JPH0236064B2 - - Google Patents

Info

Publication number
JPH0236064B2
JPH0236064B2 JP58020094A JP2009483A JPH0236064B2 JP H0236064 B2 JPH0236064 B2 JP H0236064B2 JP 58020094 A JP58020094 A JP 58020094A JP 2009483 A JP2009483 A JP 2009483A JP H0236064 B2 JPH0236064 B2 JP H0236064B2
Authority
JP
Japan
Prior art keywords
wire
connection point
capillary
bonding tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58020094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59150436A (ja
Inventor
Tomio Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58020094A priority Critical patent/JPS59150436A/ja
Publication of JPS59150436A publication Critical patent/JPS59150436A/ja
Publication of JPH0236064B2 publication Critical patent/JPH0236064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP58020094A 1983-02-09 1983-02-09 ワイヤボンデイング方法 Granted JPS59150436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58020094A JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58020094A JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59150436A JPS59150436A (ja) 1984-08-28
JPH0236064B2 true JPH0236064B2 (enExample) 1990-08-15

Family

ID=12017522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58020094A Granted JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59150436A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
JP5065585B2 (ja) 2005-10-11 2012-11-07 ユニ・チャーム株式会社 母乳パッド
US8302841B2 (en) * 2008-03-17 2012-11-06 Kulicke And Soffa Industries Wire payout measurement and calibration techniques for a wire bonding machine

Also Published As

Publication number Publication date
JPS59150436A (ja) 1984-08-28

Similar Documents

Publication Publication Date Title
US4603802A (en) Variation and control of bond force
US4600138A (en) Bonding tool and clamp assembly and wire handling method
US4340166A (en) High speed wire bonding method
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
US4053096A (en) Thermocompression welding device
US20050279805A1 (en) Bondhead for wire bonding apparatus
JPH0236064B2 (enExample)
US6595400B2 (en) Wire bonding apparatus
US4878609A (en) Apparatus for manual wire bonding
US5170928A (en) Bonding head
JP2885242B1 (ja) ワイヤボンディング方法及び装置
JPS62179733A (ja) ワイヤボンデイング方式
JP2575066B2 (ja) 半導体組立装置
JPH025533Y2 (enExample)
JPH02199846A (ja) ワイヤボンディング方法
JPH0135500B2 (enExample)
JPH11312707A (ja) ワイヤボンディング装置
JPS61290730A (ja) ボンデイング装置
JP3369764B2 (ja) ワイヤボンディング装置における放電用トーチ電極体
JP2765833B2 (ja) 半導体装置のワイヤボンディング方法
JPS5988841A (ja) ワイヤボンデイング装置
JP2539963B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPS59220939A (ja) ワイヤボンデイング方法および装置
JP2894344B1 (ja) ワイヤボンディング方法
JP2817314B2 (ja) ワイヤボンダおよびワイヤボンディング方法