JPH0239490A - Manufacture of flexible circuit whereto release sheet is bonded temporarily and same circuit - Google Patents
Manufacture of flexible circuit whereto release sheet is bonded temporarily and same circuitInfo
- Publication number
- JPH0239490A JPH0239490A JP19106788A JP19106788A JPH0239490A JP H0239490 A JPH0239490 A JP H0239490A JP 19106788 A JP19106788 A JP 19106788A JP 19106788 A JP19106788 A JP 19106788A JP H0239490 A JPH0239490 A JP H0239490A
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- release sheet
- sheet
- circuit board
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000011888 foil Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 238000004080 punching Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000012787 coverlay film Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、薄くてフレキシビリティの高い複数のフレキ
シブル回路を離型シートに仮接着した状態で製造する方
法およびその方法によって得られた離型シート仮接着フ
レキシブル回路に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a plurality of thin and highly flexible flexible circuits temporarily adhered to a release sheet, and a release method obtained by the method. The present invention relates to a sheet temporary adhesive flexible circuit.
一般に、薄くてフレキシビリティの高いフレキシブル回
路は、つぎのようにして製造されている。すなわち、銅
張りフレキシブル回路用基板の銅箔面に、露光、パター
ン形成、エツチング等を施し複数のフレキシブル回路を
配列形成する。つぎに、フレキシブル回路が形成された
上記銅箔面に、部品実装または配線を可能とするよう所
望の位置に穴明けされかつ片側に接着剤がコーティング
されたポリイミド樹脂製のカバーレイフィルムをラミネ
ートする。そして、回路面に所定の表面処理を施したの
ち、さらにポリエチレンテレフタレート類のフレキシブ
ルシートを４隅固定状態で重ねる。ついで、その状態で
各フレキシブル回路に沿って刃を入れ切断してフレキシ
ブル回路を打抜（ということにより製造されている。こ
のようにして得られた各フレキシブル回路は、銅張りフ
レキシブル回路用基板の打抜部に、打抜かれた状態のま
まで付着（フレキシブル回路の外周部と銅張りフレキシ
ブル回路用基板の打抜部の内周部との接着摩擦により付
着している）しており、そのままの状態で検査を経て需
要者に供給される。In general, flexible circuits that are thin and highly flexible are manufactured in the following manner. That is, a plurality of flexible circuits are formed in an array by exposing, patterning, etching, etc. on the copper foil surface of a copper-clad flexible circuit board. Next, on the copper foil surface on which the flexible circuit is formed, a coverlay film made of polyimide resin is laminated with holes drilled at desired positions and coated with adhesive on one side to enable component mounting or wiring. . After a predetermined surface treatment is applied to the circuit surface, a flexible sheet of polyethylene terephthalate is further stacked with the four corners fixed. Then, in this state, a blade is inserted along each flexible circuit and cut to punch out the flexible circuit (this is how the flexible circuit is manufactured. Each flexible circuit obtained in this way is made of a copper-clad flexible circuit board. It is attached to the punched part in its punched state (adhered due to adhesive friction between the outer periphery of the flexible circuit and the inner periphery of the punched part of the copper-clad flexible circuit board). It is inspected in good condition and then supplied to customers.
しかしながら、上記の状態で検査工程、運搬工程を経由
させる場合には、少しの衝撃で、フレキシブル回路が銅
張りフレキシブル回路用基板の上記打抜部から脱落する
ため取扱い性が極めて悪い。また、各フレキシブル回路
が、銅張りフレキシブル回路用基板の銅箔面にいわば埋
設された状態になっており、員数カウントに際し、銅箔
面の茶色と相俟ってカウントしにくいという問題も生じ
ている。そのうえ、フレキシブル回路の使用に際しては
、フレキシブル回路を銅張りフレキシブル回路用基板の
打抜部から外すことが行われるが、使用に際していちい
ちフレキシブル回路を打抜部から取外すことは煩雑であ
る。またフレキシブル回路が取外された後の銅張りフレ
キシブル回路用基板およびフレキシブルシートは不要部
として廃棄されるべきものであるが、使用に際してこの
不要部の方が多くでるため需要者側からその改善が要望
されている。However, when the flexible circuit is passed through the inspection process and the transportation process in the above-mentioned state, the flexible circuit falls off from the punched part of the copper-clad flexible circuit board with the slightest impact, making it extremely difficult to handle. In addition, each flexible circuit is buried in the copper foil surface of the copper-clad flexible circuit board, and this combined with the brown color of the copper foil surface makes it difficult to count. There is. Moreover, when using the flexible circuit, the flexible circuit is removed from the punching part of the copper-clad flexible circuit board, but it is troublesome to remove the flexible circuit from the punching part each time the flexible circuit is used. Furthermore, after the flexible circuit has been removed, the copper-clad flexible circuit board and flexible sheet should be discarded as unnecessary parts, but since more unnecessary parts are generated during use, the user side is asking for improvement. It is requested.
本発明は、このような事情に鑑みなされたもので、取扱
い性および作業性に優れ、かつ使用に際して大量に不要
部を生じさせることのない離型シート仮接着フレキシブ
ル回路の製法およびその離型シート仮接着フレキシブル
回路の提供をその目的とする。The present invention has been made in view of the above circumstances, and provides a method for producing a flexible circuit temporarily bonded with a release sheet, which is excellent in handling and workability, and does not produce a large amount of unnecessary parts during use, and a release sheet thereof. The purpose is to provide temporarily bonded flexible circuits.
［問題点を解決するための手段］
上記の目的を達成するため、本発明は、金属箔張りフレ
キシブル回路用基板の金属箔面に複数のフレキシブル回
路を形成する工程と、上記回路形成後の金属箔面にフィ
ルム材を貼着する工程と、紫外線硬化型弱粘着シート層
を介して離型シートを上記フィルム材に接着する工程と
、上記金属箔張りフレキシブル回路用基板の金属箔面と
反対側の面から各フレキシブル回路に沿って刃を入れ刃
先を離型シート迄到達させるフレキシブル回路打抜き工
程と、打抜かれたフレキシブル回路を上記離型シート上
に残しそれ以外のフレキシブル回路用基板の部分を上記
離型シートから剥離除去する除去工程と、フレキシブル
回路用基板が剥離除去された離型シートのシート面に対
して紫外線を照射する照射工程を備えていることを第１
の要旨とし、照射工程をフレキシブル回路打抜き工程と
除去工程との間に移し離型シートの裏面全体に紫外線を
照射する製法を第２の要旨とし、上記製法によって得ら
れる離型シート仮接着フレキシブル回路を第３の要旨と
する。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a step of forming a plurality of flexible circuits on the metal foil surface of a metal foil-clad flexible circuit board, and a step of forming a plurality of flexible circuits on the metal foil surface of a metal foil covered flexible circuit board, A step of adhering a film material to the foil surface, a step of adhering a release sheet to the film material via an ultraviolet curable weak adhesive sheet layer, and a side opposite to the metal foil surface of the metal foil covered flexible circuit board. A flexible circuit punching process in which a blade is inserted along each flexible circuit from the above surface and the cutting edge reaches the mold release sheet, and the punched flexible circuit is left on the mold release sheet and the other parts of the flexible circuit board are The first step is to include a removal step of peeling and removing the flexible circuit board from the release sheet, and an irradiation step of irradiating ultraviolet rays to the sheet surface of the release sheet from which the flexible circuit board has been peeled and removed.
The second gist is a manufacturing method in which the irradiation process is transferred between the flexible circuit punching process and the removal process and the entire back surface of the release sheet is irradiated with ultraviolet rays, and the release sheet temporarily bonded flexible circuit obtained by the above manufacturing method is is the third gist.
すなわち、本発明によれば、製品となるフレキシブル回
路は、離型シート上に複数個が配列状態で仮接着されて
いる。しかも、離型シートのシート面に形成された紫外
線硬化型弱粘着シート層は紫外線照射により接着力を失
うため、離型シートのシート面は何ら粘着力を有してい
ない。したがって、検査、運搬するぶ際して、上記離型
シートを複数枚積重することができ、かつその際、フレ
キシブル回路が離型シートに仮接着されており脱落しな
いため取扱い性に優れている。また、離型シートのみの
運搬でよいため、運搬の効率が向上する。そのうえ、フ
レキシブル回路は、銅張りフレキシブル回路用基板から
取外されそれ自体が独立して離型シート上に配列仮接着
されているため、員数カウントが容易である。さらに、
使用に際しては、離型シート上にいわば載置され離型シ
ートのシート面から盛上がった状態になっているフレキ
シブル回路を、盛上がった部分を手がかりにして離型シ
ートから剥離するだけで足りるため、従来のように打抜
部からフレキシブル回路を取外すような煩雑な作業が不
要となる。また、不要部は離型シートのみとなるため需
要者側で不要部が大量に生じるという不都合さも同時に
回避できるようになる。That is, according to the present invention, a plurality of flexible circuits as a product are temporarily adhered in an array on a release sheet. Furthermore, the ultraviolet curable weak adhesive sheet layer formed on the surface of the release sheet loses its adhesive force due to UV irradiation, so the surface of the release sheet does not have any adhesive force. Therefore, it is possible to stack a plurality of the above-mentioned release sheets during inspection and transportation, and when doing so, the flexible circuit is temporarily adhered to the release sheet and does not fall off, making it easy to handle. . Furthermore, since only the release sheet needs to be transported, the efficiency of transport is improved. Moreover, since the flexible circuits are removed from the copper-clad flexible circuit board and arranged and temporarily bonded independently on the release sheet, counting the number of flexible circuits is easy. moreover,
When using the flexible circuit, which is placed on the release sheet and raised from the surface of the release sheet, it is sufficient to peel it off from the release sheet using the raised part as a guide. This eliminates the need for the complicated work of removing the flexible circuit from the punched part as in the past. Furthermore, since the only unnecessary part is the release sheet, the inconvenience of producing a large amount of unnecessary parts on the consumer side can also be avoided at the same time.
つぎに、実施例について説明する。Next, examples will be described.
第１図ないし第７図は本発明の一実施例を示している。 1 to 7 show one embodiment of the present invention.
すなわち、第１図および第２図は銅張りフレキシブル回
路用基板９（基板はポリイミド製）の銅箔面３に、従来
公知の方法で露光、パターン形成、エツチングを施して
複数のフレキシブル回路２を形成したのち、その銅箔面
３にポリイミド製のカバーレイフィルム５を貼着した回
路板１を示している。４はフレキシブル回路２の端子部
である。本発明は、上記第１図の回路板１のカバーレイ
フィルム５面に第３図および第４図に示すように、表面
の全体に紫外線硬化型弱粘着接着剤が塗布されている透
明ポリエチレンテレフタレート製の離型シート６を、表
面を上記カバーレイフィルム５面に合わせて重ね加圧し
て仮接着する。上記紫外線硬化型弱粘着接着剤（商品名
ニレツブホルダー、日東電工■社製）は、波長３６５ｎ
ｍの紫外線を４６０ｍＪ照射することにより初期接着力
４００〜５００ｇ／２０ｍｍが１０〜２０ｇ／２０ｍｍ
と低下する。しかし、紫外線照射前であっても接着力自
体はそれ程大きくないため、接着後剥離可能である。つ
ぎに、離型シート６が仮接着された銅張りフレキシブル
回路用基板９を裏返し、第５図に示すように、フレキシ
ブル回路２の全体形状と同一の形状のシール刃７を有す
る金型を用いフレキシブル回路２を打抜く。この際、上
記シール刃７を、銅張りフレキシブル回路用基板９を貫
通させ、さらに離型シート６の厚みの半分程度上人り込
ませ、そこで停止させるというハーフカットを行う。こ
のハーフカットの結果、離型シート６は初期形状を維持
し、各フレキシブル回路２は、銅張りフレキシブル回路
用基板９の打抜部と完全に切離され独立した状態で上記
離型シート６に仮接着している。つぎに、第６図に示す
ように銅張りフレキシブル回路用基板９を離型シート６
から接着剤の仮接着力に抗して剥離する。この場合、上
記銅張りフレキシブル回路用基板９は、全体が連続して
いるため、一端側から他端側に向けて剥離するというこ
とにより全体が簡単に剥離する。しかし、フレキシブル
回路２は上記打抜きにより独立した状態で離型シート６
に仮接着しているため、上記剥離部とは関係なく離型シ
ート６上に仮接着状態で残る。ついで、上記離型シート
６のシート面（フレキシブル回路２が残存している面）
に対して紫外線照射器（図示せず）から紫外線を照射す
る。この場合、離型シート６のシート面には、第７図に
示すように、フレキシブル回路２が仮接着されているが
、フレキシブル回路２の存在しない離型シート６の表面
部分には塗布された紫外線硬化型弱粘着シート層が露呈
している。しかし、この接着剤は上記紫外線照射により
接着力を失っているため、塵埃等の付着の恐れはなく、
また積重ねも自在である。ただし、紫外線はフレキシブ
ル回路２を通過しない（特に銅張りフレキシブル回路用
基板９を通過しない）ため、フレキシブル回路２の下側
の紫外線硬化型弱粘着シート層は接着力を失わず、した
がってフレキシブル回路２は初期仮止め状態のままにな
っている。That is, in FIGS. 1 and 2, a plurality of flexible circuits 2 are formed on the copper foil surface 3 of a copper-clad flexible circuit board 9 (the board is made of polyimide) by exposing, patterning, and etching using conventionally known methods. After forming the circuit board 1, a polyimide coverlay film 5 is attached to the copper foil surface 3. 4 is a terminal portion of the flexible circuit 2. As shown in FIGS. 3 and 4, the present invention is made of transparent polyethylene terephthalate, in which the entire surface of the coverlay film 5 of the circuit board 1 shown in FIG. A release sheet 6 manufactured by A. Co., Ltd. was overlapped with its surface aligned with the surface of the coverlay film 5 and pressed to temporarily adhere. The above ultraviolet curing type weak adhesive adhesive (trade name Niretsubu Holder, manufactured by Nitto Denko ■) has a wavelength of 365n.
By irradiating 460mJ of ultraviolet rays, the initial adhesive strength of 400-500g/20mm becomes 10-20g/20mm.
and decreases. However, even before ultraviolet irradiation, the adhesive strength itself is not so strong, so it can be peeled off after adhesion. Next, the copper-clad flexible circuit board 9 to which the release sheet 6 has been temporarily bonded is turned over, and as shown in FIG. Punch out the flexible circuit 2. At this time, a half-cut is performed in which the sealing blade 7 is passed through the copper-clad flexible circuit board 9, penetrated into the mold release sheet 6 by about half the thickness, and stopped there. As a result of this half-cutting, the release sheet 6 maintains its initial shape, and each flexible circuit 2 is completely separated from the punched portion of the copper-clad flexible circuit board 9 and attached to the release sheet 6 in an independent state. Temporarily attached. Next, as shown in FIG. 6, the copper-clad flexible circuit board 9 is placed on the release sheet 6.
Peel off against the temporary adhesive force of the adhesive. In this case, since the copper-clad flexible circuit board 9 is continuous as a whole, the whole can be easily peeled off by peeling from one end toward the other end. However, the flexible circuit 2 is separated from the release sheet 6 by the punching process.
Since it is temporarily adhered to, it remains on the release sheet 6 in a temporarily adhered state regardless of the above-mentioned peeling part. Next, the sheet surface of the release sheet 6 (the surface on which the flexible circuit 2 remains)
A UV irradiator (not shown) irradiates the surface with ultraviolet rays. In this case, as shown in FIG. 7, the flexible circuit 2 is temporarily adhered to the sheet surface of the release sheet 6, but the surface portion of the release sheet 6 where the flexible circuit 2 is not coated is The ultraviolet curable weak adhesive sheet layer is exposed. However, since this adhesive has lost its adhesive strength due to the above-mentioned ultraviolet irradiation, there is no risk of dust etc. adhering to it.
They can also be stacked freely. However, since the ultraviolet rays do not pass through the flexible circuit 2 (in particular, they do not pass through the copper-clad flexible circuit board 9), the ultraviolet curable weak adhesive sheet layer on the lower side of the flexible circuit 2 does not lose its adhesive strength, and therefore the flexible circuit 2 remains in its initial temporarily fixed state.
このようにして得られた離型シート仮接着フレキシブル
回路では、第７図に示すように、フレキシブル回路２が
離型シート６上に配列状態で仮接着されている。したが
って、使用に際してはフレキシブル回路２の端部を持上
げることにより容易に剥離する。この剥離を一層容易化
するためには、上記離型シート６をその中央部から長手
方向に沿って２つ折り状に曲げることが行われる。すな
わち、上記離型シート６の曲げにより、フレキシブル回
路２の上下両端部がフレキシブル回路２自体の有する腰
の強さにより剥離し持ち上がる。そのため、その持上が
り部を手がかりにして全体を容易に剥離することができ
る。In the release sheet temporarily bonded flexible circuit thus obtained, the flexible circuits 2 are temporarily bonded in an array on the release sheet 6, as shown in FIG. Therefore, when in use, the flexible circuit 2 can be easily peeled off by lifting the end portion thereof. In order to further facilitate this peeling, the release sheet 6 is bent in two along the longitudinal direction from its center. That is, by bending the release sheet 6, both upper and lower ends of the flexible circuit 2 are peeled off and lifted due to the stiffness of the flexible circuit 2 itself. Therefore, the whole can be easily peeled off using the raised portion as a clue.
なお、上記実施例では、フレキシブル回路打抜き工程を
経て回路外不要部を除去したのち紫外線照射を行ってい
るが、紫外線照射をフレキシブル回路打抜き工程と回路
外不要部の除去工程の間に移し、離型シート６の裏面（
フレキシブル回路２の仮接着されていない面）から離型
シート６の裏面全体に紫外線を軽く照射するようにして
もよい。これにより、離型シート６のシート面の全面に
塗布された紫外線硬化型弱粘着シート層の接着力が低下
するため、回路外不要部の剥離除去の容易化が実現され
る。この場合、回路外不要部の除去跡には、紫外線硬化
型弱粘着シート層塗布面が露呈するが、上記接着剤は紫
外線照射により接着力が低下しているため、塵埃付着等
の問題を殆ど生起せず、また積重ねも可能である。なお
、フレキシブル回路２は、紫外線照射により接着力が低
下しているとはいえ多少の接着力を残している紫外線照
射型弱粘着シート層の接着力により離型シート６に仮止
めされている。したがフて、使用に際して、フレキシブ
ル回路２の端部を持上げることにより簡単に剥離する。In the above example, ultraviolet irradiation is performed after removing unnecessary parts outside the circuit through the flexible circuit punching process. The back side of the mold sheet 6 (
The entire back surface of the release sheet 6 may be lightly irradiated with ultraviolet light from the surface of the flexible circuit 2 that is not temporarily bonded. As a result, the adhesive strength of the ultraviolet curable weak adhesive sheet layer applied to the entire sheet surface of the release sheet 6 is reduced, so that unnecessary parts outside the circuit can be easily peeled off and removed. In this case, the surface coated with the ultraviolet curable weak adhesive sheet layer is exposed after removal of unnecessary parts outside the circuit, but since the adhesive strength of the above adhesive is reduced by ultraviolet irradiation, problems such as dust adhesion are almost eliminated. They do not occur and stacking is also possible. The flexible circuit 2 is temporarily fixed to the release sheet 6 by the adhesive force of the ultraviolet ray irradiation type weak adhesive sheet layer, which still has some adhesive force even though the adhesive force has been reduced by the ultraviolet irradiation. Therefore, when using the flexible circuit 2, it can be easily peeled off by lifting the end portion of the flexible circuit 2.
なお、上記の実施例では、フレキシブル回路２の離型シ
ート６からの剥離は、離型シート６の曲げを利用して行
っているが、圧縮空気を用いて行うようにしてもよい。In the above embodiment, the flexible circuit 2 is peeled off from the release sheet 6 by bending the release sheet 6, but it may also be peeled off using compressed air.
また、フレキシブル回路２形成後、残存不要銅箔を除去
するようにしてもよい。さらに離型シート６表面に塗布
される紫外線照射型弱接着剤は、離型シート６を銅張り
フレキシブル回路用基板９に接着する際、銅張りフレキ
シフル回路用基板９のカバーレイフィルム５に移行しな
いよう、カバーレイフィルム５に対する接着力よりも離
型シート６に対する接着力の大きなものが使用される。Furthermore, after the flexible circuit 2 is formed, the remaining unnecessary copper foil may be removed. Furthermore, the ultraviolet irradiation type weak adhesive applied to the surface of the release sheet 6 transfers to the coverlay film 5 of the copper-clad flexible circuit board 9 when the release sheet 6 is bonded to the copper-clad flexible circuit board 9. In order to prevent this, a material having a stronger adhesive force to the release sheet 6 than to the coverlay film 5 is used.
しかし、両者に対する接着力が同程度であっても離型シ
ート６表面を例えば粗面化しておけば、離型シート６に
対する接着力が相対的に高くなるため問題はない。また
、上記接着剤は、離型シート６に塗布しないでカバーレ
イフィルム５に塗布するようにしてもよい。However, even if the adhesive strength to both is the same, if the surface of the release sheet 6 is roughened, for example, the adhesive strength to the release sheet 6 will be relatively high, so there is no problem. Further, the adhesive may be applied to the coverlay film 5 instead of being applied to the release sheet 6.
以上のように、本発明の製法によれば、離型シートの接
着、ハーフカット不要部の剥離という工程により、離型
シート上にフィルムが整列状態で仮接着された離型シー
ト仮接着フレキシブル回路を能率よく製造することがで
きる。そして、得られた離型シート仮接着フレキシブル
回路は、回路自体が離型シートに仮接着されているため
、取扱い性に優れ、かつフレキシブル回路の員数検査も
容易である。また、離型シートからの剥離も容易なため
、使用に際して自動実装に供することができ、しかも事
前に不要銅張りフレキシブル回路用基板の部分が除かれ
ており需要者側で大量に不要部が生じることがない。ま
た、不要部の運搬が不要になり運搬効率も向上する。As described above, according to the manufacturing method of the present invention, the release sheet temporarily adhered flexible circuit is formed by temporarily adhering the film in an aligned state on the release sheet through the steps of adhering the release sheet and peeling off the unnecessary half-cut portions. can be manufactured efficiently. The obtained flexible circuit temporarily bonded to a release sheet has excellent handling properties and is easy to inspect the number of flexible circuits because the circuit itself is temporarily bonded to the release sheet. In addition, since it is easy to peel off from the release sheet, it can be used for automatic mounting when used, and unnecessary parts of the copper-clad flexible circuit board are removed in advance, resulting in a large amount of unnecessary parts on the customer side. Never. Furthermore, it becomes unnecessary to transport unnecessary parts, which improves transport efficiency.
第１図は本発明の一実施例に用いる回路板の斜視図、第
２図はそのＡ−Ａ’断面図、第３図は第１図の回路板に
離型シートを重ねた状態の斜視図、第４図はそのＢ−Ｂ
’断面図、第５図はそれをハーフカットする説明図、第
６図は離型シート上から不要部を剥離除去する説明図、
第７図は本発明の離型シート仮接着フレキシブル回路の
斜視図である。
１・・・回路板 ２・・・フレキシブル回路 ５・・・
カバーレイフィルム ６・・・離型シート ９・・・銅
張りフレキシブル回路用基板
特許出願人 日東電気工業株式会社代理人 弁
理士 西 藤 征 彦第
図
第
図
第
図
手
続
（Ｙｎ
正
書
（自発）
屯・
１３拳口６３年
９月２０日
特
許
庁
長
官
殴
１゜
４Ｈ牛の耘
昭和６３羽糟願第１９１０６７号
２゜
発明の名称
３゜
補正をする者
事件との関係 特許出願人
昭和６３；ｒ９月３０＆角；１更済（−］の住所 大阪
府茨木市下穂積１丁目１番２号名称 （３９６）日東
電工株式会社
代表者
鎌
居
五
朗
６゜
補正の内容
図面において、
第６図および第７図を別紙
添付図面のとおり訂正する。
■。
添付書類の目録
別紙訂正図面
■
通
第６図
第７図Fig. 1 is a perspective view of a circuit board used in an embodiment of the present invention, Fig. 2 is a sectional view taken along the line AA', and Fig. 3 is a perspective view of the circuit board shown in Fig. 1 with a release sheet superimposed on it. Figure 4 is the B-B
'Cross-sectional view, Figure 5 is an explanatory diagram of half-cutting it, Figure 6 is an explanatory diagram of peeling off and removing unnecessary parts from the release sheet,
FIG. 7 is a perspective view of a flexible circuit temporarily bonded to a release sheet according to the present invention. 1... Circuit board 2... Flexible circuit 5...
Coverlay film 6...Release sheet 9...Copper-clad flexible circuit board Patent applicant Nitto Electric Industries Co., Ltd. Agent Patent attorney Yukihiko Nishifuji Diagram Diagram Diagram Procedure (Yn Authorized (spontaneous)) Tun. 13 Kenguchi September 20, 1963, Director-General of the Patent Office 1° 4H Ushi no 191067 Request No. 191067 2° Title of invention 3° Relationship with the case of the person making the amendment Patent applicant 1988; Address: 1-1-2 Shimohozumi, Ibaraki City, Osaka Prefecture (396) Nitto Denko Co., Ltd. Representative Goro Kamai Figure 7 is corrected as shown in the attached drawing.
Claims (3)
複数のフレキシブル回路を形成する工程と、上記回路形
成後の金属箔面にフィルム材を貼着する工程と、紫外線
硬化型弱粘着シート層を介して離型シートを上記フィル
ム材に接着する工程と、上記金属箔張りフレキシブル回
路用基板の金属箔面と反対側の面から各フレキシブル回
路に沿つて刃を入れ刃先を離型シート迄到達させるフレ
キシブル回路打抜き工程と、打抜かれたフレキシブル回
路を上記離型シート上に残しそれ以外のフレキシブル回
路用基板の部分を上記離型シートから剥離除去する除去
工程と、フレキシブル回路用基板が剥離除去された離型
シートのシート面に対して紫外線を照射する照射工程を
備えていることを特徴とする離型シート仮接着フレキシ
ブル回路の製法。(1) A step of forming a plurality of flexible circuits on the metal foil surface of a metal foil-clad flexible circuit board, a step of pasting a film material on the metal foil surface after the circuit formation, and a UV-curable weak adhesive sheet layer. A step of adhering the release sheet to the film material through the metal foil-covered flexible circuit board, and inserting a blade along each flexible circuit from the surface opposite to the metal foil surface of the metal foil-covered flexible circuit board and letting the cutting edge reach the release sheet. a flexible circuit punching step in which the punched flexible circuit is left on the release sheet, and a removal step in which the other portions of the flexible circuit board are peeled off from the release sheet; and a removal step in which the flexible circuit board is peeled off and removed. A method for producing a flexible circuit temporarily bonded to a release sheet, comprising an irradiation step of irradiating the sheet surface of the release sheet with ultraviolet rays.
と除去工程との間に移動させ、フレキシブル回路の形成
側と反対側の離型シートの面に対して紫外線を照射する
ようにした請求項（１）記載の離型シート仮接着フレキ
シブル回路の製法。(2) Claim (1) in which the ultraviolet ray irradiation step is moved between the flexible circuit punching step and the removal step, and the ultraviolet rays are irradiated to the surface of the release sheet opposite to the side on which the flexible circuit is formed. ) The method for manufacturing a release sheet temporarily bonded flexible circuit.
成された離型シートに、全体形状が線状の複数のフレキ
シブル回路がその長手方向を離型シートの一端縁に略直
交させた状態で所定間隔で配列され前記紫外線硬化型弱
粘着シート層の接着力により仮接着され、上記フレキシ
ブル回路の存在しない離型シートのシート面の部分の接
着性が紫外線照射により略消滅していることを特徴とす
る離型シート仮接着フレキシブル回路。(3) A state in which a plurality of flexible circuits having a linear overall shape are arranged on a release sheet in which an ultraviolet curable weak adhesive sheet layer is formed on the entire surface of the sheet, with the longitudinal direction thereof substantially perpendicular to one end edge of the release sheet. are arranged at predetermined intervals and are temporarily bonded by the adhesive force of the ultraviolet curable weak adhesive sheet layer, and the adhesiveness of the sheet surface portion of the release sheet where the flexible circuit is not present is almost eliminated by ultraviolet irradiation. Features a release sheet temporary adhesive flexible circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191067A JP2562183B2 (en) | 1988-07-28 | 1988-07-28 | Release sheet temporary adhesion flexible circuit manufacturing method and release sheet temporary adhesion flexible circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191067A JP2562183B2 (en) | 1988-07-28 | 1988-07-28 | Release sheet temporary adhesion flexible circuit manufacturing method and release sheet temporary adhesion flexible circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0239490A true JPH0239490A (en) | 1990-02-08 |
| JP2562183B2 JP2562183B2 (en) | 1996-12-11 |
Family
ID=16268325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63191067A Expired - Lifetime JP2562183B2 (en) | 1988-07-28 | 1988-07-28 | Release sheet temporary adhesion flexible circuit manufacturing method and release sheet temporary adhesion flexible circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2562183B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0392066U (en) * | 1989-12-30 | 1991-09-19 | ||
| JPH0870168A (en) * | 1994-08-30 | 1996-03-12 | Shin Etsu Polymer Co Ltd | Method of cutting printed-circuit original plate |
| JP2008291329A (en) * | 2007-05-25 | 2008-12-04 | Toppan Printing Co Ltd | Bridge-less etching product, and method for producing the same |
-
1988
- 1988-07-28 JP JP63191067A patent/JP2562183B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0392066U (en) * | 1989-12-30 | 1991-09-19 | ||
| JPH0870168A (en) * | 1994-08-30 | 1996-03-12 | Shin Etsu Polymer Co Ltd | Method of cutting printed-circuit original plate |
| JP2008291329A (en) * | 2007-05-25 | 2008-12-04 | Toppan Printing Co Ltd | Bridge-less etching product, and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2562183B2 (en) | 1996-12-11 |
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