JPS6229909B2 - - Google Patents

Info

Publication number
JPS6229909B2
JPS6229909B2 JP55151259A JP15125980A JPS6229909B2 JP S6229909 B2 JPS6229909 B2 JP S6229909B2 JP 55151259 A JP55151259 A JP 55151259A JP 15125980 A JP15125980 A JP 15125980A JP S6229909 B2 JPS6229909 B2 JP S6229909B2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
layer
semiconductor element
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55151259A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5775447A (en
Inventor
Junji Tajima
Masato Tameda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55151259A priority Critical patent/JPS5775447A/ja
Publication of JPS5775447A publication Critical patent/JPS5775447A/ja
Publication of JPS6229909B2 publication Critical patent/JPS6229909B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/25—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55151259A 1980-10-28 1980-10-28 Semiconductor device Granted JPS5775447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55151259A JPS5775447A (en) 1980-10-28 1980-10-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55151259A JPS5775447A (en) 1980-10-28 1980-10-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5775447A JPS5775447A (en) 1982-05-12
JPS6229909B2 true JPS6229909B2 (index.php) 1987-06-29

Family

ID=15514747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55151259A Granted JPS5775447A (en) 1980-10-28 1980-10-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5775447A (index.php)

Also Published As

Publication number Publication date
JPS5775447A (en) 1982-05-12

Similar Documents

Publication Publication Date Title
US5622873A (en) Process for manufacturing a resin molded image pick-up semiconductor chip having a window
JPH0770562B2 (ja) 半導体パッケージ及びその製造方法
JPS6249741B2 (index.php)
JP2003309228A (ja) 半導体装置及びその製造方法
JPH1092865A (ja) 半導体装置およびその製造方法
US5264726A (en) Chip-carrier
JPS6229909B2 (index.php)
JPH03153049A (ja) 半導体装置
CN218632047U (zh) 集成电路封装件
JP3336859B2 (ja) 半導体装置およびその製造方法
JPS58107657A (ja) 半導体装置
JPS6137787B2 (index.php)
JP3391676B2 (ja) 半導体モジュール及びその樹脂封止方法
JP2535890B2 (ja) 半導体装置の製造方法
CN223452340U (zh) 芯片结构
JP2837488B2 (ja) 半導体装置
CA2021682C (en) Chip-carrier with alpha ray shield
JPS5893359A (ja) 半導体装置
JPS6211508B2 (index.php)
JP3468406B2 (ja) 半導体装置の実装方法
JPS60160626A (ja) 半導体装置
JPH0745755A (ja) 樹脂封止型半導体装置とその製造方法
JP2694779B2 (ja) 半導体集積回路装置
JPH06163755A (ja) 樹脂封止型半導体装置
JPS5817642A (ja) 半導体デバイス用保護装置