JPS6227752B2 - - Google Patents
Info
- Publication number
- JPS6227752B2 JPS6227752B2 JP19402581A JP19402581A JPS6227752B2 JP S6227752 B2 JPS6227752 B2 JP S6227752B2 JP 19402581 A JP19402581 A JP 19402581A JP 19402581 A JP19402581 A JP 19402581A JP S6227752 B2 JPS6227752 B2 JP S6227752B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- metal
- external
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 47
- 229920005989 resin Polymers 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19402581A JPS5895851A (ja) | 1981-12-02 | 1981-12-02 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19402581A JPS5895851A (ja) | 1981-12-02 | 1981-12-02 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5895851A JPS5895851A (ja) | 1983-06-07 |
JPS6227752B2 true JPS6227752B2 (ko) | 1987-06-16 |
Family
ID=16317687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19402581A Granted JPS5895851A (ja) | 1981-12-02 | 1981-12-02 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5895851A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8202154A (nl) * | 1982-05-26 | 1983-12-16 | Asm Fico Tooling | Geleiderframe. |
JPH05206347A (ja) * | 1991-03-22 | 1993-08-13 | Fujitsu Ltd | 半導体装置及びその製造方法及び半導体装置用リードフレーム |
DE10227936C1 (de) * | 2002-06-21 | 2003-05-15 | Heraeus Gmbh W C | Verfahren zur Herstellung von Systemträgern aus metallischem Trägerband sowie Metallstreifen mit Trägerbereich für elektrische Bauelemente |
-
1981
- 1981-12-02 JP JP19402581A patent/JPS5895851A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5895851A (ja) | 1983-06-07 |
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