JPS6228749Y2 - - Google Patents

Info

Publication number

JPS6228749Y2

JPS6228749Y2 JP4514180U JP4514180U JPS6228749Y2 JP S6228749 Y2 JPS6228749 Y2 JP S6228749Y2 JP 4514180 U JP4514180 U JP 4514180U JP 4514180 U JP4514180 U JP 4514180U JP S6228749 Y2 JPS6228749 Y2 JP S6228749Y2

Authority

JP

Japan

Prior art keywords

capacitor

dielectric ceramic

electrode

capacitor element

thickness direction

Prior art date

1980-04-03

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003990 capacitor Substances 0.000 claims description 55
• 239000000919 ceramic Substances 0.000 claims description 32
• 230000000149 penetrating effect Effects 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 4
• 230000003014 reinforcing effect Effects 0.000 claims description 3
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
• 229910052709 silver Inorganic materials 0.000 description 8
• 239000004332 silver Substances 0.000 description 8
• 239000007772 electrode material Substances 0.000 description 7
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
• 229910052573 porcelain Inorganic materials 0.000 description 4
• 229910045601 alloy Inorganic materials 0.000 description 3
• 239000000956 alloy Substances 0.000 description 3
• 239000003985 ceramic capacitor Substances 0.000 description 3
• 238000004519 manufacturing process Methods 0.000 description 3
• 229910052763 palladium Inorganic materials 0.000 description 3
• 229910052697 platinum Inorganic materials 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• 239000003989 dielectric material Substances 0.000 description 2
• 230000005012 migration Effects 0.000 description 2
• 238000013508 migration Methods 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• 230000035939 shock Effects 0.000 description 2
• 229910001252 Pd alloy Inorganic materials 0.000 description 1
• 239000010953 base metal Substances 0.000 description 1
• 238000005336 cracking Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1