JPS6229899B2 - - Google Patents

Info

Publication number
JPS6229899B2
JPS6229899B2 JP56086708A JP8670881A JPS6229899B2 JP S6229899 B2 JPS6229899 B2 JP S6229899B2 JP 56086708 A JP56086708 A JP 56086708A JP 8670881 A JP8670881 A JP 8670881A JP S6229899 B2 JPS6229899 B2 JP S6229899B2
Authority
JP
Japan
Prior art keywords
wire
bonding
arm
spool
leaf spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56086708A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57202748A (en
Inventor
Kazuya Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8670881A priority Critical patent/JPS57202748A/ja
Publication of JPS57202748A publication Critical patent/JPS57202748A/ja
Publication of JPS6229899B2 publication Critical patent/JPS6229899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP8670881A 1981-06-05 1981-06-05 Wire bonding device Granted JPS57202748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8670881A JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8670881A JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS57202748A JPS57202748A (en) 1982-12-11
JPS6229899B2 true JPS6229899B2 (enExample) 1987-06-29

Family

ID=13894412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8670881A Granted JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS57202748A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112736A (en) * 1980-02-12 1981-09-05 Mitsubishi Electric Corp Semiconductor assembling apparatus

Also Published As

Publication number Publication date
JPS57202748A (en) 1982-12-11

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