JPS62291039A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS62291039A
JPS62291039A JP61132711A JP13271186A JPS62291039A JP S62291039 A JPS62291039 A JP S62291039A JP 61132711 A JP61132711 A JP 61132711A JP 13271186 A JP13271186 A JP 13271186A JP S62291039 A JPS62291039 A JP S62291039A
Authority
JP
Japan
Prior art keywords
lead frame
lead
bonding
support plate
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61132711A
Other languages
English (en)
Japanese (ja)
Other versions
JPH051980B2 (https=
Inventor
Hiroshi Ushiki
博 丑木
Kenji Kitakubo
北久保　健二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP61132711A priority Critical patent/JPS62291039A/ja
Publication of JPS62291039A publication Critical patent/JPS62291039A/ja
Publication of JPH051980B2 publication Critical patent/JPH051980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP61132711A 1986-06-10 1986-06-10 ボンデイング装置 Granted JPS62291039A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61132711A JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61132711A JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS62291039A true JPS62291039A (ja) 1987-12-17
JPH051980B2 JPH051980B2 (https=) 1993-01-11

Family

ID=15087782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61132711A Granted JPS62291039A (ja) 1986-06-10 1986-06-10 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62291039A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327044U (https=) * 1986-08-07 1988-02-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327044U (https=) * 1986-08-07 1988-02-22

Also Published As

Publication number Publication date
JPH051980B2 (https=) 1993-01-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees