JPS6230367U - - Google Patents
Info
- Publication number
- JPS6230367U JPS6230367U JP1985120259U JP12025985U JPS6230367U JP S6230367 U JPS6230367 U JP S6230367U JP 1985120259 U JP1985120259 U JP 1985120259U JP 12025985 U JP12025985 U JP 12025985U JP S6230367 U JPS6230367 U JP S6230367U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- wiring board
- power
- contact pads
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008054 signal transmission Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985120259U JPS6230367U (US07652168-20100126-C00068.png) | 1985-08-07 | 1985-08-07 | |
| US06/893,209 US4742385A (en) | 1985-08-07 | 1986-08-05 | Multichip package having outer and inner power supply means |
| FR868611450A FR2586140B1 (fr) | 1985-08-07 | 1986-08-07 | Boitier multi-puces comportant un moyen d'alimentation interieur et exterieur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985120259U JPS6230367U (US07652168-20100126-C00068.png) | 1985-08-07 | 1985-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230367U true JPS6230367U (US07652168-20100126-C00068.png) | 1987-02-24 |
Family
ID=14781773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985120259U Pending JPS6230367U (US07652168-20100126-C00068.png) | 1985-08-07 | 1985-08-07 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4742385A (US07652168-20100126-C00068.png) |
| JP (1) | JPS6230367U (US07652168-20100126-C00068.png) |
| FR (1) | FR2586140B1 (US07652168-20100126-C00068.png) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4816896A (en) * | 1988-02-01 | 1989-03-28 | Motorola Inc. | Compliant standoff for semiconductor packages |
| US5184211A (en) * | 1988-03-01 | 1993-02-02 | Digital Equipment Corporation | Apparatus for packaging and cooling integrated circuit chips |
| EP0332560B1 (en) * | 1988-03-11 | 1994-03-02 | International Business Machines Corporation | Elastomeric connectors for electronic packaging and testing |
| JP2509285B2 (ja) * | 1988-03-18 | 1996-06-19 | 富士通株式会社 | 半導体装置の試験方法 |
| US5159433A (en) * | 1989-04-20 | 1992-10-27 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device having a particular casing structure |
| US5053920A (en) * | 1989-06-09 | 1991-10-01 | Digital Equipment Corporation | Integrated power conversion |
| US5045921A (en) * | 1989-12-26 | 1991-09-03 | Motorola, Inc. | Pad array carrier IC device using flexible tape |
| JPH0777258B2 (ja) * | 1990-03-16 | 1995-08-16 | 株式会社東芝 | 半導体装置 |
| JP2657429B2 (ja) * | 1990-04-09 | 1997-09-24 | 株式会社ミクロ技術研究所 | 基板の回路実装方法及びその方法に使用する回路基板 |
| JP3082323B2 (ja) * | 1991-07-30 | 2000-08-28 | ソニー株式会社 | メモリモジュール |
| US5212406A (en) * | 1992-01-06 | 1993-05-18 | Eastman Kodak Company | High density packaging of solid state devices |
| US5808357A (en) * | 1992-06-02 | 1998-09-15 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
| JP2541487B2 (ja) * | 1993-11-29 | 1996-10-09 | 日本電気株式会社 | 半導体装置パッケ―ジ |
| US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
| JP2920066B2 (ja) * | 1994-05-19 | 1999-07-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
| KR100206893B1 (ko) * | 1996-03-11 | 1999-07-01 | 구본준 | 반도체 패키지 및 그 제조방법 |
| US6750527B1 (en) * | 1996-05-30 | 2004-06-15 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method |
| JPH1070243A (ja) * | 1996-05-30 | 1998-03-10 | Toshiba Corp | 半導体集積回路装置およびその検査方法およびその検査装置 |
| FR2754390A1 (fr) * | 1996-10-07 | 1998-04-10 | Gec Alsthom Transport Sa | Module de puissance a composants electroniques semi-conducteurs de puissance et interrupteur de forte puissance comportant au moins un tel module de puissance |
| US6181008B1 (en) * | 1998-11-12 | 2001-01-30 | Sarnoff Corporation | Integrated circuit power supply |
| US6556455B2 (en) | 1999-07-15 | 2003-04-29 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
| US6847529B2 (en) * | 1999-07-15 | 2005-01-25 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
| US6947293B2 (en) * | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US6623279B2 (en) | 1999-07-15 | 2003-09-23 | Incep Technologies, Inc. | Separable power delivery connector |
| US6452113B2 (en) | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US6801431B2 (en) * | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
| US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
| US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
| US7138708B2 (en) * | 1999-09-24 | 2006-11-21 | Robert Bosch Gmbh | Electronic system for fixing power and signal semiconductor chips |
| KR100699094B1 (ko) * | 2000-02-18 | 2007-03-21 | 인세프 테크놀러지스, 인코포레이티드 | 모듈러 회로판 어셈블리 및 이것을 조립하는 방법 |
| US7167379B2 (en) * | 2001-02-16 | 2007-01-23 | Dibene Ii Joseph T | Micro-spring interconnect systems for low impedance high power applications |
| US20020117748A1 (en) * | 2001-02-28 | 2002-08-29 | Avery Leslie Ronald | Integrated circuit power supply |
| US6580613B2 (en) * | 2001-07-17 | 2003-06-17 | Infineon Technologies Ag | Solder-free PCB assembly |
| DE10142971A1 (de) * | 2001-09-01 | 2003-03-27 | Eupec Gmbh & Co Kg | Leistungshalbleitermodul |
| US6845013B2 (en) * | 2002-03-04 | 2005-01-18 | Incep Technologies, Inc. | Right-angle power interconnect electronic packaging assembly |
| US7258552B2 (en) * | 2005-07-05 | 2007-08-21 | Hewlett-Packard Development Company, L.P. | Socket for holding a circuit board module |
| DE102006022107A1 (de) * | 2006-05-11 | 2007-11-15 | Siemens Ag Österreich | Anordnung einer Leiterplatte und einem dazu in einem festen Abstand gehaltenen Kontaktträger |
| US8796842B2 (en) * | 2010-08-20 | 2014-08-05 | Ati Technologies Ulc | Stacked semiconductor chip device with thermal management circuit board |
| US8737080B2 (en) * | 2011-01-14 | 2014-05-27 | Qualcomm Incorporated | Modular surface mount package for a system on a chip |
| US8636535B1 (en) * | 2012-07-11 | 2014-01-28 | Hon Hai Precision Industry Co., Ltd. | Electrical connector having metallic shields to avoid EMI for CPU |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4082394A (en) * | 1977-01-03 | 1978-04-04 | International Business Machines Corporation | Metallized ceramic and printed circuit module |
| US4127830A (en) * | 1977-05-26 | 1978-11-28 | Raytheon Company | Microstrip switch wherein diodes are formed in single semiconductor body |
| JPS54132166A (en) * | 1978-04-05 | 1979-10-13 | Nec Corp | Socket for semiconductor device |
| DE2940593A1 (de) * | 1979-10-06 | 1981-04-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | Mehrlagen-modul mit konstantem wellenwiderstand |
| DE3235839A1 (de) * | 1982-09-28 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterschaltung |
| JPS5984455A (ja) * | 1982-11-05 | 1984-05-16 | Nec Corp | 高密度メモリパツケ−ジ |
| US4583111A (en) * | 1983-09-09 | 1986-04-15 | Fairchild Semiconductor Corporation | Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients |
-
1985
- 1985-08-07 JP JP1985120259U patent/JPS6230367U/ja active Pending
-
1986
- 1986-08-05 US US06/893,209 patent/US4742385A/en not_active Expired - Fee Related
- 1986-08-07 FR FR868611450A patent/FR2586140B1/fr not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4742385A (en) | 1988-05-03 |
| FR2586140B1 (fr) | 1990-06-29 |
| FR2586140A1 (fr) | 1987-02-13 |
