JPS60236745A - 複合電極板材料及びその製造方法 - Google Patents

複合電極板材料及びその製造方法

Info

Publication number
JPS60236745A
JPS60236745A JP9295684A JP9295684A JPS60236745A JP S60236745 A JPS60236745 A JP S60236745A JP 9295684 A JP9295684 A JP 9295684A JP 9295684 A JP9295684 A JP 9295684A JP S60236745 A JPS60236745 A JP S60236745A
Authority
JP
Japan
Prior art keywords
molybdenum
composite electrode
copper
electrode plate
plate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9295684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229223B2 (enrdf_load_stackoverflow
Inventor
泰弘 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tungsten Co Ltd
Original Assignee
Tokyo Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tungsten Co Ltd filed Critical Tokyo Tungsten Co Ltd
Priority to JP9295684A priority Critical patent/JPS60236745A/ja
Publication of JPS60236745A publication Critical patent/JPS60236745A/ja
Publication of JPS6229223B2 publication Critical patent/JPS6229223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Die Bonding (AREA)
JP9295684A 1984-05-11 1984-05-11 複合電極板材料及びその製造方法 Granted JPS60236745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9295684A JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9295684A JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Publications (2)

Publication Number Publication Date
JPS60236745A true JPS60236745A (ja) 1985-11-25
JPS6229223B2 JPS6229223B2 (enrdf_load_stackoverflow) 1987-06-25

Family

ID=14068904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9295684A Granted JPS60236745A (ja) 1984-05-11 1984-05-11 複合電極板材料及びその製造方法

Country Status (1)

Country Link
JP (1) JPS60236745A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6229223B2 (enrdf_load_stackoverflow) 1987-06-25

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