JPS6229223B2 - - Google Patents

Info

Publication number
JPS6229223B2
JPS6229223B2 JP9295684A JP9295684A JPS6229223B2 JP S6229223 B2 JPS6229223 B2 JP S6229223B2 JP 9295684 A JP9295684 A JP 9295684A JP 9295684 A JP9295684 A JP 9295684A JP S6229223 B2 JPS6229223 B2 JP S6229223B2
Authority
JP
Japan
Prior art keywords
molybdenum
copper
composite electrode
based alloy
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9295684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60236745A (ja
Inventor
Yasuhiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tungsten Co Ltd
Original Assignee
Tokyo Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tungsten Co Ltd filed Critical Tokyo Tungsten Co Ltd
Priority to JP9295684A priority Critical patent/JPS60236745A/ja
Publication of JPS60236745A publication Critical patent/JPS60236745A/ja
Publication of JPS6229223B2 publication Critical patent/JPS6229223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Die Bonding (AREA)
JP9295684A 1984-05-11 1984-05-11 複合電極板材料及びその製造方法 Granted JPS60236745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9295684A JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9295684A JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Publications (2)

Publication Number Publication Date
JPS60236745A JPS60236745A (ja) 1985-11-25
JPS6229223B2 true JPS6229223B2 (enrdf_load_stackoverflow) 1987-06-25

Family

ID=14068904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9295684A Granted JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Country Status (1)

Country Link
JP (1) JPS60236745A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS60236745A (ja) 1985-11-25

Similar Documents

Publication Publication Date Title
JP5491682B2 (ja) 太陽電池用平角導体及びその製造方法並びに太陽電池用リード線
US6225606B1 (en) Ceramic heater
JP2915623B2 (ja) 電気接点材料とその製造方法
US2874453A (en) Applying metal coatings to molybdenum
JPS6229223B2 (enrdf_load_stackoverflow)
JP2011210868A (ja) 太陽電池接続用複合平角線及びその製造方法
JP2503778B2 (ja) 半導体装置用基板
JPS639665B2 (enrdf_load_stackoverflow)
US3577275A (en) Semi-conductor crystal supports
JPH0518251B2 (enrdf_load_stackoverflow)
JPS60128234A (ja) リ−ドフレ−ム用銅合金
JPS58147140A (ja) 半導体装置のリ−ド材
JPS60239033A (ja) 複合電極材料
JPS6036652A (ja) 電気接点の製造方法
JP3611402B2 (ja) 半導体基板用放熱材及びその製造方法
JPH0593253A (ja) アーク溶射用ワイヤ
JPH0936437A (ja) 熱電変換モジュールの製造方法
JPS5950222B2 (ja) 半導体用リ−ド材
JP2670274B2 (ja) 蒸着素子用タングステン線
JPH02852B2 (enrdf_load_stackoverflow)
JPS58132938A (ja) 半導体装置
JPH04361035A (ja) 金属積層板
CA2243762C (en) Alloy, in particular a solder alloy, method for joining workpieces by soldering using the solder alloy and use of the alloy for soldering
JPH07818B2 (ja) 金属マトリツクス−繊維複合材の製造方法
JPS6353693B2 (enrdf_load_stackoverflow)