JPS6232592B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a micropin manufacturing method for collectively planting a plurality of micropins on a substrate wiring.

Josephson devices that operate at extremely low temperatures have attracted attention in recent years because of their extremely high switching speed and low power consumption compared to conventional silicon devices. Examples of high-density mounting of various boards to realize high-performance computers using Josephson devices are published in the magazine IEEE Spectrum, Vol. 15, No. 5 (1979).
W.Anackr published in 2013)
Author: Computing at 4 degrees Kelvin
degrees Kelvin). The implementation example described in the above document will be briefly described below.

As shown in FIG. 1, a plurality of IC chips 2 are mounted on a card board 1, and the card board 1 is attached to a board 3. Wiring between the card substrates 1 is performed by a wiring substrate 4 mounted on the back surface of the board substrate 3. The connection between the card board 1 and the wiring board 4 is made by a micro connector, as shown in FIG. The micro connector is composed of a connector board 5, micro pins 6 and 6' planted on the wiring board 4, and a board 3 containing mercury 7 for electrically connecting the micro pins 6 and 6'. There is.
The wiring 8 on the card board 1 and the wiring 8' on the wiring board 4 are thus connected via the mercury 7. The above are implementation examples proposed in the above-mentioned documents. Micro pin 6 used here
and 6' are minute pieces with a diameter of 75 micrometers and a length of about 200 micrometers at the part in contact with the mercury 7, and the wiring 8 on the connector board 5 glued perpendicularly to one side of the card board 1 and the wiring board 4 is installed on the wiring 8'.

An example of the manufacturing method for the above-mentioned micropins was published in the magazine IBM Technical Disclosure.
Bulletin) Vol. 22, No. 6 (November 1979), SK Lohiri and D.
"Method of Fabricating Pins Uses to Achieve Electrical Contacts to Mercury" by D. Waldman.
fabricating pins uses to achieve electrical
This is proposed in a paper entitled "Contact to Mercury". According to this method, a sample substrate is cut into the shape of micro-pins using an electrical discharge machine using a metal plate with holes drilled through etching as an electrode mask, and the cut micro-pins are attached to and are planted on the wirings 8' and 8 of the wiring board 4 and the connector board 5, respectively. Regarding the planting method, after forming micro pins with an electric discharge machine,
Possible methods include cutting the micropins individually and planting them one by one on the wirings 8 and 8', or manufacturing micropins in an array and fixing them all at once on the wirings 8 and 8'. The method of planting one by one is
It is inefficient and the technique for holding it is extremely difficult as it is fixed onto the wiring one by one. On the other hand, the method of fixing the wires all at once is advantageous in terms of efficiency, but since it is fixed onto the wires and then cut individually, mechanical strength problems arise when using machining. When processing techniques such as laser are used, thermal problems occur, and in either case, there is a strong possibility that wiring parts, solder parts, micro pins, etc. will be damaged.

Therefore, an object of the present invention is to produce a micropin manufacturing method that does not cause the above-mentioned problems and that can plant micropins all at once on wiring without mechanically or thermally damaging them. The goal is to provide the following.

In order to achieve the above object, the micro pin manufacturing method for manufacturing micro pins on a substrate wiring according to the present invention includes a step of planting the bottom of a sample substrate on the substrate wiring, and a substrate connected to the bottom of the sample substrate. The gist of this method is to include a step of forming and separating a plurality of micropins by electric discharge machining using the wiring as one electrode and the electrode mask as the other electrode. The sample substrate may be pre-processed or unprocessed before the step of planting the bottom of the sample substrate on the board wiring. When pre-processed, the micropin manufacturing method according to the present invention includes (A) cutting the sample substrate into a shape in which a plurality of micropins are connected at the bottom of the sample substrate by electrical discharge machining; (B) (C) The process of planting multiple micropins connected at the bottom of the sample substrate on the board wiring, and (C) the process of planting the sample on the board wiring by using the electrical discharge machining method with the board wiring as one electrode and the electrode mask as the other electrode. This process includes cutting the connecting portions of the substrate and separating the micropins individually.

When planting an unprocessed sample substrate, the micropin manufacturing method according to the present invention includes (A) planting the bottom of the unprocessed sample substrate on the board wiring; (B) micropins connected to the bottom of the sample substrate. (C) forming a plurality of micropins by first electrical discharge machining using the substrate wiring as one electrode and an electrode mask as the other electrode; and (C) forming a plurality of micropins formed by the above process into a second electrode. The process includes the step of separating the parts into individual parts by electrical discharge machining (2).

Hereinafter, the present invention will be explained in more detail using examples with reference to the accompanying drawings, but these are merely illustrative and do not go beyond the scope of the present invention.
Of course, various improvements and modifications are possible.

3. FIGS. 1 to 4 are cross-sectional views showing the manufacturing process in the first embodiment of the present invention, in which 9 is a fixing table, 10 is a sample substrate, 11 is a first electrode mask, 12 is a power source, 13 is a board, 14 is a solder material,
15 is a second electrode mask. A micropin manufacturing method according to the first embodiment of the present invention using an electrical discharge machine, in which the sample substrate 10 is pre-processed before being planted on the substrate wiring 8, will be described below.

In FIG. 3, a sample substrate 10 is attached to a fixing table 9 mounted on an electric discharge machine (not shown), and a power source 12 connects the sample substrate 10 and an electrode mask 11 having a hole in a predetermined shape. A voltage with positive and negative polarities is applied between the sample substrate 1 and a discharge is performed.
Perform the first cutting on 0. Next, as shown in FIG. 3, the convex sample substrate 10 removed from the fixing table 9 is fixed onto the wiring 8 formed on the substrate 13 with a solder material 14. Thereafter, as shown in FIG. 3, using an electrode mask 15 having a larger hole diameter than the electrode mask 11 used in FIG. Connect the other pole to 10 and perform electrical discharge machining. Through the above steps, micropins separated into individual micropins by the electrode mask 15 as shown in FIG. 4 are obtained.

In addition, in FIG. 3, the wiring 8 and the sample substrate 1
The reason why voltages with the same polarity are applied to both 0 and 0 is as follows. If a voltage is applied only to the sample substrate 10 and cutting is continued between the electrode masks, there will be parts that cannot be separated into individual micropins during the final cutting. On the other hand, if only the wiring 8 is cut by applying a voltage, it can be separated into individual micropins, but since the wiring 8 has a small cross-sectional area, the internal resistance of the wiring conductor increases, resulting in poor processing efficiency. Therefore, if a cutting method is used in which voltages of the same polarity are applied to the wiring 8 and the sample substrate 10, the current will initially flow toward the sample substrate 10, which has a larger cross-sectional area, and most of the sample substrate will be cut. By cutting the last remaining portion on the wiring 8 side, it is possible to completely separate the micro pins into individual micro pins.

FIGS. 4 1 to 3 are cross-sectional views showing a manufacturing process according to a second embodiment of the present invention, in which a sample substrate is planted on a substrate wiring without any pre-processing. In this embodiment, as shown in FIG. Connect the electrode mask 15 to the other pole. Next, as shown in FIG. 4, in order to form individual micropins on the substrate wiring 8, an electrode mask 15 with a large hole diameter is used.
The first cutting is performed to separate the sample substrate 10. Next, as shown in FIG. 4, a second cutting is performed using an electrode mask 11 having a smaller hole diameter than that shown in FIG. 4, in order to form the tips of the micropins. Through the above steps, it is possible to obtain micropins planted on the substrate wiring similar to those shown in FIG. 3 and FIG.

As explained above, according to the method of the present invention,
Since the micro pins are planted all at once on the wiring, they do not damage the wiring and are highly economical.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing mounting examples of various conventional boards, Figure 2 is a sectional view of the mounting example shown in Figure 1, and Figure 3 is a cross-sectional view of the mounting example shown in Figure 1.
4 and 4 are cross-sectional views showing the steps of the micropin manufacturing method according to the present invention. 1... Card board, 2... IC chip, 3... Board substrate, 4... Wiring board, 5... Connector board, 6,
6'...Micro pin, 7...Mercury, 8,8'...Wiring,
9... Fixing stand, 10... Sample substrate, 11, 15... Electrode mask, 12... Power source, 13... Substrate, 14... Soldering material.

Claims (1)

[Scope of Claims] 1. A micropin manufacturing method for manufacturing micropins on a substrate wiring, characterized by including the following steps. (A) Step of planting the bottom of the sample substrate on the board wiring,
and (B) a step of forming and separating a plurality of micropins by electrical discharge machining using the substrate wiring connected to the bottom of the sample substrate as one electrode and the electrode mask as the other electrode.