JPS6232537U - - Google Patents

Info

Publication number
JPS6232537U
JPS6232537U JP1985124340U JP12434085U JPS6232537U JP S6232537 U JPS6232537 U JP S6232537U JP 1985124340 U JP1985124340 U JP 1985124340U JP 12434085 U JP12434085 U JP 12434085U JP S6232537 U JPS6232537 U JP S6232537U
Authority
JP
Japan
Prior art keywords
protective film
bonding pad
insulating protective
conductivity type
lead layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985124340U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985124340U priority Critical patent/JPS6232537U/ja
Publication of JPS6232537U publication Critical patent/JPS6232537U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/019
    • H10W72/07551
    • H10W72/07553
    • H10W72/50
    • H10W72/531
    • H10W72/536
    • H10W72/59
    • H10W72/923
    • H10W72/934
    • H10W72/983

Landscapes

  • Wire Bonding (AREA)
JP1985124340U 1985-08-12 1985-08-12 Pending JPS6232537U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985124340U JPS6232537U (enExample) 1985-08-12 1985-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985124340U JPS6232537U (enExample) 1985-08-12 1985-08-12

Publications (1)

Publication Number Publication Date
JPS6232537U true JPS6232537U (enExample) 1987-02-26

Family

ID=31016262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985124340U Pending JPS6232537U (enExample) 1985-08-12 1985-08-12

Country Status (1)

Country Link
JP (1) JPS6232537U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164461A (ja) * 2008-01-09 2009-07-23 Toyota Motor Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134050A (ja) * 1984-12-04 1986-06-21 Nippon Denso Co Ltd 集積回路素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134050A (ja) * 1984-12-04 1986-06-21 Nippon Denso Co Ltd 集積回路素子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164461A (ja) * 2008-01-09 2009-07-23 Toyota Motor Corp 半導体装置
US8169087B2 (en) 2008-01-09 2012-05-01 Toyota Jidosha Kabushiki Kaisha Semiconductor device

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