JPS6232592B2 - - Google Patents
Info
- Publication number
- JPS6232592B2 JPS6232592B2 JP55153766A JP15376680A JPS6232592B2 JP S6232592 B2 JPS6232592 B2 JP S6232592B2 JP 55153766 A JP55153766 A JP 55153766A JP 15376680 A JP15376680 A JP 15376680A JP S6232592 B2 JPS6232592 B2 JP S6232592B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- micropins
- board
- sample substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 45
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000009760 electrical discharge machining Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 10
- 239000011111 cardboard Substances 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153766A JPS5778785A (en) | 1980-11-04 | 1980-11-04 | Method of producing micropin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153766A JPS5778785A (en) | 1980-11-04 | 1980-11-04 | Method of producing micropin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5778785A JPS5778785A (en) | 1982-05-17 |
| JPS6232592B2 true JPS6232592B2 (enrdf_load_stackoverflow) | 1987-07-15 |
Family
ID=15569656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55153766A Granted JPS5778785A (en) | 1980-11-04 | 1980-11-04 | Method of producing micropin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5778785A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58223383A (ja) * | 1982-06-21 | 1983-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 超伝導素子実装用マイクロコネクタ |
| US7122760B2 (en) * | 2002-11-25 | 2006-10-17 | Formfactor, Inc. | Using electric discharge machining to manufacture probes |
-
1980
- 1980-11-04 JP JP55153766A patent/JPS5778785A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5778785A (en) | 1982-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4688151A (en) | Multilayered interposer board for powering high current chip modules | |
| JP2840544B2 (ja) | 検査プローブ、集積回路の動作可能性を検査するため該集積回路を有する半導体基板の導電性検査パッドと係合する方法及び装置、及び該装置を形成する方法 | |
| JP3223257B2 (ja) | 熱電変換モジュールの製造方法 | |
| TW465148B (en) | Method for making socket connector | |
| KR960026718A (ko) | 상호 접속된 표면 금속층을 갖는 전자 모듈 및 그 제조 방법 | |
| JPH021152A (ja) | 半導体ウエハー列および半導体ウエハー列の製造方法 | |
| JPS5839048A (ja) | フレキシブル領域接着テ−プ | |
| JPH09512139A (ja) | 半導体デバイス上へのばね要素の取り付け、及びウエハレベルのテストを行う方法 | |
| JPH05205832A (ja) | フレキシブルテープ構造及びフレキシブルテープ形成プロセス | |
| US6880245B2 (en) | Method for fabricating a structure for making contact with an IC device | |
| JPH04106714A (ja) | 磁気ヘッドの製造方法 | |
| US4288808A (en) | Circuit structures including integrated circuits | |
| EP0312217A1 (en) | Integrated circuit chip assembly | |
| US4874086A (en) | Film carrier and a method for manufacturing a semiconductor device utilizing the same | |
| EP1115086A3 (en) | Non-contact type IC card and process for manufacturing same | |
| US4139434A (en) | Method of making circuitry with bump contacts | |
| JPS5839071A (ja) | 太陽電池素子 | |
| JPS6232592B2 (enrdf_load_stackoverflow) | ||
| CN101156284B (zh) | 用于接触电子设备的系统及其生产方法 | |
| JPS6232591B2 (enrdf_load_stackoverflow) | ||
| US20050001327A1 (en) | Semiconductor device, method for manufacturing the same, circuit substrate and electronic device | |
| JP2000235062A (ja) | バーンイン試験装置およびそれを用いた半導体装置の製造方法 | |
| US6690088B2 (en) | Integrated circuit package stacking structure | |
| JP4260843B2 (ja) | デバイスおよびそれを製造する方法 | |
| TW497232B (en) | Semiconductor device and method of manufacturing the same |