 kgf / cm ² .

Then, the coil 2 is punched out from the sheet to which the adhesive sheet has been attached to obtain a single coil. According to this, unlike the prior art, there is no need to separately punch the coil and the adhesive sheet separately, and since the adhesive sheet does not deviate from the coil, the positional accuracy is remarkably improved as compared with the prior art.

Furthermore, peel off the release paper from the single laminated coil,
As shown in FIG. 4, a single second sheet-shaped electronic component,
For example, after being bonded to a coil, a yoke plate or a printed circuit board, heating and pressing are performed to cure the adhesive.

Here, the curing treatment may be divided into two stages, in which heating and pressing are performed in the preliminary curing, and only heating is performed in the next main curing. For example, precure is performed at a temperature of 150 ° C and a pressure of 0.1.
It is carried out at a weight of kg / cm ² for 120 seconds, and the main curing is carried out at a temperature of 150 ° C. for 1.5 hours.

In addition, since the punching pattern shape is generally different between the first and second electronic components, it is not possible to stack the both and punch them in the same pattern. The punching of the first electronic component and the punching of the second electronic component to which the adhesive sheet is attached are performed separately,
Then, the two are laminated and laminated. However, when both patterns match, it is of course possible to punch them after bonding them.

[Effects of the Invention] As is clear from the above, according to the present invention, the electronic component and the adhesive sheet are bonded together and then punched, so that there is no need for two punching steps as in the conventional case, and
Since there is no complexity of sticking the individually punched coil and the adhesive sheet, the stacking productivity is improved, and since the stamping is performed after the sticking, the position accuracy of the sticking is also high, and the quality of the stacked body is high. Is improved. Moreover, in the present invention, since the large-sized sheet and the adhesive sheet are bonded together, there is also an advantage that the bonding process can be mechanized by using an ordinary laminator or the like.

[Brief description of drawings]

FIG. 1 is a plan view showing a series of large-sized sheets, FIG. 2 (A) is a perspective view showing a roll of an adhesive sheet, and FIG. 2 (B) is an enlarged sectional view showing a part thereof, FIG. FIG. 4 is a cross-sectional view for explaining the steps in the present invention. 1 ... Large format sheet, 2 ... First electronic component (coil), 3 ... Roll of adhesive sheet, 4 ... PET film, 5, 6 ... Adhesive layer, 7 ... Release paper, 8 ... Second electronic component.

Claims (2)

[Claims] 1. A sheet in which sheet-shaped electronic components are arranged,
Adhesive is applied to both sides of the insulating film, and a step of adhering the adhesive sheet with release paper on one side of the adhesive layer and adhering it, and punching out the sheet-shaped electronic component from the attached sheet. A method for laminating sheet-shaped electronic components, which comprises a step of taking out. 2. A sheet in which a first sheet-shaped electronic component is arranged and an adhesive sheet in which an adhesive is applied to both surfaces of an insulating film and one side of the adhesive layer is covered with release paper A step of adhering, a step of punching and taking out the first sheet-shaped electronic component from the pasted sheet, a step of peeling the release paper from the punched first sheet-shaped electronic component, and a second sheet-shaped electronic component. A method for laminating sheet-shaped electronic components, which comprises a step of bonding the components together.