JPS62298111A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS62298111A JPS62298111A JP61142344A JP14234486A JPS62298111A JP S62298111 A JPS62298111 A JP S62298111A JP 61142344 A JP61142344 A JP 61142344A JP 14234486 A JP14234486 A JP 14234486A JP S62298111 A JPS62298111 A JP S62298111A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- amount
- layer
- width
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 230000013011 mating Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 230000008602 contraction Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 235000014121 butter Nutrition 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 241001300198 Caperonia palustris Species 0.000 description 1
- 235000000384 Veronica chamaedrys Nutrition 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000000744 eyelid Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61142344A JPS62298111A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61142344A JPS62298111A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62298111A true JPS62298111A (ja) | 1987-12-25 |
| JPH0515299B2 JPH0515299B2 (enrdf_load_stackoverflow) | 1993-03-01 |
Family
ID=15313176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61142344A Granted JPS62298111A (ja) | 1986-06-17 | 1986-06-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62298111A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201499A (ja) * | 2007-04-06 | 2007-08-09 | Denso Corp | 半導体基板およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7138936B2 (ja) * | 2018-10-23 | 2022-09-20 | 国立大学法人信州大学 | 油圧装置の制御流量推定用のモデルベーストルックアップテーブルの作成方法、制御流量推定用のモデルベーストルックアップテーブルおよび圧力推定方法 |
-
1986
- 1986-06-17 JP JP61142344A patent/JPS62298111A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201499A (ja) * | 2007-04-06 | 2007-08-09 | Denso Corp | 半導体基板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515299B2 (enrdf_load_stackoverflow) | 1993-03-01 |
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